[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS6418745U - - Google Patents

Info

Publication number
JPS6418745U
JPS6418745U JP1987114427U JP11442787U JPS6418745U JP S6418745 U JPS6418745 U JP S6418745U JP 1987114427 U JP1987114427 U JP 1987114427U JP 11442787 U JP11442787 U JP 11442787U JP S6418745 U JPS6418745 U JP S6418745U
Authority
JP
Japan
Prior art keywords
insulating member
ceramic insulating
heat sink
interposed
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987114427U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987114427U priority Critical patent/JPS6418745U/ja
Publication of JPS6418745U publication Critical patent/JPS6418745U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の断面図、第２図ａ
は第１図のセラミツク絶縁板の平面図、同図ｂは
同図ａのＡ―Ａ断面図、第３図は従来の絶縁型半
導体装置の断面図である。 １……放熱板、２，３……セラミツク絶縁板、
２ａ……絶縁板周辺の穴、４……半田、５……半
導体ペレツト、６……接続ワイヤ、７……ゲート
リード、８……アノードリード、９……カソード
リード、１０……樹脂ケース、１１……樹脂、１
２……空洞。 Figure 1 is a sectional view of an embodiment of the present invention, Figure 2a
1 is a plan view of the ceramic insulating plate shown in FIG. 1, FIG. 1B is a sectional view taken along the line AA in FIG. 1... Heat sink, 2, 3... Ceramic insulation board,
2a... Hole around the insulating plate, 4... Solder, 5... Semiconductor pellet, 6... Connection wire, 7... Gate lead, 8... Anode lead, 9... Cathode lead, 10... Resin case, 11...Resin, 1
2...Hollow.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトと放熱板との間にセラミツクの
絶縁部材を介在させた半導体装置において、前記
セラミツク絶縁部材の周辺に複数の穴が設けられ
ていることを特徴とする絶縁型半導体装置。 1. An insulated semiconductor device in which a ceramic insulating member is interposed between a semiconductor pellet and a heat sink, characterized in that a plurality of holes are provided around the ceramic insulating member.
JP1987114427U 1987-07-24 1987-07-24 Pending JPS6418745U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987114427U JPS6418745U (en) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987114427U JPS6418745U (en) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6418745U true JPS6418745U (en) 1989-01-30

Family

ID=31355166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987114427U Pending JPS6418745U (en) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6418745U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7388573B1 (en) * 1991-12-17 2008-06-17 Sony Corporation Audio equipment and method of displaying operation thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7388573B1 (en) * 1991-12-17 2008-06-17 Sony Corporation Audio equipment and method of displaying operation thereof

Similar Documents

Publication Publication Date Title
JPS6418745U (en)
JPS60163738U (en) semiconductor equipment
JPS59195748U (en) Isolated semiconductor device
JPS646087U (en)
JPS587346U (en) semiconductor equipment
JPS6190244U (en)
JPH0377462U (en)
JPS6294643U (en)
JPS6429846U (en)
JPS6130252U (en) semiconductor equipment
JPH0330443U (en)
JPH01174940U (en)
JPS59115660U (en) High voltage insulation structure for semiconductor devices
JPH0256460U (en)
JPS62145337U (en)
JPH0482860U (en)
JPS6260046U (en)
JPS6278751U (en)
JPS63127151U (en)
JPS63142849U (en)
JPS6188458U (en)
JPS62204349U (en)
JPH01146548U (en)
JPS63153546U (en)
JPS61182045U (en)