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JPS57184244A - Metallic member for electronic parts - Google Patents

Metallic member for electronic parts

Info

Publication number
JPS57184244A
JPS57184244A JP6981381A JP6981381A JPS57184244A JP S57184244 A JPS57184244 A JP S57184244A JP 6981381 A JP6981381 A JP 6981381A JP 6981381 A JP6981381 A JP 6981381A JP S57184244 A JPS57184244 A JP S57184244A
Authority
JP
Japan
Prior art keywords
plated
silver
plated layer
layer
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6981381A
Other languages
Japanese (ja)
Other versions
JPS6344299B2 (en
Inventor
Akihiko Murata
Shinichi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP6981381A priority Critical patent/JPS57184244A/en
Publication of JPS57184244A publication Critical patent/JPS57184244A/en
Publication of JPS6344299B2 publication Critical patent/JPS6344299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve corrosion resistance, heat-resisting property, etc. by plating the surface of a metallic body forming a lead frame and an external connecting terminal with silver and containing at least one substance among selenium, antimony, copper, etc. into a silver plated layer. CONSTITUTION:The metallic body 11 to be plated is immersed in a cupric cyanide bath at the temperature of 50 deg.C and the surface of the metallic base body 11 to be plated is plated with copper 12 in approximately 0.3mum tickness, and the metallic base body to be plated is immersed in a silver cyanided strike bath at the temperature of 25 deg.C and a silver strike plated layer 13 with approx- imately 0.2mum thickness is formed onto the copper plated layer 12. The metallic base body to be plated is further immersed in a silver cyanide bath containing selenium at the temperature of 25 deg.C, a silver plated layer 14 containing selenium with 2.0mum thickness is formed onto the strike plated layer 13, and a silver plated layer 15 with 1.0mum thickness is shaped onto the layer 14. Corrosion resistance, heat-resisting property and electrical conduction property are improved while solder wetting property is also ameliorated.
JP6981381A 1981-05-08 1981-05-08 Metallic member for electronic parts Granted JPS57184244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6981381A JPS57184244A (en) 1981-05-08 1981-05-08 Metallic member for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6981381A JPS57184244A (en) 1981-05-08 1981-05-08 Metallic member for electronic parts

Publications (2)

Publication Number Publication Date
JPS57184244A true JPS57184244A (en) 1982-11-12
JPS6344299B2 JPS6344299B2 (en) 1988-09-05

Family

ID=13413568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6981381A Granted JPS57184244A (en) 1981-05-08 1981-05-08 Metallic member for electronic parts

Country Status (1)

Country Link
JP (1) JPS57184244A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199166A (en) * 2009-02-24 2010-09-09 Panasonic Corp Lead frame for optical semiconductor apparatus, and method of manufacturing the same
US11011476B2 (en) 2018-03-12 2021-05-18 Stmicroelectronics International N.V. Lead frame surface finishing
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199166A (en) * 2009-02-24 2010-09-09 Panasonic Corp Lead frame for optical semiconductor apparatus, and method of manufacturing the same
US11011476B2 (en) 2018-03-12 2021-05-18 Stmicroelectronics International N.V. Lead frame surface finishing
US11756899B2 (en) 2018-03-12 2023-09-12 Stmicroelectronics S.R.L. Lead frame surface finishing
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Also Published As

Publication number Publication date
JPS6344299B2 (en) 1988-09-05

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