JPS5676556A - Bonding gold wire for semiconductor element - Google Patents
Bonding gold wire for semiconductor elementInfo
- Publication number
- JPS5676556A JPS5676556A JP15399579A JP15399579A JPS5676556A JP S5676556 A JPS5676556 A JP S5676556A JP 15399579 A JP15399579 A JP 15399579A JP 15399579 A JP15399579 A JP 15399579A JP S5676556 A JPS5676556 A JP S5676556A
- Authority
- JP
- Japan
- Prior art keywords
- element group
- gold wire
- semiconductor element
- bonding gold
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45644—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01022—Titanium [Ti]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01031—Gallium [Ga]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01083—Bismuth [Bi]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15399579A JPS5676556A (en) | 1979-11-28 | 1979-11-28 | Bonding gold wire for semiconductor element |
US06/160,302 US4330329A (en) | 1979-11-28 | 1980-06-17 | Gold bonding wire for semiconductor elements and the semiconductor element |
DE3023623A DE3023623C2 (de) | 1979-11-28 | 1980-06-24 | Gold-Verbindungsdraht für Halbleiterelemente und dessen Verwendung für Verbindungsstellen einer Silicium-Chip-Elektrode in Halbleiterelementen |
GB8021205A GB2063913B (en) | 1979-11-28 | 1980-06-27 | Gold wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15399579A JPS5676556A (en) | 1979-11-28 | 1979-11-28 | Bonding gold wire for semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5676556A true JPS5676556A (en) | 1981-06-24 |
JPS6322062B2 JPS6322062B2 (ja) | 1988-05-10 |
Family
ID=15574607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15399579A Granted JPS5676556A (en) | 1979-11-28 | 1979-11-28 | Bonding gold wire for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5676556A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989011161A1 (en) * | 1988-05-02 | 1989-11-16 | Nippon Steel Corporation | Bonding wire for semiconductor elements |
US5008997A (en) * | 1988-09-16 | 1991-04-23 | National Semiconductor | Gold/tin eutectic bonding for tape automated bonding process |
JPH06293281A (ja) * | 1993-04-06 | 1994-10-21 | Ohtsu Tire & Rubber Co Ltd :The | クローラ形走行装置 |
US5491034A (en) * | 1988-05-02 | 1996-02-13 | Nippon Steel Corporation | Bonding wire for semiconductor element |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
JPS53112060A (en) * | 1977-03-11 | 1978-09-30 | Tanaka Electronics Ind | Gold wire for bonding semiconductor |
-
1979
- 1979-11-28 JP JP15399579A patent/JPS5676556A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
JPS53112060A (en) * | 1977-03-11 | 1978-09-30 | Tanaka Electronics Ind | Gold wire for bonding semiconductor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989011161A1 (en) * | 1988-05-02 | 1989-11-16 | Nippon Steel Corporation | Bonding wire for semiconductor elements |
JPH02119148A (ja) * | 1988-05-02 | 1990-05-07 | Nippon Steel Corp | 半導体素子用ボンディングワイヤ |
US5491034A (en) * | 1988-05-02 | 1996-02-13 | Nippon Steel Corporation | Bonding wire for semiconductor element |
US5008997A (en) * | 1988-09-16 | 1991-04-23 | National Semiconductor | Gold/tin eutectic bonding for tape automated bonding process |
JPH06293281A (ja) * | 1993-04-06 | 1994-10-21 | Ohtsu Tire & Rubber Co Ltd :The | クローラ形走行装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6322062B2 (ja) | 1988-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES8705927A1 (es) | Un procedimiento de formacion de un material de almacenamiento reversible de hidrogeno. | |
ES441949A1 (es) | Procedimiento de fabricacion de dispositivos electromagneticos. | |
JPS572851A (en) | Copper alloy for lead material of semiconductor device | |
EP0110418A3 (en) | Ductile brazing alloys containing reactive metals | |
JPS5655535A (en) | Metal bond-diamond sintered body | |
JPS5676556A (en) | Bonding gold wire for semiconductor element | |
JPS57187195A (en) | Silver solder material | |
JPS5797891A (en) | Cu-ag alloy brazing material | |
JPS5251867A (en) | Bonding wire for semiconductor device | |
JPS5621354A (en) | Bonding wire for semiconductor element | |
JPS6487734A (en) | Material for gold extra fine wire | |
FR2298609A1 (fr) | Alliage pour la metallisation et le brasage des materiaux abrasifs | |
JPS5695492A (en) | Copper-group brazing alloy | |
ES8501276A1 (es) | Procedimiento para soldar directamente productos semiacabados a base de materiales de contacto sobre soportes de contactos electricos. | |
GB799005A (en) | A method of uniting materials by means of hard solders | |
JPS5516731A (en) | Watch dial plate | |
JPS56169341A (en) | Bonding wire for semiconductor element | |
JPS5619629A (en) | Bonding wire for semiconductor element | |
CA2068635A1 (en) | Solid bodies made of high-temperature superconducting ceramic material to which contact is made by metallic conductors, and processes for producing them | |
JPS54103764A (en) | Brazing material | |
JPS563653A (en) | Manufacture of seal bonding material | |
JPS56122140A (en) | Gold wire for bonding semiconductor element and semiconductor element | |
JPS5688328A (en) | Gold wire for bonding semiconductor element and semiconductor element | |
GB967038A (en) | Brazing alloy and devices produced therewith | |
JPS5768040A (en) | Electrode structure for semiconductor device |