JPS5683964A - Input protective device - Google Patents
Input protective deviceInfo
- Publication number
- JPS5683964A JPS5683964A JP16196179A JP16196179A JPS5683964A JP S5683964 A JPS5683964 A JP S5683964A JP 16196179 A JP16196179 A JP 16196179A JP 16196179 A JP16196179 A JP 16196179A JP S5683964 A JPS5683964 A JP S5683964A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resistance layer
- resistor
- film
- protective device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 title abstract 3
- 238000009792 diffusion process Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- -1 phosphorous ions Chemical class 0.000 abstract 1
- 230000009993 protective function Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0288—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To make small an occupied area by holding satisfactorily the protective function at the same time by a method wherein when a diffused layer resistor which is the input protective device is connected to a transistor intended to be protected, the protective device is formed on the diffused layer comprising a high resistance layer and low resistance layer. CONSTITUTION:A gate of a protected transistor T2 is connected with a transistor T2 for cramping a surge voltage and the diffused layer resistor R for making the wave form of the surge voltage gentle. In this construction, the resistor R is composed of the diffused layer comprising the high resistance layer and low resistance layer. Namely, an oxidized film 2 is cover-attached to a P type Si substrate and a window is opened into which phosphorous ions are injected and then, a press-in diffusion is applied thereto to first form an N type high resistance layer 3. In the next place, after a window is perforated again into the oxidized film which has been grown at this time, corresponded to the central part of the layer 3, and an N type low resistance layer 4 which is projected from the inside of the layer 3 into the substrate 1 is formed by the diffusion, an opening is formed in the film 2 and a metal electrode 5 is cover-attached to the layer 3 while being extended over the film 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16196179A JPS5683964A (en) | 1979-12-13 | 1979-12-13 | Input protective device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16196179A JPS5683964A (en) | 1979-12-13 | 1979-12-13 | Input protective device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5683964A true JPS5683964A (en) | 1981-07-08 |
JPS648469B2 JPS648469B2 (en) | 1989-02-14 |
Family
ID=15745352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16196179A Granted JPS5683964A (en) | 1979-12-13 | 1979-12-13 | Input protective device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5683964A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0058557A1 (en) * | 1981-02-17 | 1982-08-25 | Fujitsu Limited | Protection element for a semiconductor device |
EP0102647A2 (en) * | 1982-09-07 | 1984-03-14 | Kabushiki Kaisha Toshiba | Input protection device for C-MOS device |
JPS59218764A (en) * | 1983-05-27 | 1984-12-10 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS6271275A (en) * | 1985-09-25 | 1987-04-01 | Toshiba Corp | Semiconductor integrated circuit |
US4830976A (en) * | 1984-10-01 | 1989-05-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Integrated circuit resistor |
JPH02119244A (en) * | 1988-10-28 | 1990-05-07 | Nec Corp | Manufacture of semiconductor integrated circuit |
EP0448119A2 (en) * | 1990-03-22 | 1991-09-25 | Kabushiki Kaisha Toshiba | Input protection resistor used in input protection circuit |
US5521413A (en) * | 1993-11-25 | 1996-05-28 | Nec Corporation | Semiconductor device having a solid metal wiring with a contact portion for improved protection |
-
1979
- 1979-12-13 JP JP16196179A patent/JPS5683964A/en active Granted
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4602267A (en) * | 1981-02-17 | 1986-07-22 | Fujitsu Limited | Protection element for semiconductor device |
EP0058557A1 (en) * | 1981-02-17 | 1982-08-25 | Fujitsu Limited | Protection element for a semiconductor device |
US4872045A (en) * | 1982-09-07 | 1989-10-03 | Tokyo Shibaura Denki Kabushiki Kaisha | Input protection device for C-MOS device |
EP0102647A2 (en) * | 1982-09-07 | 1984-03-14 | Kabushiki Kaisha Toshiba | Input protection device for C-MOS device |
JPS59218764A (en) * | 1983-05-27 | 1984-12-10 | Hitachi Ltd | Semiconductor integrated circuit device |
JPH0526344B2 (en) * | 1983-05-27 | 1993-04-15 | Hitachi Ltd | |
US4830976A (en) * | 1984-10-01 | 1989-05-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Integrated circuit resistor |
JPS6271275A (en) * | 1985-09-25 | 1987-04-01 | Toshiba Corp | Semiconductor integrated circuit |
US4893159A (en) * | 1985-09-25 | 1990-01-09 | Kabushiki Kaisha Toshiba | Protected MOS transistor circuit |
JPH0518469B2 (en) * | 1985-09-25 | 1993-03-12 | Tokyo Shibaura Electric Co | |
JPH02119244A (en) * | 1988-10-28 | 1990-05-07 | Nec Corp | Manufacture of semiconductor integrated circuit |
EP0448119A2 (en) * | 1990-03-22 | 1991-09-25 | Kabushiki Kaisha Toshiba | Input protection resistor used in input protection circuit |
US5181092A (en) * | 1990-03-22 | 1993-01-19 | Kabushiki Kaisha Toshiba | Input protection resistor used in input protection circuit |
US5521413A (en) * | 1993-11-25 | 1996-05-28 | Nec Corporation | Semiconductor device having a solid metal wiring with a contact portion for improved protection |
Also Published As
Publication number | Publication date |
---|---|
JPS648469B2 (en) | 1989-02-14 |
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