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JPS563653A - Manufacture of seal bonding material - Google Patents

Manufacture of seal bonding material

Info

Publication number
JPS563653A
JPS563653A JP7866979A JP7866979A JPS563653A JP S563653 A JPS563653 A JP S563653A JP 7866979 A JP7866979 A JP 7866979A JP 7866979 A JP7866979 A JP 7866979A JP S563653 A JPS563653 A JP S563653A
Authority
JP
Japan
Prior art keywords
seal bonding
plating
bonding material
reducing atmosphere
specified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7866979A
Other languages
Japanese (ja)
Other versions
JPS5943973B2 (en
Inventor
Yoshio Shinoda
Tomoyuki Furuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP7866979A priority Critical patent/JPS5943973B2/en
Publication of JPS563653A publication Critical patent/JPS563653A/en
Publication of JPS5943973B2 publication Critical patent/JPS5943973B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Heat Treatment Of Steel (AREA)
  • Heat Treatment Of Sheet Steel (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: To cheaply obtain a seal bonding material making striking as conventional pretreatment for Ag plating unnecessary by cold working an Fe-Ni-Co type seal bonding alloy of a specified composition followed by heat treatment in a reducing atmosphere at a specified temp. for a specified time.
CONSTITUTION: An Fe-Ni-Co type seal bonding alloy consisting of Ni 26W32wt% Ni, 15W19wt% Co and the balance Fe is cold worked and heat treated in a reducing atmosphere at 480W650°C for 25min or more to obtain a seal bonding material making striking as conventional preteratment for Ag plating unnecessary and extremely improving the adhesion of Ag plating in a process of manufacturing seal bonding parts. This material simplifies a plating process, considerably reduces the cost of manufacturing seal bonding parts, and is favorably uses as a seal bonding material for lead frames of a semiconductor integrated circuit device, etc. without producing a strain.
COPYRIGHT: (C)1981,JPO&Japio
JP7866979A 1979-06-23 1979-06-23 Manufacturing method of lead frame material for Ag plating Expired JPS5943973B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7866979A JPS5943973B2 (en) 1979-06-23 1979-06-23 Manufacturing method of lead frame material for Ag plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7866979A JPS5943973B2 (en) 1979-06-23 1979-06-23 Manufacturing method of lead frame material for Ag plating

Publications (2)

Publication Number Publication Date
JPS563653A true JPS563653A (en) 1981-01-14
JPS5943973B2 JPS5943973B2 (en) 1984-10-25

Family

ID=13668261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7866979A Expired JPS5943973B2 (en) 1979-06-23 1979-06-23 Manufacturing method of lead frame material for Ag plating

Country Status (1)

Country Link
JP (1) JPS5943973B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118620A (en) * 1981-01-16 1982-07-23 Sumitomo Electric Industries Connecting cap for electronic part
JPS6123800U (en) * 1984-07-18 1986-02-12 赤井電機株式会社 Pickup Cartridge
JPS61250155A (en) * 1985-04-25 1986-11-07 Nisshin Steel Co Ltd Manufacture of alloy for seal bonding with glass
JPS6232631A (en) * 1985-08-05 1987-02-12 Hitachi Ltd Integrated circuit package
JPH0268907A (en) * 1988-09-05 1990-03-08 Amorufuasu Denshi Device Kenkyusho:Kk Inductor
JPH02166707A (en) * 1988-12-21 1990-06-27 Amorufuasu Denshi Device Kenkyusho:Kk Thin film inductor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118620A (en) * 1981-01-16 1982-07-23 Sumitomo Electric Industries Connecting cap for electronic part
JPS6123800U (en) * 1984-07-18 1986-02-12 赤井電機株式会社 Pickup Cartridge
JPS61250155A (en) * 1985-04-25 1986-11-07 Nisshin Steel Co Ltd Manufacture of alloy for seal bonding with glass
JPS6232631A (en) * 1985-08-05 1987-02-12 Hitachi Ltd Integrated circuit package
JPH0431187B2 (en) * 1985-08-05 1992-05-25
JPH0268907A (en) * 1988-09-05 1990-03-08 Amorufuasu Denshi Device Kenkyusho:Kk Inductor
JPH02166707A (en) * 1988-12-21 1990-06-27 Amorufuasu Denshi Device Kenkyusho:Kk Thin film inductor

Also Published As

Publication number Publication date
JPS5943973B2 (en) 1984-10-25

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