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JPS52155494A - Process for w orking parallel plane of wafer - Google Patents

Process for w orking parallel plane of wafer

Info

Publication number
JPS52155494A
JPS52155494A JP7226676A JP7226676A JPS52155494A JP S52155494 A JPS52155494 A JP S52155494A JP 7226676 A JP7226676 A JP 7226676A JP 7226676 A JP7226676 A JP 7226676A JP S52155494 A JPS52155494 A JP S52155494A
Authority
JP
Japan
Prior art keywords
wafer
orking
parallel plane
plane
high preciseness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7226676A
Other languages
Japanese (ja)
Inventor
Junji Watanabe
Toshio Kasai
Masao Nishijima
Toshitada Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP7226676A priority Critical patent/JPS52155494A/en
Publication of JPS52155494A publication Critical patent/JPS52155494A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To shorten a bonding step and to work a wafer at a high preciseness, by forming an elastic film having a high preciseness of plane of surface on a surface of a hard substrate having a micro pore, and by sucking and maintaining the wafer temporarily through water and the like in the wafer.
JP7226676A 1976-06-21 1976-06-21 Process for w orking parallel plane of wafer Pending JPS52155494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7226676A JPS52155494A (en) 1976-06-21 1976-06-21 Process for w orking parallel plane of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7226676A JPS52155494A (en) 1976-06-21 1976-06-21 Process for w orking parallel plane of wafer

Publications (1)

Publication Number Publication Date
JPS52155494A true JPS52155494A (en) 1977-12-23

Family

ID=13484300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7226676A Pending JPS52155494A (en) 1976-06-21 1976-06-21 Process for w orking parallel plane of wafer

Country Status (1)

Country Link
JP (1) JPS52155494A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571026A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Method and apparatus for grinding wafer
DE3120477A1 (en) * 1980-05-23 1982-03-11 Disco Co., Ltd., Tokyo DEVICE FOR CLAMPING AND FIXING SEMICONDUCTOR PLATES
JPS6295863U (en) * 1985-12-04 1987-06-18
JPS62162455A (en) * 1986-06-06 1987-07-18 Hitachi Ltd Wafer grinding method
JPH03501191A (en) * 1988-06-02 1991-03-14 ヒユーズ・エアクラフト・カンパニー Optical flat surface on processed silicon wafer
WO2000025981A1 (en) * 1998-10-30 2000-05-11 Shin-Etsu Handotai Co., Ltd. Unpolished work holding board and production method thereof and work polishing method and device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4958750A (en) * 1972-10-04 1974-06-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4958750A (en) * 1972-10-04 1974-06-07

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571026A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Method and apparatus for grinding wafer
DE3120477A1 (en) * 1980-05-23 1982-03-11 Disco Co., Ltd., Tokyo DEVICE FOR CLAMPING AND FIXING SEMICONDUCTOR PLATES
US4625463A (en) * 1980-05-23 1986-12-02 Disco Co., Ltd. Wafer attracting and fixing device
JPS6295863U (en) * 1985-12-04 1987-06-18
JPH0230211Y2 (en) * 1985-12-04 1990-08-14
JPS62162455A (en) * 1986-06-06 1987-07-18 Hitachi Ltd Wafer grinding method
JPH03501191A (en) * 1988-06-02 1991-03-14 ヒユーズ・エアクラフト・カンパニー Optical flat surface on processed silicon wafer
WO2000025981A1 (en) * 1998-10-30 2000-05-11 Shin-Etsu Handotai Co., Ltd. Unpolished work holding board and production method thereof and work polishing method and device
US6386957B1 (en) 1998-10-30 2002-05-14 Shin-Etsu Handotai Co., Ltd. Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus
KR100668161B1 (en) * 1998-10-30 2007-01-11 신에쯔 한도타이 가부시키가이샤 Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus

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