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JPS60101768U - Composite laminated board - Google Patents

Composite laminated board

Info

Publication number
JPS60101768U
JPS60101768U JP19414283U JP19414283U JPS60101768U JP S60101768 U JPS60101768 U JP S60101768U JP 19414283 U JP19414283 U JP 19414283U JP 19414283 U JP19414283 U JP 19414283U JP S60101768 U JPS60101768 U JP S60101768U
Authority
JP
Japan
Prior art keywords
composite laminated
laminated board
rigid substrates
flexible printed
printed substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19414283U
Other languages
Japanese (ja)
Inventor
浅野 透盛
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP19414283U priority Critical patent/JPS60101768U/en
Publication of JPS60101768U publication Critical patent/JPS60101768U/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の複合貼合わせ基板を示す斜視図、第2図
は第1爾のI−I線断面図、第3図は他の従来例を示す
断面図、第4図は本考案に係る複合貼合わせ基板の一実
施例を示す斜視図、第5図は第4図の■−■線断面図、
第6図は本考案に係る複合貼合わせ基板の実施例を示す
平面図である。 1、・・・フレキシブル基板、2,3・・・剛性基板、
4・・・ベース材、5・・・導体パターン、6・・・フ
ィルム膜、7・・・湾曲部。
Fig. 1 is a perspective view showing a conventional composite laminated substrate, Fig. 2 is a sectional view taken along the line I-I of Fig. 1, Fig. 3 is a sectional view showing another conventional example, and Fig. 4 is a sectional view of the present invention. A perspective view showing an example of such a composite laminated board, FIG. 5 is a sectional view taken along the line ■-■ in FIG. 4,
FIG. 6 is a plan view showing an embodiment of the composite laminated substrate according to the present invention. 1,...Flexible board, 2,3...Rigid board,
4... Base material, 5... Conductor pattern, 6... Film membrane, 7... Curved portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 可撓性印刷基板に対して複数の剛性基板を貼り合わせそ
れらの剛性基板間を連絡するように構成した複合貼合わ
せ基板において、複数の前記剛性基板間の連絡部分を形
成する可撓性印刷基板の貼−、合わせ端部近傍に端部方
向に沿って湾曲部を構成したこ7とを特徴とする複合貼
合わせ基板。
In a composite laminated board configured to bond a plurality of rigid substrates to a flexible printed substrate and communicate between the rigid substrates, the flexible printed substrate forms a connecting portion between the plurality of rigid substrates. 7. A composite laminated substrate characterized in that a curved portion is formed near the mating end along the direction of the end.
JP19414283U 1983-12-19 1983-12-19 Composite laminated board Pending JPS60101768U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19414283U JPS60101768U (en) 1983-12-19 1983-12-19 Composite laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19414283U JPS60101768U (en) 1983-12-19 1983-12-19 Composite laminated board

Publications (1)

Publication Number Publication Date
JPS60101768U true JPS60101768U (en) 1985-07-11

Family

ID=30417387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19414283U Pending JPS60101768U (en) 1983-12-19 1983-12-19 Composite laminated board

Country Status (1)

Country Link
JP (1) JPS60101768U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567034U (en) * 1992-02-05 1993-09-03 日本メクトロン株式会社 Flexible circuit board with mounting plate
WO2011043318A1 (en) * 2009-10-05 2011-04-14 株式会社村田製作所 Circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567034U (en) * 1992-02-05 1993-09-03 日本メクトロン株式会社 Flexible circuit board with mounting plate
WO2011043318A1 (en) * 2009-10-05 2011-04-14 株式会社村田製作所 Circuit board
JP5360223B2 (en) * 2009-10-05 2013-12-04 株式会社村田製作所 Circuit board
US8975527B2 (en) 2009-10-05 2015-03-10 Murata Manufacturing Co., Ltd. Circuit board

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