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JPS5933075B2 - Laser processing method and device - Google Patents

Laser processing method and device

Info

Publication number
JPS5933075B2
JPS5933075B2 JP53008343A JP834378A JPS5933075B2 JP S5933075 B2 JPS5933075 B2 JP S5933075B2 JP 53008343 A JP53008343 A JP 53008343A JP 834378 A JP834378 A JP 834378A JP S5933075 B2 JPS5933075 B2 JP S5933075B2
Authority
JP
Japan
Prior art keywords
laser
workpiece
hole
annular
annular beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53008343A
Other languages
Japanese (ja)
Other versions
JPS54102691A (en
Inventor
幸隆 長野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP53008343A priority Critical patent/JPS5933075B2/en
Publication of JPS54102691A publication Critical patent/JPS54102691A/en
Publication of JPS5933075B2 publication Critical patent/JPS5933075B2/en
Expired legal-status Critical Current

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  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 本発明は被加工物のバリ取りなどに好適なレーザ加工方
法および装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing method and apparatus suitable for deburring a workpiece.

一般に機械加工された被加工物は加工部にバリが付着し
ており、加工後これを除去する再加工、いわゆるバリ取
り作業が必要である。
In general, machined workpieces have burrs attached to the machined portion, and after machining, it is necessary to perform reprocessing to remove the burrs, a so-called deburring operation.

これはやすりなどによる手作業か、ドリル、やすりなど
を用いた機械的な方法が採用されている。しかし機械的
な方法は、高能率であるが、バリ取り後さらにこの作業
による2次バリが発生し、これをさらに除去する作業を
必要とする。さらにバリ取りされる部位が貫通孔の開口
周縁部などの場合は、表裏両面のバリ取りが必要なので
、このためバリ取りに費される労力は量産においては多
大となり、生産の合理化に対し大きな隘路となつている
。またバリ取りに限らず表裏両面に面取り、その他の加
工を施す場合も同様である。本発明は上述の不都合を除
去するためになされたもので、レーザビームの焦点を再
加工すべき貫通孔の内に置き、焦点の前後において、上
記貫通孔の両端開口の周縁部を同時に再加工することに
より、貫通孔の開口周縁部を、高能率に、しかも2次バ
リが発生することなく再加工するレーザ加工方法および
この方法を実施する装置である。
This can be done manually using a file, or mechanically using a drill or file. However, although the mechanical method is highly efficient, secondary burrs are generated by this operation after deburring, and further work is required to remove them. Furthermore, if the area to be deburred is the opening periphery of a through-hole, it is necessary to deburr both the front and back sides, so the labor required for deburring is large in mass production, creating a major bottleneck in streamlining production. It is becoming. The same applies not only to deburring but also to chamfering and other processing on both the front and back surfaces. The present invention was made in order to eliminate the above-mentioned disadvantages, and the focus of the laser beam is placed inside the through hole to be reworked, and the peripheral edges of the openings at both ends of the through hole are simultaneously reworked before and after the focus. The present invention provides a laser processing method for reprocessing the opening peripheral portion of a through hole with high efficiency and without generating secondary burrs, and an apparatus for implementing this method.

以下、本発明の詳細を図示の一実施例を参照して説明す
る。第1図および第2図において、被加工物1は矩形板
状をなし、ほぼ中央部に貫通孔2がドリルによりあけら
れていて、その表裏の両端開口周縁部3、4にはバリ5
、6が発生している。本実施例はこれらのバリ5、6を
除去する再加工に本発明を適用したものである。最初に
本発明の装置につき説明する。
Hereinafter, details of the present invention will be explained with reference to an illustrated embodiment. In FIGS. 1 and 2, a workpiece 1 has a rectangular plate shape, and a through hole 2 is drilled approximately in the center thereof, and burrs 5 are formed on the peripheral edges 3 and 4 of openings at both ends of the front and back sides of the workpiece 1.
, 6 have occurred. In this embodiment, the present invention is applied to reprocessing to remove these burrs 5 and 6. First, the apparatus of the present invention will be explained.

