JPS5038256U - - Google Patents
Info
- Publication number
- JPS5038256U JPS5038256U JP9175473U JP9175473U JPS5038256U JP S5038256 U JPS5038256 U JP S5038256U JP 9175473 U JP9175473 U JP 9175473U JP 9175473 U JP9175473 U JP 9175473U JP S5038256 U JPS5038256 U JP S5038256U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175473U JPS5038256U (ja) | 1973-08-02 | 1973-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175473U JPS5038256U (ja) | 1973-08-02 | 1973-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5038256U true JPS5038256U (ja) | 1975-04-21 |
Family
ID=28281271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9175473U Pending JPS5038256U (ja) | 1973-08-02 | 1973-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5038256U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011049523A (ja) * | 2009-07-28 | 2011-03-10 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
-
1973
- 1973-08-02 JP JP9175473U patent/JPS5038256U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011049523A (ja) * | 2009-07-28 | 2011-03-10 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |