JPS5265683A - Production of insulated gate type mis semiconductor device - Google Patents
Production of insulated gate type mis semiconductor deviceInfo
- Publication number
- JPS5265683A JPS5265683A JP50141665A JP14166575A JPS5265683A JP S5265683 A JPS5265683 A JP S5265683A JP 50141665 A JP50141665 A JP 50141665A JP 14166575 A JP14166575 A JP 14166575A JP S5265683 A JPS5265683 A JP S5265683A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- insulated gate
- gate type
- type mis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 230000003071 parasitic effect Effects 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To reduce parasitic capacity by removing by etching the soruce, drain and gate forming portions of the insulating film on the surface of a semiconductor substrate, depositin ga polycrystalline Si layer containing an impurity of the conductivity type opposite to that of the substrate,, using this layer as a diffusion source, removing the channel portions of the insulating film by etching, repeating heat treatment several times, then forming a gate electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50141665A JPS5265683A (en) | 1975-11-28 | 1975-11-28 | Production of insulated gate type mis semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50141665A JPS5265683A (en) | 1975-11-28 | 1975-11-28 | Production of insulated gate type mis semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5265683A true JPS5265683A (en) | 1977-05-31 |
Family
ID=15297318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50141665A Pending JPS5265683A (en) | 1975-11-28 | 1975-11-28 | Production of insulated gate type mis semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5265683A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS554964A (en) * | 1978-06-27 | 1980-01-14 | Toshiba Corp | Manufacture of mos type semiconductor |
JPS5567166A (en) * | 1978-11-15 | 1980-05-21 | Fujitsu Ltd | Preparation of mos type semiconductor device |
JPS5613757A (en) * | 1979-07-03 | 1981-02-10 | Siemens Ag | Method of manufacturing low resistance diffused region |
JPS5732674A (en) * | 1980-07-08 | 1982-02-22 | Ibm | Integrated circuit structure |
EP0459398A2 (en) * | 1990-05-28 | 1991-12-04 | Kabushiki Kaisha Toshiba | Manufacturing method of a channel in MOS semiconductor devices |
-
1975
- 1975-11-28 JP JP50141665A patent/JPS5265683A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS554964A (en) * | 1978-06-27 | 1980-01-14 | Toshiba Corp | Manufacture of mos type semiconductor |
JPS5567166A (en) * | 1978-11-15 | 1980-05-21 | Fujitsu Ltd | Preparation of mos type semiconductor device |
JPS628956B2 (en) * | 1978-11-15 | 1987-02-25 | Fujitsu Ltd | |
JPS5613757A (en) * | 1979-07-03 | 1981-02-10 | Siemens Ag | Method of manufacturing low resistance diffused region |
JPS5732674A (en) * | 1980-07-08 | 1982-02-22 | Ibm | Integrated circuit structure |
JPH033389B2 (en) * | 1980-07-08 | 1991-01-18 | Intaanashonaru Bijinesu Mashiinzu Corp | |
EP0459398A2 (en) * | 1990-05-28 | 1991-12-04 | Kabushiki Kaisha Toshiba | Manufacturing method of a channel in MOS semiconductor devices |
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