JPS5418228B2
(de)
*
|
1973-03-02 |
1979-07-05 |
|
|
JPS5161500A
(ja)
*
|
1974-11-27 |
1976-05-28 |
Dai Ichi Kogyo Seiyaku Co Ltd |
Kasankasuisosuiyozonenzai
|
SE400581B
(sv)
*
|
1974-12-13 |
1978-04-03 |
Nordnero Ab |
Bad for kemisk polering av koppar och dess legeringar
|
SE400575B
(sv)
*
|
1974-12-13 |
1978-04-03 |
Nordnero Ab |
Bad for betning av koppar och dess legeringar
|
FR2297906A1
(fr)
*
|
1975-01-14 |
1976-08-13 |
Ugine Kuhlmann |
Stabilisation du peroxyde d'hydrogene dans les bains acides pour le decapage des metaux
|
JPS5286933A
(en)
*
|
1976-01-14 |
1977-07-20 |
Tokai Electro Chemical Co |
Method of treating surface of copper and copper alloy
|
US4067751A
(en)
*
|
1976-05-11 |
1978-01-10 |
Vereinigte Metallwerke Ranshofen-Berndorf Aktiengesellschaft |
Aqueous NaCl test solution for aluminum and its alloys
|
US4080246A
(en)
*
|
1976-06-29 |
1978-03-21 |
Gaf Corporation |
Novel etching composition and method for using same
|
US4169068A
(en)
*
|
1976-08-20 |
1979-09-25 |
Japan Synthetic Rubber Company Limited |
Stripping liquor composition for removing photoresists comprising hydrogen peroxide
|
US4220706A
(en)
*
|
1978-05-10 |
1980-09-02 |
Rca Corporation |
Etchant solution containing HF-HnO3 -H2 SO4 -H2 O2
|
BE871631A
(fr)
*
|
1978-10-27 |
1979-04-27 |
Centre Rech Metallurgique |
Procede de decapage continu de toles en acier.
|
DE2847267C2
(de)
*
|
1978-10-31 |
1993-12-23 |
Decker Gmbh & Co Kg Geb |
Stabilisator für eine wäßrige Lösung zum Beizen und/oder chemischen Glänzen von Gegenständen aus Kupfer oder Kupferlegierungen in einem mehrstufigen Verfahren und Verwendung des Stabilisators
|
DE2849894A1
(de)
*
|
1978-11-17 |
1980-05-29 |
Hoechst Ag |
Verfahren zum reinigen von kupfer enthaltenden metalloberflaechen
|
US4236957A
(en)
*
|
1979-06-25 |
1980-12-02 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant
|
US4233111A
(en)
*
|
1979-06-25 |
1980-11-11 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant
|
US4233113A
(en)
*
|
1979-06-25 |
1980-11-11 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant
|
US4233112A
(en)
*
|
1979-06-25 |
1980-11-11 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -polysulfide etchant
|
US4746369A
(en)
*
|
1982-01-11 |
1988-05-24 |
Enthone, Incorporated |
Peroxide selective stripping compositions and method
|
JPS58197277A
(ja)
*
|
1982-05-08 |
1983-11-16 |
Mitsubishi Gas Chem Co Inc |
金属の化学的溶解処理液
|
DE3244443C2
(de)
*
|
1982-12-01 |
1986-11-06 |
Späne, Rainer, 7888 Rheinfelden |
Verfahren zur Entfernung von eisen-, calcium- und manganhaltigen Verockerungen und/oder Versinterungen aus zur Wasserversorgung betriebenen Einrichtungen
|
US4491500A
(en)
*
|
1984-02-17 |
1985-01-01 |
Rem Chemicals, Inc. |
Method for refinement of metal surfaces
|
DE3642604A1
(de)
*
|
1986-12-13 |
1988-06-23 |
Henkel Kgaa |
Verwendung kurzkettiger alkansulfonsaeuren in reinigungs- und desinfektionsmitteln
|
JPS63172799A
(ja)
*
|
1987-01-12 |
1988-07-16 |
日本パ−カライジング株式会社 |
アルミニウムの表面洗浄剤
|
US4754803A
(en)
*
|
1987-02-02 |
1988-07-05 |
Phelps Dodge Industries, Inc. |
Manufacturing copper rod by casting, hot rolling and chemically shaving and pickling
|
US4946520A
(en)
*
|
1987-02-02 |
1990-08-07 |
Phelps Dodge Industries, Inc. |
Copper rod manufactured by casting, hot rolling and chemically shaving and pickling
|
US4812173A
(en)
*
|
1987-05-01 |
1989-03-14 |