基台11上には加工台12が取付けられていて、その上
に被加工物1が載置されている。加工台12は略図的に
示されているが、被加工物1を二次元的に移動して位置
ぎめできる、いわゆるXYテーブルである。基台11の
上方にレーザ発振装置13が設けられていて、これは基
台11上に固定された支持体14により、上下方向(本
図において)に位置調節自在に固定されている。基台1
1上面には、さらに加工台12の両側に支柱15、16
が植設されている。これら支柱15、16の最上部には
レーザ発振装置13からのレーザビームITを環状ビー
ム18に変換する環状光束機構19が支持固定されてい
て、その下方に環状ビーム18を収束する収束レンズ2
0を保持するとともに、被加工物1に対し収束レンズ2
0を進退させる焦点位置調節機構21が位置調節自在に
固定されている。上記の環状光束機構19は、両支柱1
5,16間にまたがり、かつ環状光束機構19の各部を
取付ける架体23と、環状板体からなり内側部にビーム
径調節ねじ24が設けられていて架体23に固定された
調節体25と、円錐反射面26をもち、架体23の中心
部に設けられた円錐ミラー体28と、環状板体からなり
、外側部に上記ビーム径調節ねじ24にはまり合うねじ
29をそなえ、内側部に上記円錐反射面26に対応した
円錐反射内面30をもつた円錐内面ミラー体31とから
構成されている。そしてこれら円錐ミラー体28、円錐
内面ミラー体31は同軸に設けられて卦り、円錐内面ミ
ラー体31を回動させることにより、これは円錐ミラー
体28に対し上下動するようになつている。また環状ビ
ーム18を通すため、架体23の取付部32は放射状の
薄い連結体(図示しない)で支持されている。焦点位置
調節機構21はほぼ環状をなす板状で形成された調節部
材21aからなつていて、その内側面に位置調節ねじ3
5が設けられて卦り、取付孔36,36により支柱15
,16に摺動自在に嵌合していて、小ねじにより所望の
位置に固定される。
A processing table 12 is mounted on the base 11, and the workpiece 1 is placed on it. Although the processing table 12 is schematically shown, it is a so-called XY table that can move and position the workpiece 1 two-dimensionally. A laser oscillation device 13 is provided above the base 11, and is fixed by a support 14 fixed on the base 11 so that its position can be adjusted in the vertical direction (in this figure). Base 1
1, there are further supports 15 and 16 on both sides of the processing table 12.
has been planted. An annular beam mechanism 19 that converts the laser beam IT from the laser oscillation device 13 into an annular beam 18 is supported and fixed at the top of these pillars 15 and 16, and a converging lens 2 that converges the annular beam 18 is below the annular beam mechanism 19.
0 and the converging lens 2 to the workpiece 1.
A focal position adjustment mechanism 21 for moving the lens 0 forward and backward is fixed so as to be adjustable in position. The above-mentioned annular light flux mechanism 19 has both pillars 1
5 and 16 and to which each part of the annular beam mechanism 19 is attached; and an adjustment body 25 which is made of an annular plate and has a beam diameter adjusting screw 24 on its inner side and is fixed to the frame 23. , which has a conical reflecting surface 26 and is made up of a conical mirror body 28 provided at the center of the frame 23, and an annular plate body, and has a screw 29 fitted to the beam diameter adjustment screw 24 on the outside, and a screw 29 on the inside that fits into the beam diameter adjustment screw 24. It is comprised of a conical inner surface mirror body 31 having a conical reflective inner surface 30 corresponding to the conical reflective surface 26 . The conical mirror body 28 and the conical inner mirror body 31 are coaxially provided, and by rotating the conical inner mirror body 31, it can be moved up and down with respect to the conical mirror body 28. Further, in order to allow the annular beam 18 to pass through, the mounting portion 32 of the frame 23 is supported by a radial thin connecting body (not shown). The focal position adjustment mechanism 21 consists of an adjustment member 21a formed in a substantially annular plate shape, and a position adjustment screw 3 is provided on the inner surface of the adjustment member 21a.
5 is provided, and the mounting holes 36, 36 allow the support 15
, 16, and is fixed in a desired position with a machine screw.

