JPS5727090A - Manufacture of semiconductor light emitting device - Google Patents
Manufacture of semiconductor light emitting deviceInfo
- Publication number
- JPS5727090A JPS5727090A JP10224680A JP10224680A JPS5727090A JP S5727090 A JPS5727090 A JP S5727090A JP 10224680 A JP10224680 A JP 10224680A JP 10224680 A JP10224680 A JP 10224680A JP S5727090 A JPS5727090 A JP S5727090A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- region
- emitting device
- phs
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To obtain long life in the semiconductor light emitting device having a PHS (plated heat sink) structure, by alleviating the generation of the stress in the boundary part of the PHS region and the non-PHS region. CONSTITUTION:In the case the end-surface radiating type semiconductor light emitting device, wherein a thick-film electrode having excellent heat conductivity, is provided on the surface adjacent to the light emitting region, a first metal layer 14 which is to become an ohmic electrode is formed on the surface adjacent to the light emitting region in a semiconductor wafer 1, wherein a pluarlity of light emitting element are formed. Then a second metal layer 16 which is thicker than said first metal layer 14 is formed. Third metal layers 171-172, which have excellent heat conductivity and are separated for each element region, are formed on the layer 16. Thereafter, cleavage is performed and the light emitting elements are separated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10224680A JPS5727090A (en) | 1980-07-25 | 1980-07-25 | Manufacture of semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10224680A JPS5727090A (en) | 1980-07-25 | 1980-07-25 | Manufacture of semiconductor light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5727090A true JPS5727090A (en) | 1982-02-13 |
Family
ID=14322246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10224680A Pending JPS5727090A (en) | 1980-07-25 | 1980-07-25 | Manufacture of semiconductor light emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5727090A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5608749A (en) * | 1992-09-16 | 1997-03-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor laser diode and semiconductor laser diode array including plated heat sink (PHS) electrode |
JP2007258640A (en) * | 2006-03-27 | 2007-10-04 | Victor Co Of Japan Ltd | Semiconductor element and its manufacturing method |
-
1980
- 1980-07-25 JP JP10224680A patent/JPS5727090A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5608749A (en) * | 1992-09-16 | 1997-03-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor laser diode and semiconductor laser diode array including plated heat sink (PHS) electrode |
JP2007258640A (en) * | 2006-03-27 | 2007-10-04 | Victor Co Of Japan Ltd | Semiconductor element and its manufacturing method |
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