JPH0234181B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to a molding material for sealing electronic components, and its purpose is to prevent a decrease in surface resistivity during humidification, eliminate surface leakage current when voltage is applied, and improve the moisture resistance of electronic components. The purpose is to improve. In recent years, various electronic components have been encapsulated with plastic in order to reduce costs and improve productivity. These electronic components include, for example, transistors. Casting, compression molding, injection molding, transfer molding, etc. are used as sealing methods with these plastics, and injection and transfer molding methods, which are superior in mass production and workability, are often used to improve productivity. has been done. Generally, these electronic components are small and are molded in a large number of molds, such as 50 to 200 molds. For this reason, thermosetting resin molding materials such as silicone resin molding materials, epoxy resin molding materials, and unsaturated polyester resin molding materials are used as sealing materials to satisfy multi-cavity molding. The material has the drawbacks of low mechanical strength and weak adhesion to metals, unsaturated polyester resin molding materials have poor abrasion resistance and moisture resistance, and epoxy resin molding materials have poor material preservation and moisture resistance. There were flaws. The present invention solves the above-mentioned drawbacks, and by adding a specific organosilicon compound to an epoxy resin molding material with improved material storage stability, the moisture resistance can be significantly improved. . The amount of the specific organosilicon compound used in the present invention is not particularly limited, but is preferably 0.01
~3% by weight (hereinafter simply referred to as %) is desirable. The present invention will be explained in detail below. The epoxy resins used in the present invention include bisphenol A type epoxy resins, novolac type epoxy resins, resol type epoxy resins, halogenated epoxy resins, glycidyl ester type epoxy resins,
Polymer-type epoxy resins, etc., and curing agents include amine-type curing agents, aliphatic polyamines, polyamide resins, aromatic diamines, acid anhydride curing agents, Lewis acid complex compounds, aromatic polyamines, polycarboxylic acids,
Polycarboxylic acid hydrazide, boron trifluoride monoethylamine, dicyandiamide, imidazole,
Phenol resin, melamine resin, acrylic resin,
Urea resin, isocyanate, etc., and fillers include glass fiber, metal whiskers, carbon fiber, Kevlar fiber, polyester fiber, polyamide fiber, pulp, asbestos, calcium silicate, barite, mica, clay, sericite, alumina,
Additives include molybdenum sulfide, calcium carbonate, silicic acid, basic magnesium carbonate, magnesium carbonate, calcium hydroxide, aluminum hydroxide, antimony trioxide, talc, titanium oxide, etc.
Mold release agents such as stearic acid, zinc stearate, calcium stearate, wax, and coloring agents such as carbon black and iron oxide are used.
Further, an organic silicon compound represented by formula 1 is added to the above-mentioned epoxy resin molding material. Although the amount of the organosilicon compound is not particularly limited, it is preferably 0.01 to 3%. That is, if the amount of the organic silicon compound is less than 0.01%, the effect of improving moisture resistance tends to decrease, and if it exceeds 3%, the adhesion to metal tends to decrease. (In Formula 1, R represents a hydrogen group, a methyl group, or a phenyl group, but it is preferable that a part of R is further modified with a hydroxyl group, an amino group, or an epoxy group.
That is, this is because the effect of improving moisture resistance tends to be greater. ) As mentioned above, the present invention is characterized in that a specific organic silicon compound is added to an epoxy resin molding material with good material preservation, which is composed of an epoxy resin, a curing agent, a filler, and an additive. Not only is it suitable for molding multiple electronic parts by transfer molding or injection molding, but it can also be applied to cast molding and compression molding. Indicates a methyl group or phenyl group in the side chain R, and a part of these R is replaced with a hydrogen group or hydroxyl group, or modified with an amino group or an epoxy group,
Specifically, in hydrogen group-modified silicones, silanol-modified silicones, amino-modified silicones, epoxy-modified silicones, etc., hydrogen groups, or reactive groups such as hydroxyl groups, amino groups, and epoxy groups react with the epoxy groups of epoxy resins. This made it possible to improve moisture resistance. Next, the present invention will be specifically explained using Examples and Comparative Examples. Examples 1 to 5 Molding materials for encapsulating electronic components were obtained by blending, mixing, and kneading materials according to the formulation table in Table 1.

【table】

[Table] The molding materials obtained in Examples 1 and 2 and Examples 4 and 5 as described above were molded using a transfer molding machine at a mold temperature of 160°C, a molding pressure of 50 Kg/cm ² , and a curing time of 2 minutes. A molded product was molded under the conditions of Example 3.
The molding material obtained is cast and molded at 160℃.
The molded product was obtained by curing for 30 minutes. Comparative Example A molded article was obtained from Example 1 with the organosilicon compound removed and treated in the same manner as in Example 1. The results of the surface leakage current test and surface water repellency test of the molded products of Examples 1 to 5 and Comparative Examples are as shown in Table 2. The surface leakage current of
It was also confirmed that the molding material for encapsulating electronic components according to the present invention has good surface water repellency.

【table】

Claims (1)

[Claims] 1. Electronic component encapsulation characterized by adding an organic silicon compound represented by formula [1] to an epoxy resin molding material consisting of an epoxy resin, a curing agent, a filler, and an additive. molding material. (In formula [1], R represents a methyl group or a phenyl group) 2. For encapsulating an electronic component according to claim 1, wherein the amount of the organic silicon compound added is 0.01 to 3% by weight. Molding material. 3. Claim No. 3, characterized in that the terminal R or side chain R of the organosilicon compound represented by formula [1] is partially modified with a hydroxyl group, an amino group, or an epoxy group. The molding material for encapsulating electronic components according to item 1 or 2.