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JPS5687695A - Copper foil for printed circuit and its manufacture - Google Patents

Copper foil for printed circuit and its manufacture

Info

Publication number
JPS5687695A
JPS5687695A JP16411279A JP16411279A JPS5687695A JP S5687695 A JPS5687695 A JP S5687695A JP 16411279 A JP16411279 A JP 16411279A JP 16411279 A JP16411279 A JP 16411279A JP S5687695 A JPS5687695 A JP S5687695A
Authority
JP
Japan
Prior art keywords
copper foil
zinc
printed circuit
manufacture
zinc oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16411279A
Other languages
Japanese (ja)
Other versions
JPS587077B2 (en
Inventor
Eiji Hino
Masanori Hayashi
Takashi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP16411279A priority Critical patent/JPS587077B2/en
Publication of JPS5687695A publication Critical patent/JPS5687695A/en
Publication of JPS587077B2 publication Critical patent/JPS587077B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To manufacture copper foil for printed circuit having simultaneously various desired properties including rust preventive property at a low cost, by forming mixed coating of zinc or zinc oxide etc. by electroplating at least on one surface of the copper foil with plating soln. contg. zinc salt etc.
CONSTITUTION: Electroplating is performed by using plating soln. contg. zinc salt or zinc oxide and chromate at least on one surface of copper foil to form a mixed coating composed of zinc or zinc oxide and chromium oxide. Hereby copper foil for printed circuit excellent in rust preventive power, resistance to thermochromism, and peeling strength is manufactured simply and at a low cost by a continuous process.
COPYRIGHT: (C)1981,JPO&Japio
JP16411279A 1979-12-19 1979-12-19 Copper foil for printed circuits and its manufacturing method Expired JPS587077B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16411279A JPS587077B2 (en) 1979-12-19 1979-12-19 Copper foil for printed circuits and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16411279A JPS587077B2 (en) 1979-12-19 1979-12-19 Copper foil for printed circuits and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS5687695A true JPS5687695A (en) 1981-07-16
JPS587077B2 JPS587077B2 (en) 1983-02-08

Family

ID=15786974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16411279A Expired JPS587077B2 (en) 1979-12-19 1979-12-19 Copper foil for printed circuits and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS587077B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6484690A (en) * 1987-09-26 1989-03-29 Matsushita Electric Works Ltd Printed wiring board and the production thereof
EP0458916A1 (en) * 1989-10-13 1991-12-04 Olin Corp Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil.
EP0541997A2 (en) * 1991-11-15 1993-05-19 Nikko Gould Foil Co., Ltd. Surface treatment method of a copper foil for printed circuits
US5449951A (en) * 1992-01-17 1995-09-12 Olin Corporation Lead frames with improved adhesion to a polymer
US6168703B1 (en) 1997-09-04 2001-01-02 Ga-Tek Inc. Copper foil and laminate containing a hydrogen inhibitor
KR101327565B1 (en) * 2009-06-05 2013-11-12 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for semiconductor package substrtate and subsrate for semiconductor package

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7749611B2 (en) * 2002-12-05 2010-07-06 Gbc Metals, L.L.C. Peel strength enhancement of copper laminates
JP4683646B2 (en) * 2006-03-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 Copper or copper alloy foil for printed circuit boards
JP5672764B2 (en) * 2010-05-13 2015-02-18 大日本印刷株式会社 Wiring circuit laminate, suspension substrate using the same, and manufacturing method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6484690A (en) * 1987-09-26 1989-03-29 Matsushita Electric Works Ltd Printed wiring board and the production thereof
EP0458916A1 (en) * 1989-10-13 1991-12-04 Olin Corp Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil.
EP0458916A4 (en) * 1989-10-13 1994-02-09 Olin Corporation
EP0541997A2 (en) * 1991-11-15 1993-05-19 Nikko Gould Foil Co., Ltd. Surface treatment method of a copper foil for printed circuits
EP0541997A3 (en) * 1991-11-15 1994-11-02 Nikko Gould Foil Kk Surface treatment method of a copper foil for printed circuits
US5449951A (en) * 1992-01-17 1995-09-12 Olin Corporation Lead frames with improved adhesion to a polymer
US6168703B1 (en) 1997-09-04 2001-01-02 Ga-Tek Inc. Copper foil and laminate containing a hydrogen inhibitor
KR101327565B1 (en) * 2009-06-05 2013-11-12 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for semiconductor package substrtate and subsrate for semiconductor package

Also Published As

Publication number Publication date
JPS587077B2 (en) 1983-02-08

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