JPS57185350A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS57185350A JPS57185350A JP7038181A JP7038181A JPS57185350A JP S57185350 A JPS57185350 A JP S57185350A JP 7038181 A JP7038181 A JP 7038181A JP 7038181 A JP7038181 A JP 7038181A JP S57185350 A JPS57185350 A JP S57185350A
- Authority
- JP
- Japan
- Prior art keywords
- polyfunctional
- reinforcing material
- polyphenylene ether
- unsaturated double
- ether resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: The titled composition having improved heat resistance and solvent resistance, obtained by reacting preliminarily a thermo-plastic polymer of a compound containing an olefinic unsaturated double bond with a polyfunctional maleimide and a polyphenylene ether resin in the presence of a radical polymerization initiator.
CONSTITUTION: For example, (A) a polymerization catalyst is eliminated from a reaction solution of a polyphenylene ether resin, and it is reacted with (B) a thermoplastic (co)polymer of a compound containing one or more olefinic unsaturated double bonds in the molecule, (C) a polyfunctional maleimide and/or polyfunctional cyanic ester shown by the formula (R4 is aromatic or aliphatic polyfunctional organic group; X1 and X2 are H, halogen, or lower alkyl; K is integer of 2W10), and (D) a radical polymerization initiator, to give the desired composition.
EFFECT: Production processes can be simplified.
USE: A powdery reinforcing material, filler, fibrous reinforcing material, coating compound etc.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038181A JPS57185350A (en) | 1981-05-11 | 1981-05-11 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038181A JPS57185350A (en) | 1981-05-11 | 1981-05-11 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57185350A true JPS57185350A (en) | 1982-11-15 |
| JPH0153298B2 JPH0153298B2 (en) | 1989-11-13 |
Family
ID=13429801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7038181A Granted JPS57185350A (en) | 1981-05-11 | 1981-05-11 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57185350A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287959A (en) * | 1985-06-15 | 1986-12-18 | Matsushita Electric Works Ltd | Production of cured polyphenylene oxide article |
| JPH01158039A (en) * | 1987-04-27 | 1989-06-21 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
| US5929168A (en) * | 1994-05-19 | 1999-07-27 | Optatech, Corporation | Polyphenylene ether blends and a process for the preparation thereof |
| US6492030B1 (en) | 1999-02-03 | 2002-12-10 | Tomoegawa Paper Co., Ltd. | Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same |
| JP2007302877A (en) * | 2006-04-14 | 2007-11-22 | Hitachi Chem Co Ltd | Thermosetting resin composition of ipn type composite, and varnish, prepreg and metal-clad laminate using the same |
| JP2007302876A (en) * | 2006-04-13 | 2007-11-22 | Hitachi Chem Co Ltd | Resin composition of semi-ipn type composite and varnish, prepreg and metal-clad laminate each using the same composition |
| JP2008095061A (en) * | 2006-02-17 | 2008-04-24 | Hitachi Chem Co Ltd | Thermosetting resin composition of semi-ipn-type compound material, and varnish, prepreg and metal-clad laminate board using the same |
| JP2008133414A (en) * | 2006-10-24 | 2008-06-12 | Hitachi Chem Co Ltd | New semi-ipn type composite material-containing thermosetting resin composition and varnish, prepreg and metal clad laminate using the same |
| JP2008291214A (en) * | 2007-04-25 | 2008-12-04 | Hitachi Chem Co Ltd | Method for producing resin varnish containing thermosetting resin of semi-ipn-type compound material, resin varnish for printed wiring board, prepreg, and metal-clad laminated board |
| US8501870B2 (en) | 2006-02-17 | 2013-08-06 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| WO2016138760A1 (en) * | 2015-03-04 | 2016-09-09 | 广东生益科技股份有限公司 | Resin composition and pre-preg and laminate using the composition |
| WO2016138759A1 (en) * | 2015-03-05 | 2016-09-09 | 广东生益科技股份有限公司 | Resin composition and pre-preg and laminate using the composition |
| WO2019230943A1 (en) * | 2018-06-01 | 2019-12-05 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-tightened laminated sheet, resin sheet, and printed wiring board |
-
1981
- 1981-05-11 JP JP7038181A patent/JPS57185350A/en active Granted
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0562149B2 (en) * | 1985-06-15 | 1993-09-07 | Matsushita Electric Works Ltd | |
| JPS61287959A (en) * | 1985-06-15 | 1986-12-18 | Matsushita Electric Works Ltd | Production of cured polyphenylene oxide article |
| JPH01158039A (en) * | 1987-04-27 | 1989-06-21 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
| US5929168A (en) * | 1994-05-19 | 1999-07-27 | Optatech, Corporation | Polyphenylene ether blends and a process for the preparation thereof |
| US6492030B1 (en) | 1999-02-03 | 2002-12-10 | Tomoegawa Paper Co., Ltd. | Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same |
| US8501870B2 (en) | 2006-02-17 | 2013-08-06 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| JP2008095061A (en) * | 2006-02-17 | 2008-04-24 | Hitachi Chem Co Ltd | Thermosetting resin composition of semi-ipn-type compound material, and varnish, prepreg and metal-clad laminate board using the same |
| US8568891B2 (en) | 2006-02-17 | 2013-10-29 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| JP2007302876A (en) * | 2006-04-13 | 2007-11-22 | Hitachi Chem Co Ltd | Resin composition of semi-ipn type composite and varnish, prepreg and metal-clad laminate each using the same composition |
| JP2007302877A (en) * | 2006-04-14 | 2007-11-22 | Hitachi Chem Co Ltd | Thermosetting resin composition of ipn type composite, and varnish, prepreg and metal-clad laminate using the same |
| JP2008133414A (en) * | 2006-10-24 | 2008-06-12 | Hitachi Chem Co Ltd | New semi-ipn type composite material-containing thermosetting resin composition and varnish, prepreg and metal clad laminate using the same |
| JP2008291214A (en) * | 2007-04-25 | 2008-12-04 | Hitachi Chem Co Ltd | Method for producing resin varnish containing thermosetting resin of semi-ipn-type compound material, resin varnish for printed wiring board, prepreg, and metal-clad laminated board |
| WO2016138760A1 (en) * | 2015-03-04 | 2016-09-09 | 广东生益科技股份有限公司 | Resin composition and pre-preg and laminate using the composition |
| US10858514B2 (en) | 2015-03-04 | 2020-12-08 | Shengyi Technology Co., Ltd. | Resin composition and pre-preg and laminate using the composition |
| WO2016138759A1 (en) * | 2015-03-05 | 2016-09-09 | 广东生益科技股份有限公司 | Resin composition and pre-preg and laminate using the composition |
| US10584222B2 (en) | 2015-03-05 | 2020-03-10 | Shengyi Technology Co., Ltd. | Resin composition and pre-preg and laminate using the composition |
| WO2019230943A1 (en) * | 2018-06-01 | 2019-12-05 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-tightened laminated sheet, resin sheet, and printed wiring board |
| JP6669320B1 (en) * | 2018-06-01 | 2020-03-18 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0153298B2 (en) | 1989-11-13 |
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