GB956922A - Chemical gold plating - Google Patents
Chemical gold platingInfo
- Publication number
- GB956922A GB956922A GB29612/62A GB2961262A GB956922A GB 956922 A GB956922 A GB 956922A GB 29612/62 A GB29612/62 A GB 29612/62A GB 2961262 A GB2961262 A GB 2961262A GB 956922 A GB956922 A GB 956922A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solution
- palladium
- gold
- salt
- soluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
In an electroless gold plating process the plating solution comprises an aqueous solution containing 0.5-30 g/l. of a soluble gold cyanide such as alkali gold cyanide and 0.01-30 g/l. of a soluble palladous salt. Suitable soluble palladium salts are palladium "p" salt (NH3)2Pd(NO2)2, disodium palladium tetrachloride Na2PdCl4, palladous chloride and sulphate. The solution may also contain up to 300 g/l. of an alkali salt of a weak acid and up to 100 g/l. of a weak acid such as phosphonic acid, acetic, propionic, kojic, maleic, tartaric, citric and ethylenediaminetetraacetic (E.D.T.A.) acids as complexing agents. The pH of the solution is maintained at 8-11 by addition of ammonium hydroxide. The gold may be deposited on copper or brass or a printed plastic board with copper circuit elements which has been etched in cuprous chloride, treated in 50% HCl, sensitized in stannous chloride and then catalyzed in PdCl2 solution. The palladium ions may be supplied to the solution by first applying the palladium to the substrate which is then immersed in a gold solution.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US134106A US3396042A (en) | 1961-08-28 | 1961-08-28 | Chemical gold plating composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB956922A true GB956922A (en) | 1964-04-29 |
Family
ID=22461795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB29612/62A Expired GB956922A (en) | 1961-08-28 | 1962-08-01 | Chemical gold plating |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3396042A (en) |
| CH (1) | CH405868A (en) |
| DE (1) | DE1446259B2 (en) |
| GB (1) | GB956922A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3468676A (en) * | 1963-09-09 | 1969-09-23 | Photocircuits Corp | Electroless gold plating |
| US3607352A (en) * | 1968-11-29 | 1971-09-21 | Enthone | Electroless metal plating |
| US3993808A (en) * | 1971-08-13 | 1976-11-23 | Hitachi, Ltd. | Method for electroless plating gold directly on tungsten or molybdenum |
| US3862850A (en) * | 1973-06-08 | 1975-01-28 | Ceramic Systems | Electroless gold plating on refractory metals |
| US4091128A (en) * | 1976-10-08 | 1978-05-23 | Ppg Industries, Inc. | Electroless gold plating bath |
| US4340451A (en) * | 1979-12-17 | 1982-07-20 | Bell Telephone Laboratories, Incorporated | Method of replenishing gold/in plating baths |
| US4550036A (en) * | 1984-10-18 | 1985-10-29 | Hughes Aircraft Company | Electroless silver plating process and system |
| US5178918A (en) * | 1986-07-14 | 1993-01-12 | Robert Duva | Electroless plating process |
| US4863766A (en) * | 1986-09-02 | 1989-09-05 | General Electric Company | Electroless gold plating composition and method for plating |
| US4832743A (en) * | 1986-12-19 | 1989-05-23 | Lamerie, N.V. | Gold plating solutions, creams and baths |
| US6086946A (en) * | 1996-08-08 | 2000-07-11 | International Business Machines Corporation | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2719821A (en) * | 1951-07-19 | 1955-10-04 | Charles R Campana | Gold alloy plating bath |
-
1961
- 1961-08-28 US US134106A patent/US3396042A/en not_active Expired - Lifetime
-
1962
- 1962-08-01 GB GB29612/62A patent/GB956922A/en not_active Expired
- 1962-08-07 CH CH940562A patent/CH405868A/en unknown
- 1962-08-28 DE DE19621446259 patent/DE1446259B2/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3396042A (en) | 1968-08-06 |
| DE1446259B2 (en) | 1970-12-17 |
| DE1446259A1 (en) | 1968-11-14 |
| CH405868A (en) | 1966-01-15 |
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