JPS58146373U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58146373U JPS58146373U JP1982041887U JP4188782U JPS58146373U JP S58146373 U JPS58146373 U JP S58146373U JP 1982041887 U JP1982041887 U JP 1982041887U JP 4188782 U JP4188782 U JP 4188782U JP S58146373 U JPS58146373 U JP S58146373U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- printed
- terminal parts
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来のプリント配線基板の各々平面
図及び断面図、第３図及び第４図は本考案の実施例の各
々平面図及び断面図、第５図は本考案の他の実施例の平
面図を示す。
２１．３３・・・・・・基板、２２．３１・・・・・・
突起、２３．３２・・・・・・プリント回路、２４．２
５・・・・・・端子部、２６，３０・・・・・・スリッ
ト、２７．２８・・・・・・半田層。1 and 2 are a plan view and a sectional view, respectively, of a conventional printed wiring board, FIG. 3 and 4 are a plan view and a sectional view, respectively, of an embodiment of the present invention, and FIG. 5 is a plan view and a sectional view, respectively, of a conventional printed wiring board. FIG. 3 shows a plan view of an embodiment of the invention. 21.33... Board, 22.31...
Projection, 23.32...Printed circuit, 24.2
5...Terminal section, 26, 30...Slit, 27.28...Solder layer.
Claims (2)
られた複数個の端子部と、該複数個の端子部がプリント
され基板の側面に設けられた突起と、前記複数個の端子
部の間に配置され少な（とも前記突起に設けられたスリ
ットと、前記端子部に積層された半田層とを有すること
を特徴とするプリント配線基板。(1) In a printed wiring board, a plurality of terminal parts provided on the printed circuit, a protrusion provided on the side surface of the board on which the plurality of terminal parts are printed, and a position between the plurality of terminal parts. A printed wiring board characterized by having a slit provided in the protrusion and a solder layer laminated on the terminal portion.
請求の範囲第１項記載のプリント配線基板。(2) The printed wiring board according to claim 1, wherein the printed circuit is a fuse circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982041887U JPS58146373U (en) | 1982-03-26 | 1982-03-26 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982041887U JPS58146373U (en) | 1982-03-26 | 1982-03-26 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58146373U true JPS58146373U (en) | 1983-10-01 |
Family
ID=30053057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982041887U Pending JPS58146373U (en) | 1982-03-26 | 1982-03-26 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58146373U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5456189A (en) * | 1977-10-13 | 1979-05-04 | Omron Tateisi Electronics Co | Lead wire connection |
-
1982
- 1982-03-26 JP JP1982041887U patent/JPS58146373U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5456189A (en) * | 1977-10-13 | 1979-05-04 | Omron Tateisi Electronics Co | Lead wire connection |
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