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JPS575857A - Electroless indium-plating solution - Google Patents

Electroless indium-plating solution

Info

Publication number
JPS575857A
JPS575857A JP8068880A JP8068880A JPS575857A JP S575857 A JPS575857 A JP S575857A JP 8068880 A JP8068880 A JP 8068880A JP 8068880 A JP8068880 A JP 8068880A JP S575857 A JPS575857 A JP S575857A
Authority
JP
Japan
Prior art keywords
plating solution
electroless
assuredly
borohydride
triethanolamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8068880A
Other languages
Japanese (ja)
Inventor
Haruyoshi Nishikawa
Shinichi Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP8068880A priority Critical patent/JPS575857A/en
Publication of JPS575857A publication Critical patent/JPS575857A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE: To offer an electroless indium-plating solution which can electrolessly form a uniform In film onto a substrate having a complex shape within a short period, by using the plating solution containing In, a borohydride, ethylenediamine tetracetic acid (or its salt) and triethanolamine as main components.
CONSTITUTION: The electroless In-plating solution contains an In(III) compound, e.g. In2(SO4)3.9H2O or the like, a borohydride as a reducing agent, 2W3mol ratio of ethylenediamine tetracetic acid (or its salt) as the first complexing agent to In and 3W6mol ratio of triethanolamine as the second complexing agent to In. The plating solution is adjusted at pH about 9W11. The plating solution assuredly reduces In, and assuredly retains and deposits In ion without harming the plating reaction of In. Consequently, it is possible to form a uniform silver-while In-plated layer within a short period, even onto an article having a complex shape such as a printed circuit board or the like, or an electric unconductive article such as plastics or the like.
COPYRIGHT: (C)1982,JPO&Japio
JP8068880A 1980-06-14 1980-06-14 Electroless indium-plating solution Pending JPS575857A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8068880A JPS575857A (en) 1980-06-14 1980-06-14 Electroless indium-plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8068880A JPS575857A (en) 1980-06-14 1980-06-14 Electroless indium-plating solution

Publications (1)

Publication Number Publication Date
JPS575857A true JPS575857A (en) 1982-01-12

Family

ID=13725269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8068880A Pending JPS575857A (en) 1980-06-14 1980-06-14 Electroless indium-plating solution

Country Status (1)

Country Link
JP (1) JPS575857A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102082274A (en) * 2010-12-09 2011-06-01 襄樊学院 Surface treatment process of battery current collector
US8460533B2 (en) 2006-12-15 2013-06-11 Rohm And Haas Electronic Materials Llc Indium compositions
US8491773B2 (en) 2008-04-22 2013-07-23 Rohm And Haas Electronic Materials Llc Method of replenishing indium ions in indium electroplating compositions
JP7169020B1 (en) * 2021-12-27 2022-11-10 石原ケミカル株式会社 Reduction type electroless indium plating bath

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8460533B2 (en) 2006-12-15 2013-06-11 Rohm And Haas Electronic Materials Llc Indium compositions
US9206519B2 (en) 2006-12-15 2015-12-08 Rohm And Haas Electronic Materials Llc Indium compositions
US8491773B2 (en) 2008-04-22 2013-07-23 Rohm And Haas Electronic Materials Llc Method of replenishing indium ions in indium electroplating compositions
CN102082274A (en) * 2010-12-09 2011-06-01 襄樊学院 Surface treatment process of battery current collector
JP7169020B1 (en) * 2021-12-27 2022-11-10 石原ケミカル株式会社 Reduction type electroless indium plating bath

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