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ES273365U - Un ensamble de componente electronico - Google Patents

Un ensamble de componente electronico

Info

Publication number
ES273365U
ES273365U ES1983273365U ES273365U ES273365U ES 273365 U ES273365 U ES 273365U ES 1983273365 U ES1983273365 U ES 1983273365U ES 273365 U ES273365 U ES 273365U ES 273365 U ES273365 U ES 273365U
Authority
ES
Spain
Prior art keywords
component
electric conductor
electric
conductor pattern
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1983273365U
Other languages
English (en)
Other versions
ES273365Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from BE2/59767A external-priority patent/BE893780A/nl
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES273365U publication Critical patent/ES273365U/es
Application granted granted Critical
Publication of ES273365Y publication Critical patent/ES273365Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

1. Un ensamble de componente electrónico que incluye un primer componente sin hilos y tiene diversos terminales de contacto eléctrico y un segundo componente que porta una distribución de conductor eléctrico, siendo dicho primer componente montado en superficie sobre dicho segundo componente y estando dichos terminales de contacto conectados eléctricamente a dicha distribuición de conductor eléctrico, existiendo un elemento aislante intermedio para absorber los esfuerzos entre dichos componentes, caracterizado porque dicho elemento intermedio (3), está montado entre dichos terminales de contacto eléctrico (4) y dicha distribución de conductor eléctrico (6) y está constituido por una capa (8) de material aislante que porta conductores eléctricos dúctiles (9) que tienen porciones de contacto (10, 11) y que interconectan eléctricamente dichos terminales de contacto eléctrico (4) y dicha distribución de conductor eléctrico (6). 2. Un ensamble de componente electrónico, según la reivindicación 1, caracterizado porque dicha capa (8) está montada libremente entre dicho primero (1) y segundo (2) componentes. 3. Un ensamble de componentes electrónico, según la reivindicación 2, caracterizado porque en dichos conductos eléctricos (9) existen primeras porciones de contactos (10) en un lado de dicha capa (8), mientras que segundas porciones de contacto (11) de dichos conductores eléctricos (9) son accesibles desde ambos lados de dicha capa (8) a través de una abertura (12) en dicha capa (8). 4. Un ensamble de componente electrónico, según la reivindicacióin 3, caracterizado porque dichas segundas porciones de contact5o (11) se prolongan libremente en dicha abertura (12). 5. Un ensamble de componente electrónico, según la reivindicación 3, caracterizado porque dichas segundas porciones de contacto (11) están conectadas eléctricamente a dichos terminales de contacto (4) de dicho primer componente (1). 6. Un ensamble de componente electrónico, según la reivindicación 1, caracterizado porquedicho primer componente (2) es una tarjeta de circuito impreso. 7. Un ensamble de componente electrónico, según la reivindicación 1, caracterizado porque dicha capa intermedia (8) esta hecha de un meterial aislante flexible al que se fijan dichos conductores eléctricos (9) prácticamente a lo largo de toda su longitud. 8. Un ensamble de componente electrónico, según la reivindicación 1, caracterizado porque dicha capa intermedia (8) está solamente conectada a dichos conductores eléctricos (9) a lo largo de parte de su longitud. 9. Un ensamble de componente electrónico, según la reivindicación 1, caracterizado porque dichos conductores eléctricos (9), excepto dichas porciones de contacto (10, 11) de mismo, están aisladas. 10. Un ensamble de componente electrónico, según la reivindicación 3, caracterizado porque sobre dicha capa (8) dichas primeras porciones de contacto (10) están a unas primeras distancias entre sí, mientras que dichas segundas porciones de contacto (11) están a unas segudasdistancias entre sí siendo diferentes las primeras y las segundas distancias. 11. Un ensamble de componente electrónico, según la reivindicación 3, caracterizado porque sobre dicha capa (8) están situadas dichas segundas porciones de contacto (11) sobre los cuatro lados de dicha abertura (12) que es rectangular y se conectan a las primeras porciones de contacto (10) dispuestas en dos filas sobre cada uno de los lados opuestos de dicha abertura. 12. Un ensamble de componente electrónico, según la reivindicación 3, caracterizado porque dicha capa (8) tiene dos aberturas primera (12) y segunda (12¿) separadas, a través de las cuales se prolonga un primero (11) y un segundo (11¿) juegos de dichas segundas porciones de contacto (11, 11¿) respectivamente, estando eléctricamente conectados dicho primero (11) y segundo (11¿) juegos de porciones de contacto segundas (11, 11¿) a un primero (10) y un segundo (10¿) juegos de dichas porciones de contacto primeras (10, 10¿) situados adyacentes al segundo (11¿) y el primer (11) juego de las porciones de contacto segundas, respectivamente. 13. Un ensamble de componente electrónico.
ES1983273365U 1982-07-07 1983-07-07 Un ensamble de componente electronico Expired ES273365Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE2/59767A BE893780A (nl) 1982-07-07 1982-07-07 Samenstel van elektronische componenten

