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JPS6464373A - Semiconductor device for energy conversion use - Google Patents

Semiconductor device for energy conversion use

Info

Publication number
JPS6464373A
JPS6464373A JP62222501A JP22250187A JPS6464373A JP S6464373 A JPS6464373 A JP S6464373A JP 62222501 A JP62222501 A JP 62222501A JP 22250187 A JP22250187 A JP 22250187A JP S6464373 A JPS6464373 A JP S6464373A
Authority
JP
Japan
Prior art keywords
metal bump
ohmic electrode
region
electrode film
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62222501A
Other languages
Japanese (ja)
Inventor
Ryoji Okata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62222501A priority Critical patent/JPS6464373A/en
Publication of JPS6464373A publication Critical patent/JPS6464373A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To retain a good P-n junction characteristic by a method wherein a stress-absorbing region situated on a region where a P-n junction has been formed is installed between an ohmic electrode film and a metal bump in order to prevent a defect and a deterioration of an active region. CONSTITUTION:A P-type HgCdTe semiconductor crystal layer 1 is formed epitaxially on a CdTe substrate, an n-type photodetecting part 2 is formed. In addition, an ohmic contact layer composed of In is formed in such a way that it is wider than the n-type photodetecting part 2. Then, a photoresist 7 is coated on a whole face; after that, one part of the photoresist is removed in such a way that the In contact layer 4 is exposed; a contact hole 7a is formed. In 8 is evaporated on the whole face; one part of a photoresist 9 is removed in such a way that a part on the ohmic electrode 4 is exposed. A metal bump 5 composed of a limited In thick film is formed in a region corre sponding to an upper part of the ohmic electrode film 4 where the In evaporated film 8 is exposed. The metal bump 5 composed of the In thick film connected to the ohmic electrode film 4 is left; the metal bump 5 which has a vacant hole region 6 between the ohmic electrode film 4 and the metal bump 5 is constituted.
JP62222501A 1987-09-04 1987-09-04 Semiconductor device for energy conversion use Pending JPS6464373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62222501A JPS6464373A (en) 1987-09-04 1987-09-04 Semiconductor device for energy conversion use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222501A JPS6464373A (en) 1987-09-04 1987-09-04 Semiconductor device for energy conversion use

Publications (1)

Publication Number Publication Date
JPS6464373A true JPS6464373A (en) 1989-03-10

Family

ID=16783419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222501A Pending JPS6464373A (en) 1987-09-04 1987-09-04 Semiconductor device for energy conversion use

Country Status (1)

Country Link
JP (1) JPS6464373A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5464446A (en) * 1993-10-12 1995-11-07 Medtronic, Inc. Brain lead anchoring system
US7537065B2 (en) 2002-01-10 2009-05-26 Black & Decker Inc. Angle grinder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5464446A (en) * 1993-10-12 1995-11-07 Medtronic, Inc. Brain lead anchoring system
US7537065B2 (en) 2002-01-10 2009-05-26 Black & Decker Inc. Angle grinder

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