JPS5233787B2 - - Google Patents
Info
- Publication number
- JPS5233787B2 JPS5233787B2 JP4550772A JP4550772A JPS5233787B2 JP S5233787 B2 JPS5233787 B2 JP S5233787B2 JP 4550772 A JP4550772 A JP 4550772A JP 4550772 A JP4550772 A JP 4550772A JP S5233787 B2 JPS5233787 B2 JP S5233787B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550772A JPS5233787B2 (ja) | 1972-05-10 | 1972-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550772A JPS5233787B2 (ja) | 1972-05-10 | 1972-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS496460A JPS496460A (ja) | 1974-01-21 |
| JPS5233787B2 true JPS5233787B2 (ja) | 1977-08-30 |
Family
ID=12721312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4550772A Expired JPS5233787B2 (ja) | 1972-05-10 | 1972-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5233787B2 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5640259A (en) * | 1979-09-11 | 1981-04-16 | Nec Corp | Manufacture of semiconductor device |
| US4446477A (en) * | 1981-08-21 | 1984-05-01 | Sperry Corporation | Multichip thin film module |
| US4617730A (en) * | 1984-08-13 | 1986-10-21 | International Business Machines Corporation | Method of fabricating a chip interposer |
| JPS61178357A (ja) * | 1985-01-30 | 1986-08-11 | Graphtec Corp | 用紙自動整列装置 |
| JPH0815200B2 (ja) * | 1987-05-18 | 1996-02-14 | イビデン株式会社 | 半導体搭載基板用の導体ピン |
| JPH0815201B2 (ja) * | 1987-05-18 | 1996-02-14 | イビデン株式会社 | 半導体搭載用基板 |
-
1972
- 1972-05-10 JP JP4550772A patent/JPS5233787B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS496460A (ja) | 1974-01-21 |