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JPS6432175A - Semiconductor acceleration sensor - Google Patents

Semiconductor acceleration sensor

Info

Publication number
JPS6432175A
JPS6432175A JP18977887A JP18977887A JPS6432175A JP S6432175 A JPS6432175 A JP S6432175A JP 18977887 A JP18977887 A JP 18977887A JP 18977887 A JP18977887 A JP 18977887A JP S6432175 A JPS6432175 A JP S6432175A
Authority
JP
Japan
Prior art keywords
oxide film
etching
thickness
epitaxial layer
etching mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18977887A
Other languages
Japanese (ja)
Inventor
Shuji Noda
Yamato Mase
Nobuo Nagata
Hiroshi Motoyama
Akihiro Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin Corp
Original Assignee
Aisin Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin Seiki Co Ltd filed Critical Aisin Seiki Co Ltd
Priority to JP18977887A priority Critical patent/JPS6432175A/en
Publication of JPS6432175A publication Critical patent/JPS6432175A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Sensors (AREA)

Abstract

PURPOSE:To obtain a low-cost sensor which enables the thickness of an epitaxial layer to be set freely by using a single crystal substrate having no epitaxial layer and controlling the thickness of a beam by giving a stage to the oxide film of an etching mask. CONSTITUTION:An n-type silicon substrate 1 having no epitaxial layer is oxidized thermally to cover the surface with an oxide film 2. Then this oxide film 2 is bored and p-type impurities are implanted in the holed part to form a gauge resistance diffusion layer 3. Then while a diffusion gauge is contacted by Al wiring 4, an nitride film 5 is formed as a final protection film by plasma CVD. Here, a through-hole 8 around the weight part of the etching mask on the reverse surface is etched with an etching liquid whose etching rate is slow, the beam part 9 and through hole 8 are patterned with photosensitive resin, and then etching is performed from on the oxide film. In this case, the thickness of the beam is controlled by giving a stage to the oxide film of the etching mask by using a prescribed expression, so when the oxide film of the beam part 9 is etched, the difference in etching depth between the through part 8 and beam part 9 is equal to the thickness of the beam part which is left finally.
JP18977887A 1987-07-29 1987-07-29 Semiconductor acceleration sensor Pending JPS6432175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18977887A JPS6432175A (en) 1987-07-29 1987-07-29 Semiconductor acceleration sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18977887A JPS6432175A (en) 1987-07-29 1987-07-29 Semiconductor acceleration sensor

Publications (1)

Publication Number Publication Date
JPS6432175A true JPS6432175A (en) 1989-02-02

Family

ID=16247044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18977887A Pending JPS6432175A (en) 1987-07-29 1987-07-29 Semiconductor acceleration sensor

Country Status (1)

Country Link
JP (1) JPS6432175A (en)

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