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JPS57187325A - Production of epoxy resin laminated sheet - Google Patents

Production of epoxy resin laminated sheet

Info

Publication number
JPS57187325A
JPS57187325A JP7368581A JP7368581A JPS57187325A JP S57187325 A JPS57187325 A JP S57187325A JP 7368581 A JP7368581 A JP 7368581A JP 7368581 A JP7368581 A JP 7368581A JP S57187325 A JPS57187325 A JP S57187325A
Authority
JP
Japan
Prior art keywords
laminated
resin
epoxy resin
laminated sheet
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7368581A
Other languages
Japanese (ja)
Inventor
Yuji Shimamoto
Yoshikazu Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP7368581A priority Critical patent/JPS57187325A/en
Publication of JPS57187325A publication Critical patent/JPS57187325A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To produce the titled laminated sheet having high hardness at high temperatures and good adhesion to copper foil, by laminating prepregs prepared by impregnating substrates with a resin composition for laminated sheets, consisting of specified two types of epoxy resins and a curing agent and molding the laminated prepregs under heating.
CONSTITUTION: A resin for laminated sheets is prepared by mixing a mixture of tetraglycidoxytetraphenylethane (formulaI) and a bisphenol A type epoxy resin, epoxy equivalent 250W500, (formula II) with dicyandiamide as a curing agent. Then, substrates such as glass cloth are impregnated with the above-produced resin, and a suitale number of the impregnated substrates are laminated and molded under heating to form an epoxy resin laminated sheet.
COPYRIGHT: (C)1982,JPO&Japio
JP7368581A 1981-05-15 1981-05-15 Production of epoxy resin laminated sheet Pending JPS57187325A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7368581A JPS57187325A (en) 1981-05-15 1981-05-15 Production of epoxy resin laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7368581A JPS57187325A (en) 1981-05-15 1981-05-15 Production of epoxy resin laminated sheet

Publications (1)

Publication Number Publication Date
JPS57187325A true JPS57187325A (en) 1982-11-18

Family

ID=13525309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7368581A Pending JPS57187325A (en) 1981-05-15 1981-05-15 Production of epoxy resin laminated sheet

Country Status (1)

Country Link
JP (1) JPS57187325A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166825A (en) * 1985-01-18 1986-07-28 Matsushita Electric Ind Co Ltd Epoxy resin composition
JPS6310618A (en) * 1986-06-30 1988-01-18 Mitsubishi Rayon Co Ltd Epoxy resin composition
JPS6356581A (en) * 1986-08-27 1988-03-11 Mitsubishi Petrochem Co Ltd Adhesive composition for foil stamping
WO2014092019A1 (en) * 2012-12-12 2014-06-19 株式会社ニコン Composition, laminate, method for producing laminate, transistor, and method for producing transistor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166825A (en) * 1985-01-18 1986-07-28 Matsushita Electric Ind Co Ltd Epoxy resin composition
JPS6310618A (en) * 1986-06-30 1988-01-18 Mitsubishi Rayon Co Ltd Epoxy resin composition
JPS6356581A (en) * 1986-08-27 1988-03-11 Mitsubishi Petrochem Co Ltd Adhesive composition for foil stamping
WO2014092019A1 (en) * 2012-12-12 2014-06-19 株式会社ニコン Composition, laminate, method for producing laminate, transistor, and method for producing transistor

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