JPS5887336U - Etching device - Google Patents
Etching deviceInfo
- Publication number
- JPS5887336U JPS5887336U JP18304881U JP18304881U JPS5887336U JP S5887336 U JPS5887336 U JP S5887336U JP 18304881 U JP18304881 U JP 18304881U JP 18304881 U JP18304881 U JP 18304881U JP S5887336 U JPS5887336 U JP S5887336U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- etching device
- etching
- etched
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の薄膜形成用の蝕刻装置を説明する為の
断面図、第２図は本考案の一実施例を説明する為の斜視
図、第３図ｉ第２図に示した本考案の一実施例を更に詳
細に説明する為の断面図である。
面図において、１１，１３，２３，３２・・・治具、１
２．３３．３７．３９・・・Ｏリング、１４・・・容器
、１５．２１．４１・・・蝕刻液、１６．３１・・・シ
リコンウェハ、１７・・・Ａｕパターン、２２・・・ガ
ラス還流器、２４．３８・・・円筒形突起、２５・・・
ヒータ、２６・・・通気筒、２７・・・冷却管、２８・
・・冷却水の導入口、２９・・・冷却水の導出口、３４
．４０−押え具、３５・・・メネジ、３６・・・結合子
。Fig. 1 is a sectional view for explaining a conventional etching device for forming thin films, Fig. 2 is a perspective view for explaining an embodiment of the present invention, Fig. 3i is a book shown in Fig. 2; FIG. 2 is a sectional view for explaining one embodiment of the invention in more detail. In the plan view, 11, 13, 23, 32... jig, 1
2.33.37.39...O ring, 14...container, 15.21.41...etching liquid, 16.31...silicon wafer, 17...Au pattern, 22... Glass reflux device, 24.38...Cylindrical projection, 25...
Heater, 26... Ventilation pipe, 27... Cooling pipe, 28.
...Cooling water inlet, 29...Cooling water outlet, 34
．． 40-presser, 35...female screw, 36...connector.
Claims (1)
この開口部を通して被蝕刻物の一主面側のみが前記蝕刻
液にさらされるように、前記被蝕刻物を前記第１の治具
に固定するための第２の治具を設けたことを特徴とする
蝕刻装置。An opening is provided in the first jig for filling the inside with the etching solution,
A second jig is provided for fixing the object to be etched to the first jig so that only one main surface side of the object to be etched is exposed to the etching liquid through the opening. An etching device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18304881U JPS5887336U (en) | 1981-12-09 | 1981-12-09 | Etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18304881U JPS5887336U (en) | 1981-12-09 | 1981-12-09 | Etching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5887336U true JPS5887336U (en) | 1983-06-14 |
| JPS642439Y2 JPS642439Y2 (en) | 1989-01-20 |
Family
ID=29981963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18304881U Granted JPS5887336U (en) | 1981-12-09 | 1981-12-09 | Etching device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5887336U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5970336U (en) * | 1982-10-30 | 1984-05-12 | 日本電信電話株式会社 | Etching device |
| JPS6482654A (en) * | 1987-09-25 | 1989-03-28 | Toshiba Corp | Manufacture of semiconductor device and equipment therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5227368A (en) * | 1975-08-27 | 1977-03-01 | Hitachi Ltd | Selection etching method |
| JPS533922U (en) * | 1976-06-28 | 1978-01-14 | ||
| JPS54152661U (en) * | 1978-04-14 | 1979-10-24 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833408A (en) * | 1972-04-19 | 1974-09-03 | Rca Corp | Video discs having a methyl alkyl silicone coating |
-
1981
- 1981-12-09 JP JP18304881U patent/JPS5887336U/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5227368A (en) * | 1975-08-27 | 1977-03-01 | Hitachi Ltd | Selection etching method |
| JPS533922U (en) * | 1976-06-28 | 1978-01-14 | ||
| JPS54152661U (en) * | 1978-04-14 | 1979-10-24 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5970336U (en) * | 1982-10-30 | 1984-05-12 | 日本電信電話株式会社 | Etching device |
| JPS6482654A (en) * | 1987-09-25 | 1989-03-28 | Toshiba Corp | Manufacture of semiconductor device and equipment therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS642439Y2 (en) | 1989-01-20 |
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