JPS57117542A - Molded article of expandable resin - Google Patents
Molded article of expandable resinInfo
- Publication number
- JPS57117542A JPS57117542A JP443281A JP443281A JPS57117542A JP S57117542 A JPS57117542 A JP S57117542A JP 443281 A JP443281 A JP 443281A JP 443281 A JP443281 A JP 443281A JP S57117542 A JPS57117542 A JP S57117542A
- Authority
- JP
- Japan
- Prior art keywords
- amount
- component
- equivalent
- room temperature
- molded article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: The titled molded article useful for heat insulation, sealing, fixing electrical parts, etc., having functions such as keeping warm, sound insulation, weight saving, etc., obtained by blending an expandable epoxy resin composition containing a blowing agent wint a specific thermoplastic resin, followed by molding it into various kinds of shapes.
CONSTITUTION: (A) an epoxy resin having preferably ≥35 equivalent/kg epoxide, liquid or semisolid at room temperature, is blended with (B) a high-molecular- weight thermoplastic resin having a molecular weight of ≥10,000, consisting of a repeating unit shown by the formula derived from bisphenol A and epichlorohydrin, (C) a curing agent (e.g., dicyandiamide, etc.) exhibiting activity at high temperature, stable at room temperature, and (D) a blowing agent (e.g., azodicarbonamide, etc.) in such a way that the amount of the component B is 30W60wt% based on the total amounts of the components A, B, and C, the amount of the component C is 0.5W20wt% based on 100pts.wt. of the components A and B, or 0.3W1.5 opoxy equivalent, and the amount of the component D is an amount to give an expansion magnification of about 3W10 times, to hive the desired composition, and, if necessary, the composition is bonded to a reinforcing material and molded in an integrated way.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP443281A JPS57117542A (en) | 1981-01-13 | 1981-01-13 | Molded article of expandable resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP443281A JPS57117542A (en) | 1981-01-13 | 1981-01-13 | Molded article of expandable resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57117542A true JPS57117542A (en) | 1982-07-22 |
Family
ID=11584077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP443281A Pending JPS57117542A (en) | 1981-01-13 | 1981-01-13 | Molded article of expandable resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57117542A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6387470B1 (en) * | 1998-11-05 | 2002-05-14 | Sika Corporation | Sound deadening and structural reinforcement compositions and methods of using the same |
US8127506B2 (en) | 2006-07-25 | 2012-03-06 | Zephyros, Inc. | Structural reinforcements |
JP2012057157A (en) * | 2010-09-03 | 2012-03-22 | Sika Technology Ag | Heat curable epoxy resin composition using water as foaming agent |
US8475694B2 (en) | 2005-10-25 | 2013-07-02 | Zephyros, Inc. | Shaped expandable material |
US9096039B2 (en) | 2010-03-04 | 2015-08-04 | Zephyros, Inc. | Structural composite laminates |
US9427902B2 (en) | 2009-09-15 | 2016-08-30 | Zephyros, Inc. | Cavity filling |
US9688050B2 (en) | 2004-06-18 | 2017-06-27 | Zephyros, Inc. | Panel structure |
US10457840B2 (en) | 2010-09-30 | 2019-10-29 | Zephyros, Inc. | Foamed adhesive |
US10577522B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Thermosetting adhesive films including a fibrous carrier |
US11028220B2 (en) | 2014-10-10 | 2021-06-08 | Zephyros, Inc. | Relating to structural adhesives |
US11248145B2 (en) | 2008-04-09 | 2022-02-15 | Zephyros, Inc. | Structural adhesives |
-
1981
- 1981-01-13 JP JP443281A patent/JPS57117542A/en active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6387470B1 (en) * | 1998-11-05 | 2002-05-14 | Sika Corporation | Sound deadening and structural reinforcement compositions and methods of using the same |
US10647083B2 (en) | 2004-06-18 | 2020-05-12 | Zephyros, Inc. | Panel structure |
US9688050B2 (en) | 2004-06-18 | 2017-06-27 | Zephyros, Inc. | Panel structure |
US8771564B2 (en) | 2005-10-25 | 2014-07-08 | Zephyros, Inc. | Shaped expandable material |
US8475694B2 (en) | 2005-10-25 | 2013-07-02 | Zephyros, Inc. | Shaped expandable material |
US10589795B2 (en) | 2006-07-25 | 2020-03-17 | Zephyros, Inc. | Structural reinforcements |
US8127506B2 (en) | 2006-07-25 | 2012-03-06 | Zephyros, Inc. | Structural reinforcements |
US8656669B2 (en) | 2006-07-25 | 2014-02-25 | Zephyros, Inc. | Structural reinforcements |
US9415811B2 (en) | 2006-07-25 | 2016-08-16 | Zephyros, Inc. | Structural reinforcements |
US8449020B2 (en) | 2006-07-25 | 2013-05-28 | Zephyros, Inc. | Structural reinforcements |
US11248145B2 (en) | 2008-04-09 | 2022-02-15 | Zephyros, Inc. | Structural adhesives |
US11667813B2 (en) | 2008-04-09 | 2023-06-06 | Zephyros, Inc. | Structural adhesives |
US9427902B2 (en) | 2009-09-15 | 2016-08-30 | Zephyros, Inc. | Cavity filling |
US9096039B2 (en) | 2010-03-04 | 2015-08-04 | Zephyros, Inc. | Structural composite laminates |
JP2012057157A (en) * | 2010-09-03 | 2012-03-22 | Sika Technology Ag | Heat curable epoxy resin composition using water as foaming agent |
US10457840B2 (en) | 2010-09-30 | 2019-10-29 | Zephyros, Inc. | Foamed adhesive |
US11873428B2 (en) | 2013-07-26 | 2024-01-16 | Zephyros, Inc. | Thermosetting adhesive films |
US10577522B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Thermosetting adhesive films including a fibrous carrier |
US10577523B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Relating to thermosetting adhesive films |
US11028220B2 (en) | 2014-10-10 | 2021-06-08 | Zephyros, Inc. | Relating to structural adhesives |
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