JPS5958931U - composite electronic components - Google Patents
composite electronic componentsInfo
- Publication number
- JPS5958931U JPS5958931U JP15483582U JP15483582U JPS5958931U JP S5958931 U JPS5958931 U JP S5958931U JP 15483582 U JP15483582 U JP 15483582U JP 15483582 U JP15483582 U JP 15483582U JP S5958931 U JPS5958931 U JP S5958931U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- composite electronic
- electronic component
- lead wire
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Ceramic Capacitors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のリード線付電子部品を示す正面図、第２
図は同上にディップ外装を施した正面区第３図は同上を
プリント基板に実装した正面図、第４図はこの考案に係
る複合電子部品の正面図、１ 第５図は同上にディッ
プ外装を施した正面図、第・ ６図は同上をプリント
基板に実装した正面図、第７藺ａないしｄの各々はリー
ド線付電子部品と電子部品の組合せ例を示す等価回路図
である。
１ １１・・・複合電子部品、１２・・・リード線付
電子部１、 品、１３・・・電子部品、１６・・・リー
ド線、１７・・・ディップ外装、１８・・・プリント基
板。Figure 1 is a front view of a conventional electronic component with lead wires;
Figure 3 shows a front view of the same as the above with a dip exterior. Figure 3 is a front view of the same as the above mounted on a printed circuit board. Figure 4 is a front view of a composite electronic component according to this invention. 1 Figure 5 shows a dip exterior on the same as the above. FIG. 6 is a front view of the same as above mounted on a printed circuit board, and FIGS. 7A to 7D are equivalent circuit diagrams showing examples of combinations of electronic components with lead wires and electronic components. 1 11...Composite electronic component, 12...Electronic part 1 with lead wire, product, 13...Electronic component, 16...Lead wire, 17...Dip exterior, 18...Printed circuit board.
Claims (1)
品を取付け、両型子部品に絶縁外装材を一体に被覆した
ことを特徴とする複合電子部品。A composite electronic component characterized in that another electronic component is attached to the base of the lead wire of an electronic component with a lead wire, and both mold components are integrally covered with an insulating exterior material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15483582U JPS5958931U (en) | 1982-10-12 | 1982-10-12 | composite electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15483582U JPS5958931U (en) | 1982-10-12 | 1982-10-12 | composite electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5958931U true JPS5958931U (en) | 1984-04-17 |
Family
ID=30342141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15483582U Pending JPS5958931U (en) | 1982-10-12 | 1982-10-12 | composite electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5958931U (en) |
-
1982
- 1982-10-12 JP JP15483582U patent/JPS5958931U/en active Pending
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