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JPS5662345A - Load frame and semiconductor device - Google Patents

Load frame and semiconductor device

Info

Publication number
JPS5662345A
JPS5662345A JP13762479A JP13762479A JPS5662345A JP S5662345 A JPS5662345 A JP S5662345A JP 13762479 A JP13762479 A JP 13762479A JP 13762479 A JP13762479 A JP 13762479A JP S5662345 A JPS5662345 A JP S5662345A
Authority
JP
Japan
Prior art keywords
lead
pellet
tab
semiconductor device
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13762479A
Other languages
Japanese (ja)
Inventor
Susumu Okikawa
Hiromichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13762479A priority Critical patent/JPS5662345A/en
Publication of JPS5662345A publication Critical patent/JPS5662345A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the heat dissipating property by composing a lead frame connecting a tab made of a material close to the coefficient of thermal expansion of a pellet and a lead made of a material of a high conductivity. CONSTITUTION:A tab 11 made of a material such as Kovar 42 and alloy closer to the coefficient of thermal expansion of a semiconductor pellet 20 and a lead 14 made of a material, such as copper, higher in the heat conductivity than the tab 11 are connected solidly to form a lead frame. A semiconductor pellet 20 is fastened on a tab 11 of the lead frame while a wire bonding is made between the pellet 20 and the lead 14 with a wiring. Then, the lead 14, the pellet 20, the wire 21 and the like are packaged.
JP13762479A 1979-10-26 1979-10-26 Load frame and semiconductor device Pending JPS5662345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13762479A JPS5662345A (en) 1979-10-26 1979-10-26 Load frame and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13762479A JPS5662345A (en) 1979-10-26 1979-10-26 Load frame and semiconductor device

Publications (1)

Publication Number Publication Date
JPS5662345A true JPS5662345A (en) 1981-05-28

Family

ID=15203008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13762479A Pending JPS5662345A (en) 1979-10-26 1979-10-26 Load frame and semiconductor device

Country Status (1)

Country Link
JP (1) JPS5662345A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254759A (en) * 1984-05-31 1985-12-16 Mitsubishi Electric Corp Compound metal material for lead frame
JPS6441146U (en) * 1987-09-08 1989-03-13
JPH02235365A (en) * 1989-03-08 1990-09-18 Mitsubishi Electric Corp Lead frame for semiconductor device
EP0534678A3 (en) * 1991-09-25 1994-03-16 American Telephone & Telegraph
US5428885A (en) * 1989-01-14 1995-07-04 Tdk Corporation Method of making a multilayer hybrid circuit
WO1999044234A1 (en) * 1998-02-27 1999-09-02 Robert Bosch Gmbh Lead frame device and method for producing the same
JP2020094933A (en) * 2018-12-13 2020-06-18 日立オートモティブシステムズ株式会社 Thermal flowmeter

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254759A (en) * 1984-05-31 1985-12-16 Mitsubishi Electric Corp Compound metal material for lead frame
JPS6441146U (en) * 1987-09-08 1989-03-13
US5428885A (en) * 1989-01-14 1995-07-04 Tdk Corporation Method of making a multilayer hybrid circuit
JPH02235365A (en) * 1989-03-08 1990-09-18 Mitsubishi Electric Corp Lead frame for semiconductor device
EP0534678A3 (en) * 1991-09-25 1994-03-16 American Telephone & Telegraph
US6528868B1 (en) 1998-02-21 2003-03-04 Robert Bosch Gmbh Lead frame device and method for producing the same
WO1999044234A1 (en) * 1998-02-27 1999-09-02 Robert Bosch Gmbh Lead frame device and method for producing the same
KR100730906B1 (en) * 1998-02-27 2007-06-22 로베르트 보쉬 게엠베하 Lead frame device and manufacturing method thereof
JP2020094933A (en) * 2018-12-13 2020-06-18 日立オートモティブシステムズ株式会社 Thermal flowmeter

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