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JPS5922386A - 電子部品構造体 - Google Patents

電子部品構造体

Info

Publication number
JPS5922386A
JPS5922386A JP58123124A JP12312483A JPS5922386A JP S5922386 A JPS5922386 A JP S5922386A JP 58123124 A JP58123124 A JP 58123124A JP 12312483 A JP12312483 A JP 12312483A JP S5922386 A JPS5922386 A JP S5922386A
Authority
JP
Japan
Prior art keywords
contact
strip
conductors
component
contact portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58123124A
Other languages
English (en)
Japanese (ja)
Inventor
ルシアン・カミエル・デ・ブロウケレ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from BE2/59767A external-priority patent/BE893780A/nl
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Publication of JPS5922386A publication Critical patent/JPS5922386A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
JP58123124A 1982-07-07 1983-07-06 電子部品構造体 Pending JPS5922386A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE2/59767 1982-07-07
BE2/59767A BE893780A (nl) 1982-07-07 1982-07-07 Samenstel van elektronische componenten

Publications (1)

Publication Number Publication Date
JPS5922386A true JPS5922386A (ja) 1984-02-04

Family

ID=3865605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58123124A Pending JPS5922386A (ja) 1982-07-07 1983-07-06 電子部品構造体

Country Status (3)

Country Link
JP (1) JPS5922386A (es)
ES (1) ES273365Y (es)
GB (1) GB2124433B (es)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196994A (ja) * 1984-03-19 1985-10-05 日本電気株式会社 回路の接続方式
JPS63118262U (es) * 1987-01-23 1988-07-30
JPH0583071A (ja) * 1991-09-20 1993-04-02 Daishinku Co 表面実装型電子部品

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855872A (en) * 1987-08-13 1989-08-08 General Electric Company Leadless ceramic chip carrier printed wiring board adapter
US5023580A (en) * 1989-12-22 1991-06-11 Motorola, Inc. Surface-mount filter
US5400219A (en) * 1992-09-02 1995-03-21 Eastman Kodak Company Tape automated bonding for electrically connecting semiconductor chips to substrates
JPH0750762B2 (ja) * 1992-12-18 1995-05-31 山一電機株式会社 Ｉｃキャリア
US5494448A (en) * 1994-03-15 1996-02-27 Motorola, Inc. Cantilever spring and method for temporarily coupling a semiconductor device to a transmission line using the cantilever spring
JPH0823160A (ja) * 1994-05-06 1996-01-23 Seiko Epson Corp プリント配線板と電子部品の接続方法
DE19719235A1 (de) * 1997-05-07 1998-11-12 Bosch Gmbh Robert Verfahren zur Kontaktierung wenigstens einer Leiterplatte oder wenigstens eines Stanzgitters und wenigstens eines Hybrids
TW405129B (en) * 1997-12-19 2000-09-11 Koninkl Philips Electronics Nv Thin-film component
DE10307846A1 (de) * 2003-02-25 2004-09-02 Daimlerchrysler Ag Verfahren zum elektrischen Kontaktieren eines Bauteils mit einem Flachkabel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210075A (en) * 1975-07-07 1977-01-26 Nat Semiconductor Corp Tape of connecting ganggbonding for semiconductor devices and method of making the same
JPS52140271A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Device and manufacture for collection-type semiconductor
JPS54152468A (en) * 1978-05-22 1979-11-30 Hitachi Ltd Carrier tape for tape carrier

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614575A1 (de) * 1966-08-16 1970-05-27 Signetics Corp Aufbau einer integrierten Schaltung und Verfahren zum Herstellen dieses Aufbaues
GB1209901A (en) * 1967-01-11 1970-10-21 British Telecomm Res Ltd Improvements relating to the mounting of integrated circuit assemblies
US3691289A (en) * 1970-10-22 1972-09-12 Minnesota Mining & Mfg Packaging of semiconductor devices
NL164425C (nl) * 1971-02-05 1980-12-15 Philips Nv Halfgeleiderinrichting voorzien van een koellichaam.
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210075A (en) * 1975-07-07 1977-01-26 Nat Semiconductor Corp Tape of connecting ganggbonding for semiconductor devices and method of making the same
JPS52140271A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Device and manufacture for collection-type semiconductor
JPS54152468A (en) * 1978-05-22 1979-11-30 Hitachi Ltd Carrier tape for tape carrier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196994A (ja) * 1984-03-19 1985-10-05 日本電気株式会社 回路の接続方式
JPS63118262U (es) * 1987-01-23 1988-07-30
JPH0583071A (ja) * 1991-09-20 1993-04-02 Daishinku Co 表面実装型電子部品

Also Published As

Publication number Publication date
ES273365Y (es) 1984-09-01
GB8318318D0 (en) 1983-08-10
GB2124433A (en) 1984-02-15
GB2124433B (en) 1986-05-21
ES273365U (es) 1984-02-01

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