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JPS6431376A - High-frequency heating device - Google Patents

High-frequency heating device

Info

Publication number
JPS6431376A
JPS6431376A JP18710987A JP18710987A JPS6431376A JP S6431376 A JPS6431376 A JP S6431376A JP 18710987 A JP18710987 A JP 18710987A JP 18710987 A JP18710987 A JP 18710987A JP S6431376 A JPS6431376 A JP S6431376A
Authority
JP
Japan
Prior art keywords
reduced
heating
chips
packages
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18710987A
Other languages
Japanese (ja)
Inventor
Daisuke Betsusou
Kazuho Sakamoto
Naoyoshi Maehara
Takashi Niwa
Takahiro Matsumoto
Koji Yoshino
Haruo Suenaga
Masaaki Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18710987A priority Critical patent/JPS6431376A/en
Publication of JPS6431376A publication Critical patent/JPS6431376A/en
Pending legal-status Critical Current

Links

Landscapes

  • Constitution Of High-Frequency Heating (AREA)

Abstract

PURPOSE:To suppress the heating of high-voltage high-speed diodes with a simple structure and obtain the desired withstand voltage by connecting multiple chips in series, sealing them with an insulating material to form a package, and connecting two or more packages in parallel. CONSTITUTION:Two packages each constituted of chips 2 connected in series by a lead wire are connected in parallel by lead wires 3. The heating can be reduced because the forward direction of diodes is diverted and the switching characteristic can be improved because the individual chip area can be reduced according to this constitution, the switching loss can be reduced, and the heating can be reduced. The lead wires are also helpful for the radiation of chips.
JP18710987A 1987-07-27 1987-07-27 High-frequency heating device Pending JPS6431376A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18710987A JPS6431376A (en) 1987-07-27 1987-07-27 High-frequency heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18710987A JPS6431376A (en) 1987-07-27 1987-07-27 High-frequency heating device

Publications (1)

Publication Number Publication Date
JPS6431376A true JPS6431376A (en) 1989-02-01

Family

ID=16200257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18710987A Pending JPS6431376A (en) 1987-07-27 1987-07-27 High-frequency heating device

Country Status (1)

Country Link
JP (1) JPS6431376A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127304A (en) * 2012-12-26 2014-07-07 Panasonic Corp High frequency heating apparatus
US11828545B2 (en) 2019-01-15 2023-11-28 T.Rad Co., Ltd. Corrugated fin type heat exchanger

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127304A (en) * 2012-12-26 2014-07-07 Panasonic Corp High frequency heating apparatus
US11828545B2 (en) 2019-01-15 2023-11-28 T.Rad Co., Ltd. Corrugated fin type heat exchanger

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