[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS6451424A - One-pack epoxy resin composition - Google Patents

One-pack epoxy resin composition

Info

Publication number
JPS6451424A
JPS6451424A JP20739987A JP20739987A JPS6451424A JP S6451424 A JPS6451424 A JP S6451424A JP 20739987 A JP20739987 A JP 20739987A JP 20739987 A JP20739987 A JP 20739987A JP S6451424 A JPS6451424 A JP S6451424A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
silane coupling
agent
pack epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20739987A
Other languages
Japanese (ja)
Inventor
Toshio Sugimoto
Yousui Nemoto
Sadahiko Kawaguchi
Akihisa Yano
Yoshitaka Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Mitsubishi Petrochemical Co Ltd
Original Assignee
Ibiden Co Ltd
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd, Mitsubishi Petrochemical Co Ltd filed Critical Ibiden Co Ltd
Priority to JP20739987A priority Critical patent/JPS6451424A/en
Publication of JPS6451424A publication Critical patent/JPS6451424A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To provide the title resin composition excellent in storage stability, adhesiveness, etc., by mixing a liquid epoxy resin with diaminodiphenyl sulfone as a curing agent and a silica powder treated with a silane coupling agent in a specified mixing ratio. CONSTITUTION:A one-pack epoxy resin composition is prepared by mixing 100pts.wt. liquid epoxy resin (A) with 20-45pts.wt. diaminodiphenyl sulfone (B) as a curing agent and 30-65wt.%, based on the resin composition, silica powder (C) treated with a silane coupling agent. Examples of the silane coupling agents used in said treatment include gamma-glycidoxypropyltrimethoxysilane and gamma-aminopropyltriethoxysilane. By using the obtained one-pack epoxy resin composition as a semiconductor sealing agent, sealing of excellent moisture resistance can be performed.
JP20739987A 1987-08-22 1987-08-22 One-pack epoxy resin composition Pending JPS6451424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20739987A JPS6451424A (en) 1987-08-22 1987-08-22 One-pack epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20739987A JPS6451424A (en) 1987-08-22 1987-08-22 One-pack epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS6451424A true JPS6451424A (en) 1989-02-27

Family

ID=16539100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20739987A Pending JPS6451424A (en) 1987-08-22 1987-08-22 One-pack epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS6451424A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999055789A1 (en) * 1998-04-24 1999-11-04 Catalysts & Chemicals Industries Co., Ltd. Coating liquid for forming silica-based film having low dielectric constant and substrate having film of low dielectric constant coated thereon
AU753791B2 (en) * 1999-04-02 2002-10-31 Ntt Docomo, Inc. Channel estimation device and method, demodulation device and method, and fading frequency decision device and method
US8531938B2 (en) 2002-03-28 2013-09-10 Interdigital Technology Corporation Transmit processing using receiver functions

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999055789A1 (en) * 1998-04-24 1999-11-04 Catalysts & Chemicals Industries Co., Ltd. Coating liquid for forming silica-based film having low dielectric constant and substrate having film of low dielectric constant coated thereon
AU753791B2 (en) * 1999-04-02 2002-10-31 Ntt Docomo, Inc. Channel estimation device and method, demodulation device and method, and fading frequency decision device and method
US8531938B2 (en) 2002-03-28 2013-09-10 Interdigital Technology Corporation Transmit processing using receiver functions

Similar Documents

Publication Publication Date Title
MY107882A (en) Epoxy resin composition
JPS6451424A (en) One-pack epoxy resin composition
JPS5454168A (en) Epoxy resin composition
JPS5721450A (en) Epoxy resin composition
JPS5776343A (en) Toothed belt
GB2051097B (en) Moulding compositions
JPS56122145A (en) Resin composition for sealing semiconductor device
JPS56136838A (en) Thermoplastic polyester resin composition
JPS6460625A (en) Casting epoxy resin composition
JPS6429416A (en) Epoxy resin composition
DE3474556D1 (en) Process for producing a coating comprising a mixture of an epoxy resin and a curing agent
JPS55153357A (en) Manufacturing method of resin sealed semiconductor device
JPS6411122A (en) Epoxy resin composition
JPS6490253A (en) Epoxy resin composition and its production
JPS5650958A (en) Resin composition
JPS5649749A (en) Polyester resin composition
JPS5645948A (en) Production of composite material
JPS57192428A (en) One-pack type epoxy resin composition
JPS5792019A (en) Preparation of imidazole mixture assuming liquidity at room temperature
JPS57205420A (en) Thermosetting resin composition
JPS5647445A (en) Epoxy resin composition
JPS6460623A (en) Epoxy resin composition for semiconductor sealing
JPS5565218A (en) Epoxy resin adhesive or filler
JPS5623761A (en) Epoxy resin composition for sealing semiconductor device
JPS6466230A (en) Epoxy resin composition