JPS6090801U - Resin cast electronic components - Google Patents
Resin cast electronic componentsInfo
- Publication number
- JPS6090801U JPS6090801U JP18453283U JP18453283U JPS6090801U JP S6090801 U JPS6090801 U JP S6090801U JP 18453283 U JP18453283 U JP 18453283U JP 18453283 U JP18453283 U JP 18453283U JP S6090801 U JPS6090801 U JP S6090801U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic components
- case
- resin cast
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の樹脂注型形電子部品の一つである高圧用
抵抗体の縦断正面図、第２図は同上の縦断側面図、第３
図はこの考案の樹脂注型電子部品の一つである高圧用抵
抗体の縦断正面図、第４図は同上の平面図、第５図は他
の実施例の縦断正面図、第６図はさらに他の実施例の縦
断正面図である。
１・・・基絶縁基板、２・・・抵抗膜、３・・・絶縁ケ
ース、９・・・溝、１０・・・リード線、１１・・・樹
脂、Ａ・・・抵抗基板。Figure 1 is a longitudinal sectional front view of a high-voltage resistor, which is one of the conventional resin-cast electronic components, Figure 2 is a longitudinal sectional side view of the same, and Figure 3
The figure is a longitudinal sectional front view of a high-voltage resistor, which is one of the resin-cast electronic components of this invention, FIG. 4 is a plan view of the same, FIG. 5 is a longitudinal sectional front view of another embodiment, and FIG. FIG. 7 is a longitudinal sectional front view of still another embodiment. DESCRIPTION OF SYMBOLS 1... Base insulating substrate, 2... Resistance film, 3... Insulating case, 9... Groove, 10... Lead wire, 11... Resin, A... Resistance board.
Claims (1)
し、ケースと基板間の空隙に樹脂を注型した樹脂注型形
電子部品において、該基板から導出されるリード線の少
なくとも１本を、基板の端部と平行に折り曲げ、これを
ケー不内の少なくとも一端に設けた溝により支持せしめ
て、基板とケースを隔離したことを特徴とする樹脂注型
形電子部品。In a resin-casting electronic component in which an electronic component using an insulating substrate is housed in an insulating case, and resin is cast into the gap between the case and the substrate, at least one of the lead wires led out from the substrate is A resin-cast electronic component, characterized in that the board is bent parallel to the edge of the board and supported by a groove provided in at least one end of the case to separate the board and the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18453283U JPS6090801U (en) | 1983-11-28 | 1983-11-28 | Resin cast electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18453283U JPS6090801U (en) | 1983-11-28 | 1983-11-28 | Resin cast electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6090801U true JPS6090801U (en) | 1985-06-21 |
Family
ID=30399093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18453283U Pending JPS6090801U (en) | 1983-11-28 | 1983-11-28 | Resin cast electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6090801U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341902U (en) * | 1989-08-31 | 1991-04-22 | ||
| WO2019087260A1 (en) * | 2017-10-30 | 2019-05-09 | 日立化成株式会社 | Film capacitor manufacturing method and case |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037840B1 (en) * | 1969-09-27 | 1975-12-05 | ||
| JPS5730803U (en) * | 1980-07-29 | 1982-02-18 |
-
1983
- 1983-11-28 JP JP18453283U patent/JPS6090801U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037840B1 (en) * | 1969-09-27 | 1975-12-05 | ||
| JPS5730803U (en) * | 1980-07-29 | 1982-02-18 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341902U (en) * | 1989-08-31 | 1991-04-22 | ||
| WO2019087260A1 (en) * | 2017-10-30 | 2019-05-09 | 日立化成株式会社 | Film capacitor manufacturing method and case |
| JPWO2019087260A1 (en) * | 2017-10-30 | 2020-11-12 | 昭和電工マテリアルズ株式会社 | Film capacitor manufacturing method and case |
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