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JPS5710621A - Catalyst for polymerizing epoxy compound - Google Patents

Catalyst for polymerizing epoxy compound

Info

Publication number
JPS5710621A
JPS5710621A JP8457180A JP8457180A JPS5710621A JP S5710621 A JPS5710621 A JP S5710621A JP 8457180 A JP8457180 A JP 8457180A JP 8457180 A JP8457180 A JP 8457180A JP S5710621 A JPS5710621 A JP S5710621A
Authority
JP
Japan
Prior art keywords
compound
catalyst
epoxy compound
polymerizing
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8457180A
Other languages
Japanese (ja)
Other versions
JPS5757489B2 (en
Inventor
Shuji Hayase
Shinichi Sanada
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8457180A priority Critical patent/JPS5710621A/en
Publication of JPS5710621A publication Critical patent/JPS5710621A/en
Publication of JPS5757489B2 publication Critical patent/JPS5757489B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: The titled catalyst having improved stability, compatibility with a resin composition, and high activity even at low temperature, capable of providing a polymer having improved electric properties by low-temperature curing, comprising a Si compound directly linked to a hydroxyl group and a multiple bond group and an organic Al compound.
CONSTITUTION: A catalyst for polymerizing an epoxy compound is prepared by feeding (A) an organosilicon compound (e.g., triphenylsilanol, etc.) having at least one silicon atom directly linked to at least one hydroxyl group and at least one group having a mltiple bond and (B) an organic type aluminum compound[e.g., tris (acetylacetonato) aluminum, etc.] to a polymerizing pipe replaced by N2 gas. An epoxy compound (e.g., cyclohexene oxide, etc.) is added to the catalyst and blended fully. The pipe is hermetically sealed and polymerization reaction is carried out, to give a polymer.
COPYRIGHT: (C)1982,JPO&Japio
JP8457180A 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound Granted JPS5710621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8457180A JPS5710621A (en) 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8457180A JPS5710621A (en) 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound

Publications (2)

Publication Number Publication Date
JPS5710621A true JPS5710621A (en) 1982-01-20
JPS5757489B2 JPS5757489B2 (en) 1982-12-04

Family

ID=13834349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8457180A Granted JPS5710621A (en) 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound

Country Status (1)

Country Link
JP (1) JPS5710621A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184242A (en) * 1981-05-08 1982-11-12 Matsushita Electric Works Ltd Molding material for sealing electronic part
JPS59180474A (en) * 1983-03-29 1984-10-13 エドワ−ド・マルコム・ジエフリ− Annunciator
JPS60121350U (en) * 1984-01-26 1985-08-16 井坪建設株式会社 Ultrasonic compact type caller
WO2019240044A1 (en) * 2018-06-13 2019-12-19 デクセリアルズ株式会社 Cationically curable composition and cured product production method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477504A (en) * 1977-12-02 1979-06-21 Matsushita Electric Ind Co Ltd Wireless hearing aid device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477504A (en) * 1977-12-02 1979-06-21 Matsushita Electric Ind Co Ltd Wireless hearing aid device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184242A (en) * 1981-05-08 1982-11-12 Matsushita Electric Works Ltd Molding material for sealing electronic part
JPH0234181B2 (en) * 1981-05-08 1990-08-01 Matsushita Denko Kk
JPS59180474A (en) * 1983-03-29 1984-10-13 エドワ−ド・マルコム・ジエフリ− Annunciator
JPS60121350U (en) * 1984-01-26 1985-08-16 井坪建設株式会社 Ultrasonic compact type caller
WO2019240044A1 (en) * 2018-06-13 2019-12-19 デクセリアルズ株式会社 Cationically curable composition and cured product production method
JP2019214675A (en) * 2018-06-13 2019-12-19 デクセリアルズ株式会社 Cation curable composition, and manufacturing method of cured article
KR20210016419A (en) * 2018-06-13 2021-02-15 데쿠세리아루즈 가부시키가이샤 Cation curable composition, and method for producing cured product
US11773208B2 (en) 2018-06-13 2023-10-03 Dexerials Corporation Cationically curable composition and cured product production method

Also Published As

Publication number Publication date
JPS5757489B2 (en) 1982-12-04

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