収束レンズ20はレンズ本体40と、このレンズ本体4
0を支持する環状の枠体41とからなつている。枠体4
1は内側面に形成された段部42と蓋体43とによりレ
ンズ本体40を保持するとともに、外側面に設けられた
ねじ44が位置調節ねじ35とはまり合つて調節部材2
1aに支持されている。従つて調節部材21aの移動に
よりレンズ20の焦点位置45は、被加工物1に対し大
きく移動調節され、枠体41の回動により精密な移動調
節がなされる。本発明の装置は上述したように構成され
ているが、その作動とともに本発明の方法につき述べる
The converging lens 20 includes a lens body 40 and this lens body 4.
It consists of an annular frame 41 that supports 0. Frame 4
1 holds the lens body 40 by a stepped portion 42 formed on the inner surface and a lid body 43, and a screw 44 provided on the outer surface fits into the position adjustment screw 35, so that the adjustment member 2
It is supported by 1a. Therefore, the movement of the adjustment member 21a allows the focal position 45 of the lens 20 to be largely adjusted relative to the workpiece 1, and the rotation of the frame 41 allows precise movement adjustment. The apparatus of the present invention is constructed as described above, and the operation thereof as well as the method of the present invention will be described.

.調節は加工レーザビーム17と同様な図示しない調節
用レーザビームを例えば側方から導入して行なうのであ
る。まず焦点位置45が被加工物1の孔2の深さの中央
で、かつ孔2の軸上に置かれる1

−ように(T,=−t)焦点調節機構21VCよりレン
ズ20を動かして調節する。次に円錐内面ミラー体31
を回動させて環状ビーム18の外径Dを調節して被加工
物1の開口周縁部3,4にレーザビーム46が接するよ
うにする。以上で調節が完了し、加工レーザビーム17
を照射すると、レーザビーム17は、円錐反射面26に
より直角に曲げられ、円錐反射内面30によりさらに直
角に曲げられ、環状ビーム18となつてレンズ20の方
に行く、ここに卦いて環状ビーム18は集束されレーザ
ビーム46となつて貫通孔2の中に入つて行き透過する
.. The adjustment is performed by introducing an adjustment laser beam (not shown) similar to the processing laser beam 17, for example, from the side. First, the focal point 45 is located at the center of the depth of the hole 2 of the workpiece 1 and on the axis of the hole 2.
/
- (T,=-t) by moving the lens 20 from the focus adjustment mechanism 21VC. Next, the conical inner mirror body 31
is rotated to adjust the outer diameter D of the annular beam 18 so that the laser beam 46 comes into contact with the peripheral edges 3 and 4 of the opening of the workpiece 1. With the above adjustment completed, the processing laser beam 17
, the laser beam 17 is bent at right angles by the conical reflective surface 26 and further bent at right angles by the conical reflective inner surface 30 to become an annular beam 18 and go toward the lens 20, where the annular beam 18 is focused into a laser beam 46 that enters the through hole 2 and is transmitted therethrough.

この際バリ5,6はレーザビーム46により直ちに蒸発
除去される。な卦本実施例Vc.卦いては、円錐反射面
2、6と円錐反射内面30とにより環状ビームを得たが
、第3図に示すように2個の円錐ブリズム47,48を
使用しても同様な効果が得られる。
At this time, the burrs 5 and 6 are immediately vaporized and removed by the laser beam 46. A trigram example Vc. Although an annular beam was obtained by the conical reflecting surfaces 2 and 6 and the conical reflecting inner surface 30, the same effect can be obtained by using two conical prisms 47 and 48 as shown in FIG. .

以上詳述したように、本発明のレーザ加工方法はレーザ
ビームを使用したので加工後2次バリの発生は全くない
As detailed above, since the laser processing method of the present invention uses a laser beam, no secondary burrs are generated after processing.

さらに貫通孔内に焦点を置くので表裏両面同時に加工さ
れきわめて高能率であるなどのすぐれた効果を奏するも
のである。また本発明の装置は、レーザビームを環状ビ
ームに変えてから収束レンズで収束するようにしたので
、焦点位置の前後でもエネルギ密度が高く、十分に加工
することができ、また環状ビームの径を調節するだけで
容易に被加工物の孔径に適応させることができるなどの
種々なすぐれた効果を奏するものである。な卦、本実施
例に卦いては、直線状の孔につき述べたが、焦点位置の
調節によりテーパ状の孔についても同様の加工ができる
Furthermore, since the focus is placed on the inside of the through hole, both the front and back surfaces can be processed at the same time, resulting in extremely high efficiency and other excellent effects. In addition, the device of the present invention converts the laser beam into an annular beam and then converges it with a converging lens, so the energy density is high both before and after the focal point, making it possible to process the annular beam sufficiently. This provides various excellent effects such as being able to easily adapt to the hole diameter of the workpiece by just adjusting it. Although this embodiment has been described with respect to a straight hole, similar processing can be performed on a tapered hole by adjusting the focal point position.

