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JPS5218173A - Soldering method of semiconductor element - Google Patents

Soldering method of semiconductor element

Info

Publication number
JPS5218173A
JPS5218173A JP9439175A JP9439175A JPS5218173A JP S5218173 A JPS5218173 A JP S5218173A JP 9439175 A JP9439175 A JP 9439175A JP 9439175 A JP9439175 A JP 9439175A JP S5218173 A JPS5218173 A JP S5218173A
Authority
JP
Japan
Prior art keywords
soldering method
semiconductor element
installing
improve
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9439175A
Other languages
Japanese (ja)
Inventor
Tsutomu Kamata
Tomoshi Uesono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9439175A priority Critical patent/JPS5218173A/en
Publication of JPS5218173A publication Critical patent/JPS5218173A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: In order to improve the soldering method of the base of element by means of installing the organic agents on a cooling piece in troidal manner.
COPYRIGHT: (C)1977,JPO&Japio
JP9439175A 1975-08-01 1975-08-01 Soldering method of semiconductor element Pending JPS5218173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9439175A JPS5218173A (en) 1975-08-01 1975-08-01 Soldering method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9439175A JPS5218173A (en) 1975-08-01 1975-08-01 Soldering method of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5218173A true JPS5218173A (en) 1977-02-10

Family

ID=14108968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9439175A Pending JPS5218173A (en) 1975-08-01 1975-08-01 Soldering method of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5218173A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5464050A (en) * 1977-10-31 1979-05-23 Toshiba Corp Soldering tool and its using method
JPS54102541U (en) * 1977-12-28 1979-07-19
JPS60121668A (en) * 1983-12-05 1985-06-29 Matsushita Electric Ind Co Ltd Lead storage battery
JPS6130837U (en) * 1984-07-27 1986-02-24 株式会社 寺岡精工 load cell

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5464050A (en) * 1977-10-31 1979-05-23 Toshiba Corp Soldering tool and its using method
JPS5615987B2 (en) * 1977-10-31 1981-04-14
JPS54102541U (en) * 1977-12-28 1979-07-19
JPS60121668A (en) * 1983-12-05 1985-06-29 Matsushita Electric Ind Co Ltd Lead storage battery
JPH0512822B2 (en) * 1983-12-05 1993-02-19 Matsushita Electric Ind Co Ltd
JPS6130837U (en) * 1984-07-27 1986-02-24 株式会社 寺岡精工 load cell
JPH0511478Y2 (en) * 1984-07-27 1993-03-22

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