JPS61192451U - - Google Patents
Info
- Publication number
- JPS61192451U JPS61192451U JP7749385U JP7749385U JPS61192451U JP S61192451 U JPS61192451 U JP S61192451U JP 7749385 U JP7749385 U JP 7749385U JP 7749385 U JP7749385 U JP 7749385U JP S61192451 U JPS61192451 U JP S61192451U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- plug
- enlarged
- type semiconductor
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はセラミツクス基板からなる本考案のプ
ラグイン型半導体パツケージ用基板１の四隅に固
定されたスタンドオフピン２の斜視図であり、第
２図は該プラグイン型半導体パツケージ用基板の
断面図である。第３図は本考案の有機系樹脂素材
からなるプラグイン型半導体パツケージ用基板８
に、スタンドオフピンを固着した断面図である。
第４図は本考案の有機系樹脂素材からなるプラグ
イン型半導体パツケージ用基板８を配線基板１１
に実装した状態の斜視図を示している。第５図は
本考案の半導体パツケージの四隅に固定されてい
る各種のスタンドオフピンの主要部の拡大斜視図
である。
１……セラミツク基板、２……スタンドオフピ
ン、３……導体ピン、４……銀ロウ、５……鍔、
６……膨大形状部（鍔下）、７……チユーブ又は
パイプ、８……プラスチツク性の半導体パツケー
ジ用基板、９……スルホール、１０……膨大形状
部（鍔上）、１１……配線基板、１２……はんだ
。
FIG. 1 is a perspective view of standoff pins 2 fixed to the four corners of a plug-in type semiconductor package substrate 1 of the present invention made of a ceramic substrate, and FIG. 2 is a cross-sectional view of the plug-in type semiconductor package substrate 1. It is. Figure 3 shows a substrate 8 for a plug-in semiconductor package made of an organic resin material of the present invention.
FIG. 3 is a cross-sectional view with a standoff pin fixed to it.
FIG. 4 shows a plug-in type semiconductor package board 8 made of an organic resin material of the present invention and a wiring board 11.
A perspective view of the device mounted on the device is shown. FIG. 5 is an enlarged perspective view of the main parts of various standoff pins fixed at the four corners of the semiconductor package of the present invention. 1... Ceramic board, 2... Standoff pin, 3... Conductor pin, 4... Silver solder, 5... Tsuba,
6... Enormous shape part (below the flange), 7... Tube or pipe, 8... Plastic semiconductor package substrate, 9... Through hole, 10... Enormous shape part (above the flange), 11... Wiring board , 12...Solder.
Claims (1)
を有し、該膨大形状部に膨大形状部の幅より小さ
い直径を有するチユーブ又はパイプがはめ込まれ
てなるプラグイン型半導体パツケージ用基板。 ２ 前記導体ピンが鍔を有することを特徴とする
実用新案登録請求の範囲第１項記載のプラグイン
型半導体パツケージ用基板。 ３ 前記膨大形状部にチユーブがはめ込まれてな
る導体ピンにおいて別の膨大形状部が、有機系樹
脂素材からなるプリント配線板のスルホールに嵌
入されて固定されていることを特徴とする実用新
案登録請求の範囲第１項〜第２項記載のプラグイ
ン型半導体パツケージ用基板。[Claims for Utility Model Registration] 1. A plug-in type in which at least two or more conductor pins have an enlarged shape, and a tube or pipe having a diameter smaller than the width of the enlarged shape is fitted into the enlarged shape. Substrate for semiconductor package. 2. The plug-in type semiconductor package substrate according to claim 1, wherein the conductor pin has a flange. 3. A request for registration of a utility model characterized in that in the conductor pin formed by fitting a tube into the enlarged portion, another enlarged portion is fitted into a through hole of a printed wiring board made of an organic resin material and fixed. A plug-in type semiconductor package substrate according to the ranges 1 to 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7749385U JPS61192451U (en) | 1985-05-23 | 1985-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7749385U JPS61192451U (en) | 1985-05-23 | 1985-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61192451U true JPS61192451U (en) | 1986-11-29 |
Family
ID=30620608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7749385U Pending JPS61192451U (en) | 1985-05-23 | 1985-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61192451U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049644B2 (en) * | 1975-11-21 | 1985-11-02 | 旭電化工業株式会社 | Curable unsaturated epoxy resin composition |
-
1985
- 1985-05-23 JP JP7749385U patent/JPS61192451U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049644B2 (en) * | 1975-11-21 | 1985-11-02 | 旭電化工業株式会社 | Curable unsaturated epoxy resin composition |