Ciba-Geigy Corporation |
Stabilized hydrogen peroxide contact lens disinfecting solution
|
US4851077A
(en)
*
|
1988-05-19 |
1989-07-25 |
Mcdonnell Douglas Corporation |
Chemical milling of lithium aluminum alloy
|
US5052421A
(en)
*
|
1988-07-19 |
1991-10-01 |
Henkel Corporation |
Treatment of aluminum with non-chrome cleaner/deoxidizer system followed by conversion coating
|
GB8829253D0
(en)
*
|
1988-12-15 |
1989-01-25 |
Imasa Ltd |
Method of removing deposits of tin lead or tin/lead alloys from copper substrates and compositions for use therein
|
DE3900207A1
(de)
*
|
1989-01-05 |
1990-07-12 |
Basf Ag |
Verwendung von copolymerisaten aus 1,2-di-alkoxyethylenen und monoethylenisch ungesaettigten dicarbonsaeureanhydriden in waschmitteln und waschmittel, die diese copolymerisate enthalten
|
FR2650303B1
(fr)
*
|
1989-07-26 |
1993-12-10 |
Ugine Aciers Chatillon Gueugnon |
Procede de decapage en bain acide de produits metalliques contenant du titane ou au moins un element chimique de la famille du titane
|
US5100500A
(en)
*
|
1991-02-08 |
1992-03-31 |
Aluminum Company Of America |
Milling solution and method
|
US5248386A
(en)
*
|
1991-02-08 |
1993-09-28 |
Aluminum Company Of America |
Milling solution and method
|
IT1255855B
(it)
*
|
1992-10-12 |
1995-11-17 |
Cesare Pedrazzini |
Processo di decapaggio e di passivazione per lamiere di titanio in nastro, senza impiego di acido nitrico.
|
DE69504126T2
(de)
*
|
1994-04-20 |
1998-12-24 |
Eastman Kodak Co., Rochester, N.Y. |
Verarbeitung eines photographischen Silberhalogenidelement mit einer Wasserstoffperoxid-Bleichzusammensetzung
|
US5454876A
(en)
*
|
1994-08-02 |
1995-10-03 |
21St Century Companies, Inc. |
Process for reducing lead leachate in brass plumbing components
|
TW466728B
(en)
*
|
1999-05-21 |
2001-12-01 |
Cfmt Inc |
Methods for wet processing electronic components having copper containing surfaces
|
EP1377692B1
(de)
|
2001-04-09 |
2005-11-09 |
AK Steel Properties, Inc. |
Wasserstoffperoxid-beizen von siliciumhaltigen elektrostrahlqualitäten
|
KR20030090720A
(ko)
*
|
2001-04-09 |
2003-11-28 |
에이케이 프로퍼티즈 인코포레이티드 |
폐 피클액로 부터 과산화수소를 제거하는 장치 및 방법
|
ES2272699T3
(es)
|
2001-04-09 |
2007-05-01 |
Ak Steel Properties, Inc. |
Tecnica de decapado con peroxido de hidrogeno para aceros inoxidables.
|
JP4047556B2
(ja)
*
|
2001-05-22 |
2008-02-13 |
株式会社エンプラス |
コンタクトピン及び電気部品用ソケット
|
JP2003045539A
(ja)
*
|
2001-05-22 |
2003-02-14 |
Enplas Corp |
コンタクトピン及び電気部品用ソケット
|
DE102005011298A1
(de)
|
2005-03-04 |
2006-09-07 |
Gebr. Schmid Gmbh & Co. |
Vorrichtung und Verfahren zum Ätzen von Substraten
|
KR100712879B1
(ko)
|
2005-04-06 |
2007-04-30 |
주식회사 잉크테크 |
에칭액 조성물
|
US7976723B2
(en)
*
|
2007-05-17 |
2011-07-12 |
International Business Machines Corporation |
Method for kinetically controlled etching of copper
|
KR101845083B1
(ko)
*
|
2010-12-10 |
2018-04-04 |
동우 화인켐 주식회사 |
액정표시장치용 어레이 기판의 제조방법
|
DE102010054509A1
(de)
*
|
2010-12-14 |
2012-06-14 |
Thyssenkrupp Electrical Steel Gmbh |
Verfahren zur Herstellung eines kornorientierten Elektrobands
|
JP2013199702A
(ja)
*
|
2012-02-24 |
2013-10-03 |
Mitsubishi Shindoh Co Ltd |
銅或いは銅基合金表面の酸化皮膜の除去方法
|
CN104327857B
(zh)
*
|
2014-09-30 |
2016-01-13 |
江西省平波电子有限公司 |
一种触摸屏用蚀刻液及其制备方法
|
WO2023192000A1
(en)
*
|
2022-03-31 |
2023-10-05 |
Fujifilm Electronic Materials U.S.A., Inc. |
Surface treatment compositions and methods
|