またバリ取りの場合につき述べたが、本発明は面取りそ
の他開口周縁部の加工でもよいことはいうまでもない。
Further, although the case of deburring has been described, it goes without saying that the present invention may also be applied to chamfering or other processing of the peripheral edge of the opening.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の要部断面正面図である。 第2図は第1図の要部拡大図である。第3図は上記実施
例の要部の一変形例を示す要部正面図である。1・・・
被加工物、2・・・貫通孔、3,4・・・開口周縁部、
12・・・加工台、13・・・レーザ発振装置、17・
・・レーザビーム、18・・・環状ビーム、19・・・
環状光束節機構、20・・・収束レンズ、21・・・位
置調節機構、45・・・焦点。
FIG. 1 is a sectional front view of essential parts of an embodiment of the present invention. FIG. 2 is an enlarged view of the main part of FIG. 1. FIG. 3 is a front view of a main part showing a modification of the main part of the above embodiment. 1...
Workpiece, 2... Through hole, 3, 4... Opening periphery,
12... Processing table, 13... Laser oscillation device, 17.
...Laser beam, 18...Annular beam, 19...
Annular light beam adjustment mechanism, 20... Converging lens, 21... Position adjustment mechanism, 45... Focal point.

Claims (1)

【特許請求の範囲】 1 被加工物に設けられた貫通孔内にレーザビームの焦
点を置き、上記貫通孔の両端開口周縁部を同時に加工す
ることを特徴とするレーザ加工方法。 2 レーザ発振装置と、上記レーザ発振装置から発振さ
れたレーザビームを環状ビームに変換するとともに上記
環状ビームの直径を調節する環状光束機構と、上記環状
ビームの光路上に設けられ上記環状ビームを収束する収
束レンズと、上記収束レンズからのレーザビームが透過
する貫通孔をもつた被加工物を支持する加工台と、上記
被加工物と上記収束レンズとの間隔を調節する焦点位置
調節機構とを具備することを特徴とするレーザ加工装置
[Scope of Claims] 1. A laser processing method, characterized in that a laser beam is focused within a through hole provided in a workpiece, and peripheral edges of openings at both ends of the through hole are simultaneously processed. 2 a laser oscillation device, an annular beam mechanism that converts the laser beam oscillated from the laser oscillation device into an annular beam and adjusts the diameter of the annular beam, and a device that is provided on the optical path of the annular beam and converges the annular beam. a processing table that supports a workpiece having a through hole through which a laser beam from the convergence lens passes; and a focal position adjustment mechanism that adjusts a distance between the workpiece and the convergence lens. A laser processing device comprising:
JP53008343A 1978-01-30 1978-01-30 Laser processing method and device Expired JPS5933075B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53008343A JPS5933075B2 (en) 1978-01-30 1978-01-30 Laser processing method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53008343A JPS5933075B2 (en) 1978-01-30 1978-01-30 Laser processing method and device

Publications (2)

Publication Number Publication Date
JPS54102691A JPS54102691A (en) 1979-08-13
JPS5933075B2 true JPS5933075B2 (en) 1984-08-13

Family

ID=11690557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53008343A Expired JPS5933075B2 (en) 1978-01-30 1978-01-30 Laser processing method and device

Country Status (1)

Country Link
JP (1) JPS5933075B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5699016A (en) * 1980-01-08 1981-08-10 Mitsubishi Heavy Ind Ltd Deburring method for electric resistance welded tube
DE3011244C2 (en) * 1980-03-24 1983-07-28 Walter 6000 Frankfurt Röder Laser cutting device for three-dimensional molded parts
AT378306B (en) * 1983-08-29 1985-07-25 Akg Akustische Kino Geraete USE OF A BUNDLED LASER BEAM FOR PRODUCING AN ACOUSTIC FRICTION RESISTOR FOR ELECTROACOUSTIC TRANSDUCERS
KR101102631B1 (en) * 2010-06-18 2012-01-04 한국전력공사 Cable Tray Device

Also Published As

Publication number Publication date
JPS54102691A (en) 1979-08-13

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