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JPS5722570A - Automatic handling tool for parts - Google Patents

Automatic handling tool for parts

Info

Publication number
JPS5722570A
JPS5722570A JP9038480A JP9038480A JPS5722570A JP S5722570 A JPS5722570 A JP S5722570A JP 9038480 A JP9038480 A JP 9038480A JP 9038480 A JP9038480 A JP 9038480A JP S5722570 A JPS5722570 A JP S5722570A
Authority
JP
Japan
Prior art keywords
ics
characteristic inspection
components
trays
selection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9038480A
Other languages
English (en)
Inventor
Kenji Takatsuka
Seiichi Iwasaki
Kyohei Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9038480A priority Critical patent/JPS5722570A/ja
Publication of JPS5722570A publication Critical patent/JPS5722570A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP9038480A 1980-07-02 1980-07-02 Automatic handling tool for parts Pending JPS5722570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9038480A JPS5722570A (en) 1980-07-02 1980-07-02 Automatic handling tool for parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9038480A JPS5722570A (en) 1980-07-02 1980-07-02 Automatic handling tool for parts

Publications (1)

Publication Number Publication Date
JPS5722570A true JPS5722570A (en) 1982-02-05

Family

ID=13997071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9038480A Pending JPS5722570A (en) 1980-07-02 1980-07-02 Automatic handling tool for parts

Country Status (1)

Country Link
JP (1) JPS5722570A (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114817U (ja) * 1983-01-24 1984-08-03 三洋電機株式会社 ジユ−サ
JPS6080237A (ja) * 1983-10-07 1985-05-08 Mitsutoyo Mfg Co Ltd パツケ−ジ型回路素子の自動検査装置
JPS60207790A (ja) * 1984-03-28 1985-10-19 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション ロボツトア−ムによる試験選別装置
EP0166448A2 (en) * 1984-06-29 1986-01-02 Advantest Corporation IC test equipment
JPS61139768A (ja) * 1984-12-12 1986-06-27 Matsushita Electric Ind Co Ltd 電子部品の検査方法
US4686468A (en) * 1984-12-10 1987-08-11 Aseco Corporation Contact set for test apparatus for testing integrated circuit package
US4908126A (en) * 1986-11-11 1990-03-13 Multitest, Elektronische Systeme Gmbh Apparatus for testing and sorting electronic components, in particular IC's
US5125503A (en) * 1989-04-17 1992-06-30 Ekkehard Ueberreiter Apparatus for testing electronic components having a loading station a testing station and an unloading station for the components
WO1995028737A1 (en) * 1994-04-18 1995-10-26 Micron Technology, Inc. Method and apparatus for automatically positioning electronic die within component packages
WO2005053015A1 (ja) * 2003-11-26 2005-06-09 Hirata Corporation ワークハンドリング装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114817U (ja) * 1983-01-24 1984-08-03 三洋電機株式会社 ジユ−サ
JPS6326094Y2 (ja) * 1983-01-24 1988-07-15
JPS6080237A (ja) * 1983-10-07 1985-05-08 Mitsutoyo Mfg Co Ltd パツケ−ジ型回路素子の自動検査装置
JPS60207790A (ja) * 1984-03-28 1985-10-19 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション ロボツトア−ムによる試験選別装置
JPH0450156B2 (ja) * 1984-03-28 1992-08-13 Intaanashonaru Bijinesu Mashiinzu Corp
US4715501A (en) * 1984-06-29 1987-12-29 Takeda Riken Co., Ltd. IC test equipment
EP0166448A2 (en) * 1984-06-29 1986-01-02 Advantest Corporation IC test equipment
US4686468A (en) * 1984-12-10 1987-08-11 Aseco Corporation Contact set for test apparatus for testing integrated circuit package
JPS61139768A (ja) * 1984-12-12 1986-06-27 Matsushita Electric Ind Co Ltd 電子部品の検査方法
US4908126A (en) * 1986-11-11 1990-03-13 Multitest, Elektronische Systeme Gmbh Apparatus for testing and sorting electronic components, in particular IC's
US5125503A (en) * 1989-04-17 1992-06-30 Ekkehard Ueberreiter Apparatus for testing electronic components having a loading station a testing station and an unloading station for the components
WO1995028737A1 (en) * 1994-04-18 1995-10-26 Micron Technology, Inc. Method and apparatus for automatically positioning electronic die within component packages
EP1251550A1 (en) * 1994-04-18 2002-10-23 Micron Technology, Inc. Method and apparatus for automatically positioning electronic die within component packages
WO2005053015A1 (ja) * 2003-11-26 2005-06-09 Hirata Corporation ワークハンドリング装置

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