JPS59166957A - Photomask inspecting mark - Google Patents

Abstract

PURPOSE:To prevent a master mask from being generated in an erroneous state by forming an inspecting mark for displaying the surface and the rear side of a picture, the direction, and a discrimination of white or black of a pattern, on a picture area of one chip portion of a photomask. CONSTITUTION:An inspecting mark 11 for confirming a discrimination of the surface or the rear side of a picture, the direction on the plane, and a discrimination of white or black of a pattern for constituting the picture is formed on a chip area 12 on a photomask. As for the mark 11, that which is not symmetrical and not a point symmetry either is used, and in this case, a character of F is used. This mark 11 is formed simultaneously when a picture data is generated by a CAD, and when generating a master mask from a reticle, whether the state is correct or not can be confirmed by taking a glance at this mark 11. Therefore, it is prevented that the master mask is generated in an erroneous state.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides a process for manufacturing a photomask, in which the front and back of an image in a chip region on a photomask are determined, the orientation on a plane, and the pattern constituting the image are determined. This invention relates to a photomask inspection mark that indicates whether it is white or black.

[Technical background of the invention]

Generally, photomasks (
Master Mask and Hicopy Mask) C. They are manufactured through the following steps. In other words, CAD (Compute
(r Aided Design) to create image data, and use this data to create a 10x image (reticle) for one chip using a 4-turn generator or the like. This reticle is then used to reduce the size of the step and rebeat camera to
All master masks are created by arranging a large number of items in both the Y directions. Furthermore, this mask is duplicated to create a copy mask (working mask).

[Problems with background technology]

Conventionally, in the manufacturing process of the photomask, especially when creating a master mask from a reticle, it is necessary to distinguish between the front and back of an image for one chip, the plane orientation, and whether the t4 turn making up the image is white or black. It was difficult to confirm.

For this reason, there have been cases in which the front and back of an image for one chip have been reversed or set in an abnormal direction, and furthermore, for example, what should be a white pattern has been mistaken for a black part/f-turn. If such a situation occurs, the mask will be created with all of the plurality of chip regions not being normal.

Create a copy mask based on such a mask mask,
As a result, even if photolithography is performed, a normal pattern cannot be formed on the semiconductor wafer.

[Purpose of the invention]

This invention was made in view of the above circumstances, and its purpose is to provide a photomask inspection mark that can correctly form multiple chip areas in the photomask manufacturing process and improve manufacturing yield. be.

[Summary of the invention]

At the end of this prayer, both 1 chip worth of parts on the photomask
A photomask inspection mark is formed on the inside or outside of the g area to indicate the type of surface of the image and its orientation on a plane, as well as the white or black color of the turns that make up the image. .

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In the photomask manufacturing process, this invention uses inspection marks to confirm whether the image is front or back and the plane orientation in the chip area on the photomask, as well as whether the pattern constituting the image is white or black. It is something to do. As this inspection mark, one that is not bilaterally symmetrical or point symmetrical is used. For example, the letters of the alphabet are A, H, and I.

Any character other than M, O, S, T, U, V, W, X, Y, Z can be used as an inspection mark.
) to (h) show an example in which the letters PF''' are used as the inspection mark 11. Fig. 1 (a) shows an image (reticle) corresponding to one chip on the photomask. 1 (b) to (d) are front images, but the orientation on the plane is 900 mm. , 180°, 270°
This indicates a case that is different from the above and is not normal.

FIG. 1(e) shows a case where the orientation of the image is normal, but it is on the back side. Furthermore, FIGS. 1(f) to (h)
indicates a case where the image is backwards and the orientation on the plane is not normal.

The inspection mark 11 can be formed simultaneously when image data is created using CAD. This inspection mark 11 is formed in a white or black pattern depending on whether the pattern forming the image is white or black.

The position of the inspection mark 11 may be formed on the outside of the chip area 12 as shown in FIG. 2(a), or it may be formed on the inner side of the chip area 12 as shown in FIG. 2(b). It's okay. The shape, color, and orientation of this inspection mark 11 can be easily confirmed with a microscope when the reticle is created.

Therefore, by forming the inspection mark 11, it is possible to check whether the image on the reticle is front or back and whether the orientation on the plane is normal.
Furthermore, you can check at a glance the colors of the patterns that make up the image. Therefore, when repeating a reticle image, it is possible to prevent an accident in which a master mask is created in a state where the orientation of the image is not normal. Furthermore, even if a mask mask is created in an abnormal state and a copy mask is created, accidents such as accidental illumination can be prevented by checking the inspection mark 11 at that stage. .

FIG. 3(a) shows a mask 1 which is repeatedly formed when the inspection mark 11 is outside the chip area 12 as shown in FIG. 2(a). ) is the second
This figure shows a mask that is repeatedly formed when the inspection mark 11 is located inside the chip region 12 as shown in FIG. 3(b).

In the above embodiment, the inspection mark 11 is explained using letters of the alphabet, but the invention is not limited to this, and even other symbols etc. may be non-symmetrical and non-point symmetrical. Good to have.

[Effects of the Invention] As described above, according to the invention, it is possible to prevent accidents such as formation of multiple chip regions with incorrect orientations in the photomask manufacturing process, and improve the manufacturing yield of the product. can be done.

[Brief explanation of drawings]

FIGS. 1(a) to (h) are diagrams showing photomask inspection marks according to an embodiment of the present invention, and FIG. 2(a) is a diagram showing a photomask inspection mark according to an embodiment of the invention.
t (b) is a plan view showing a reticle with the above marks shaped like tl: (a), when the mark is outside the chip area, (b) is a plan view where the mark is outside the chip area. If it is inside 9+: Figure 3 (a), (
b) trJ: A plan view showing a mask, respectively.
2(a) shows the case when the reticle shown in FIG. 2(,) is used, and FIG. 2(b) shows the case when the reticle shown in FIG. 2(b) is used. 11... Inspection mark, 12... Chip area. Figure 1 (a) (b) (c) (d) (e)
(f) ((1) (h) Y Figure 2 Figure 3 (a) 2 - (b) 2

Claims (1)

[Claims] In the process of manufacturing a photomask, the image is provided inside or outside the image area of 1 differential on the photomask, and the front and back of the image, the orientation on the plane, and the white or black of the pattern constituting the image. A photomask inspection mark characterized by displaying the following.