JPS58175668U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58175668U JPS58175668U JP7405182U JP7405182U JPS58175668U JP S58175668 U JPS58175668 U JP S58175668U JP 7405182 U JP7405182 U JP 7405182U JP 7405182 U JP7405182 U JP 7405182U JP S58175668 U JPS58175668 U JP S58175668U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- copper foil
- shaped
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の印刷配線板を示し、ａは上面図、ｂは側
面図、第２図は本考案の一実施例の印刷配線板を示し、
ａは上面図、ｂは側面図である。
１．２・・・・・・銅箔、３・・・・・・チップ状回路
素子、４・・・・・・柱状の銅箔、５・・・・・・接着
剤、６・・・・・・基板、９・・・・・・枠状の銅箔。FIG. 1 shows a conventional printed wiring board, a is a top view, b is a side view, and FIG. 2 is a printed wiring board according to an embodiment of the present invention.
A is a top view, and b is a side view. 1.2... Copper foil, 3... Chip-shaped circuit element, 4... Column-shaped copper foil, 5... Adhesive, 6... ...Substrate, 9...Frame-shaped copper foil.
Claims (1)
防止するための枠状の銅箔を設けたことを特徴とする印
刷配線板。 −′A printed wiring board characterized in that a frame-shaped copper foil is provided to prevent spread of an adhesive for bonding a chip-shaped circuit element onto a substrate. −′
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405182U JPS58175668U (en) | 1982-05-19 | 1982-05-19 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405182U JPS58175668U (en) | 1982-05-19 | 1982-05-19 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58175668U true JPS58175668U (en) | 1983-11-24 |
Family
ID=30083515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7405182U Pending JPS58175668U (en) | 1982-05-19 | 1982-05-19 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175668U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11818840B2 (en) | 2019-03-25 | 2023-11-14 | Mitsubishi Electric Corporation | Printed wiring board and electronic device |
-
1982
- 1982-05-19 JP JP7405182U patent/JPS58175668U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11818840B2 (en) | 2019-03-25 | 2023-11-14 | Mitsubishi Electric Corporation | Printed wiring board and electronic device |
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