Publications (2)

Publication Number Publication Date
ES273365U true ES273365U (es) 1984-02-01
ES273365Y ES273365Y (es) 1984-09-01

Family

ID=3865605

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1983273365U Expired ES273365Y (es) 1982-07-07 1983-07-07 Un ensamble de componente electronico

Country Status (3)

Country Link
JP (1) JPS5922386A (es)
ES (1) ES273365Y (es)
GB (1) GB2124433B (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196994A (ja) * 1984-03-19 1985-10-05 日本電気株式会社 回路の接続方式
JPS63118262U (es) * 1987-01-23 1988-07-30
US4855872A (en) * 1987-08-13 1989-08-08 General Electric Company Leadless ceramic chip carrier printed wiring board adapter
US5023580A (en) * 1989-12-22 1991-06-11 Motorola, Inc. Surface-mount filter
JP2541046B2 (ja) * 1991-09-20 1996-10-09 株式会社大真空 表面実装型電子部品
US5400219A (en) * 1992-09-02 1995-03-21 Eastman Kodak Company Tape automated bonding for electrically connecting semiconductor chips to substrates
JPH0750762B2 (ja) * 1992-12-18 1995-05-31 山一電機株式会社 Ｉｃキャリア
US5494448A (en) * 1994-03-15 1996-02-27 Motorola, Inc. Cantilever spring and method for temporarily coupling a semiconductor device to a transmission line using the cantilever spring
JPH0823160A (ja) * 1994-05-06 1996-01-23 Seiko Epson Corp プリント配線板と電子部品の接続方法
DE19719235A1 (de) * 1997-05-07 1998-11-12 Bosch Gmbh Robert Verfahren zur Kontaktierung wenigstens einer Leiterplatte oder wenigstens eines Stanzgitters und wenigstens eines Hybrids
TW405129B (en) * 1997-12-19 2000-09-11 Koninkl Philips Electronics Nv Thin-film component
DE10307846A1 (de) * 2003-02-25 2004-09-02 Daimlerchrysler Ag Verfahren zum elektrischen Kontaktieren eines Bauteils mit einem Flachkabel

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614575A1 (de) * 1966-08-16 1970-05-27 Signetics Corp Aufbau einer integrierten Schaltung und Verfahren zum Herstellen dieses Aufbaues
GB1209901A (en) * 1967-01-11 1970-10-21 British Telecomm Res Ltd Improvements relating to the mounting of integrated circuit assemblies
US3691289A (en) * 1970-10-22 1972-09-12 Minnesota Mining & Mfg Packaging of semiconductor devices
NL164425C (nl) * 1971-02-05 1980-12-15 Philips Nv Halfgeleiderinrichting voorzien van een koellichaam.
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
US4063993A (en) * 1975-07-07 1977-12-20 National Semiconductor Corporation Method of making gang bonding interconnect tape for semiconductive devices
JPS52140271A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Device and manufacture for collection-type semiconductor
JPS54152468A (en) * 1978-05-22 1979-11-30 Hitachi Ltd Carrier tape for tape carrier

Also Published As

Publication number Publication date
ES273365Y (es) 1984-09-01
GB8318318D0 (en) 1983-08-10
GB2124433A (en) 1984-02-15
GB2124433B (en) 1986-05-21
JPS5922386A (ja) 1984-02-04

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