JPS5661133A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5661133A JPS5661133A JP13803679A JP13803679A JPS5661133A JP S5661133 A JPS5661133 A JP S5661133A JP 13803679 A JP13803679 A JP 13803679A JP 13803679 A JP13803679 A JP 13803679A JP S5661133 A JPS5661133 A JP S5661133A
- Authority
- JP
- Japan
- Prior art keywords
- elements
- sheet
- wafer
- inspected
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000005452 bending Methods 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To selectively peel off elements from a sheet based on a detection output by adhering a semiconductor wafer forming many elements to an adhesive sheet wherein characteristics are inspected after splitting the semiconductor wafer into elements. CONSTITUTION:A wafer 10 forming many elements 11 is adhered to a conductive adhesive sheet 12. Lines 13, 14 are scribed thereon, then bending and stretching are given to the sheet 12 to form the clearance between elements 11. Characteristics of element 11 are inspected 15 and driving sources 16, 17 are actuated depending on the detected output. A bar 18 is pushed up and a collet 19 is moved down to adsorb the elements 11 for peeling off elements 11 from the sheet 12. Good elements are moved to a lead frame or the like for fixing. In this composition, automatic selection is possible and elements showing bad characteristics produced at the time of split will completely be removed in addition to inferior elements on the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13803679A JPS5661133A (en) | 1979-10-24 | 1979-10-24 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13803679A JPS5661133A (en) | 1979-10-24 | 1979-10-24 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5661133A true JPS5661133A (en) | 1981-05-26 |
Family
ID=15212529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13803679A Pending JPS5661133A (en) | 1979-10-24 | 1979-10-24 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5661133A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019067930A (en) * | 2017-09-29 | 2019-04-25 | 日亜化学工業株式会社 | Method of manufacturing light emitting element |
-
1979
- 1979-10-24 JP JP13803679A patent/JPS5661133A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019067930A (en) * | 2017-09-29 | 2019-04-25 | 日亜化学工業株式会社 | Method of manufacturing light emitting element |
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