JPS6471129A - Method and device for cleaning surface of semiconductor substrate - Google Patents
Method and device for cleaning surface of semiconductor substrateInfo
- Publication number
- JPS6471129A JPS6471129A JP22644687A JP22644687A JPS6471129A JP S6471129 A JPS6471129 A JP S6471129A JP 22644687 A JP22644687 A JP 22644687A JP 22644687 A JP22644687 A JP 22644687A JP S6471129 A JPS6471129 A JP S6471129A
- Authority
- JP
- Japan
- Prior art keywords
- vessel
- controller
- semiconductor substrate
- evacuation
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE:To improve a cleaning effect, and to clean the surface of a semiconductor substrate by evacuating the inside of a vessel having required strength with respect to both vacuum resistance and high pressure resistance while heating the inside of the vessel and pressuring the inside of the vessel at atmospheric pressure or higher. CONSTITUTION:A semiconductor substrate 5 is installed to a substrate installing section 3, and the inside of a vacuum vessel 1 is evacuated by a pump 8 for evacuation. The installing section 3 is set at 200 deg.C by a heater 2 and a temperature controller 4. Heating and evacuation are continued for twenty min, conduction to the heater 2 is stopped, only evacuation is continued, and the inside of the vessel 1 is exhausted up to 10<-7>-10<-8>Torr. An on-off valve 6 is closed, and nitrogen gas is introduced into the vessel 1. When the inside of the vessel 1 reaches atmospheric pressure, a sequence-controller 21 receives a signal from a pressure sensor 14 and a mass flow-controller. 17 and a low-pressure gas supply valve 18 are closed by the sequence-controller 21, and a high-pressure gas supply valve 20 is opened. Accordingly, the surface of the substrate 5 is cleaned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22644687A JPH0638409B2 (en) | 1987-09-11 | 1987-09-11 | Method and apparatus for cleaning surface of semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22644687A JPH0638409B2 (en) | 1987-09-11 | 1987-09-11 | Method and apparatus for cleaning surface of semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6471129A true JPS6471129A (en) | 1989-03-16 |
| JPH0638409B2 JPH0638409B2 (en) | 1994-05-18 |
Family
ID=16845227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22644687A Expired - Lifetime JPH0638409B2 (en) | 1987-09-11 | 1987-09-11 | Method and apparatus for cleaning surface of semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638409B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03174720A (en) * | 1989-12-04 | 1991-07-29 | Tokyo Electron Sagami Ltd | Processing method and processing apparatus using this method |
| JPH04252045A (en) * | 1991-01-28 | 1992-09-08 | Nec Corp | Evaluation of semiconductor element manufacturing process |
| JPH0677134A (en) * | 1992-08-26 | 1994-03-18 | Nec Kansai Ltd | Vacuum heating method |
-
1987
- 1987-09-11 JP JP22644687A patent/JPH0638409B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03174720A (en) * | 1989-12-04 | 1991-07-29 | Tokyo Electron Sagami Ltd | Processing method and processing apparatus using this method |
| JPH04252045A (en) * | 1991-01-28 | 1992-09-08 | Nec Corp | Evaluation of semiconductor element manufacturing process |
| JPH0677134A (en) * | 1992-08-26 | 1994-03-18 | Nec Kansai Ltd | Vacuum heating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0638409B2 (en) | 1994-05-18 |
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