JPS6124969U - Lead for printed circuit board - Google Patents
Lead for printed circuit boardInfo
- Publication number
- JPS6124969U JPS6124969U JP1984108183U JP10818384U JPS6124969U JP S6124969 U JPS6124969 U JP S6124969U JP 1984108183 U JP1984108183 U JP 1984108183U JP 10818384 U JP10818384 U JP 10818384U JP S6124969 U JPS6124969 U JP S6124969U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit board
- printed circuit
- view
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例のプリント基板ハンダ付状態
の斜面図、第２図は同平面図、第３図は要部の断面図、
第４図は連続プレス成型状態の平面図、第５図は同側面
図、第６，７図はリード取付部分のプリント基板の一部
平面図、第８図は従来の第１の型の平面図、第９図は同
側面図、第１０図はハンダ付状態の斜面図、第１１図は
第２の型の平面図、第１２図はハンダ付状態の斜面図で
ある。
Ａ・・・プリント基板、４・・・ハンダ付パッド、１０
・・・リード部、１１・・・巾広部、１２・・・立上片
。Fig. 1 is a perspective view of a soldered printed circuit board according to an embodiment of the present invention, Fig. 2 is a plan view of the same, and Fig. 3 is a sectional view of the main parts.
Fig. 4 is a plan view of the continuous press molding state, Fig. 5 is a side view of the same, Figs. 6 and 7 are partial plan views of the printed circuit board in the lead attachment area, and Fig. 8 is a plan view of the conventional first mold. 9 is a side view of the same, FIG. 10 is a perspective view of the soldered state, FIG. 11 is a plan view of the second mold, and FIG. 12 is a perspective view of the soldered state. A... Printed circuit board, 4... Soldering pad, 10
...Lead part, 11...Wide part, 12...Rising piece.
Claims (1)
て、かつハンタ付部を含む巾広部と、該巾広部に形成し
た位置決め片とを備えたことを特徴とするプリント基板
用リード。A printed circuit board comprising a lead part, a wide part that is continuous with the lead part, is wider than the lead part, and includes a hunter attachment part, and a positioning piece formed on the wide part. Lead for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984108183U JPS6124969U (en) | 1984-07-19 | 1984-07-19 | Lead for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984108183U JPS6124969U (en) | 1984-07-19 | 1984-07-19 | Lead for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6124969U true JPS6124969U (en) | 1986-02-14 |
Family
ID=30667389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984108183U Pending JPS6124969U (en) | 1984-07-19 | 1984-07-19 | Lead for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6124969U (en) |
-
1984
- 1984-07-19 JP JP1984108183U patent/JPS6124969U/en active Pending
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