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JPS5618708A - Optoelectronic inspector - Google Patents

Optoelectronic inspector

Info

Publication number
JPS5618708A
JPS5618708A JP10044680A JP10044680A JPS5618708A JP S5618708 A JPS5618708 A JP S5618708A JP 10044680 A JP10044680 A JP 10044680A JP 10044680 A JP10044680 A JP 10044680A JP S5618708 A JPS5618708 A JP S5618708A
Authority
JP
Japan
Prior art keywords
test
test specimen
error
image sensor
undertaken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10044680A
Other languages
English (en)
Inventor
Deemensu Giyuntaa
Hendoritsukusu Ururitsuhi
Shiyunaidaa Rihiaruto
Uiruto Kaaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5618708A publication Critical patent/JPS5618708A/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Toxicology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Image Input (AREA)
  • Closed-Circuit Television Systems (AREA)
JP10044680A 1979-07-23 1980-07-22 Optoelectronic inspector Pending JPS5618708A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792929846 DE2929846A1 (de) 1979-07-23 1979-07-23 Opto-elektronisches pruefsystem zur automatischen beschaffenheitspruefung von leiterplatten, deren zwischenprodukte und druckwerkzeuge

Publications (1)

Publication Number Publication Date
JPS5618708A true JPS5618708A (en) 1981-02-21

Family

ID=6076547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10044680A Pending JPS5618708A (en) 1979-07-23 1980-07-22 Optoelectronic inspector

Country Status (5)

Country Link
US (1) US4305097A (ja)
EP (1) EP0023574B1 (ja)
JP (1) JPS5618708A (ja)
AT (1) ATE9848T1 (ja)
DE (1) DE2929846A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57161642A (en) * 1981-03-31 1982-10-05 Olympus Optical Co Ltd Inspecting device for defect of surface
JPS5833154A (ja) * 1981-08-24 1983-02-26 Hitachi Ltd 検査装置
JPH02503775A (ja) * 1988-03-15 1990-11-08 オセ プリンテイング システムズ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 発光ダイオード行を作るための組立方法

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016673B2 (ja) * 1978-12-25 1985-04-26 川崎重工業株式会社 サ−ボ系における被検体認識装置
SE449531B (sv) * 1980-12-11 1987-05-04 Gerhard Westerberg Forfarande och anordning for kontroll av mikromasker
EP0054596B1 (fr) * 1980-12-18 1985-05-29 International Business Machines Corporation Procédé d'inspection et de tri automatique d'objets présentant des configurations avec des tolérances dimensionnelles et des critères de rejet variables selon l'emplacement, équipement et circuits de mise en oeuvre
FR2500925A1 (fr) * 1981-03-02 1982-09-03 Atelier Outillage Orleanais Sa Procede pour controler des percages pratiques dans une piece, notamment une carte a circuits imprimes, et appareil pour la mise en oeuvre de ce procede
DE3204086A1 (de) * 1982-02-06 1983-08-11 Ibm Deutschland Gmbh, 7000 Stuttgart Vorrichtung zur automatischen optischen beschaffenheitspruefung
US4513438A (en) * 1982-04-15 1985-04-23 Coulter Electronics, Inc. Automated microscopy system and method for locating and re-locating objects in an image
DE3267548D1 (en) * 1982-05-28 1986-01-02 Ibm Deutschland Process and device for an automatic optical inspection
JPS5958586A (ja) * 1982-09-28 1984-04-04 Toshiba Mach Co Ltd マスクの検査方法および装置
EP0108439A3 (en) * 1982-11-02 1986-04-02 Administratie- en Automatiseringscentrum Vulcaan B.V. Weighing device
JPS59111589A (ja) * 1982-12-17 1984-06-27 ロ−レルバンクマシン株式会社 紙葉類判別装置
US4589140A (en) * 1983-03-21 1986-05-13 Beltronics, Inc. Method of and apparatus for real-time high-speed inspection of objects for identifying or recognizing known and unknown portions thereof, including defects and the like
US4692690A (en) * 1983-12-26 1987-09-08 Hitachi, Ltd. Pattern detecting apparatus
DE3347645C1 (de) * 1983-12-30 1985-10-10 Dr.-Ing. Ludwig Pietzsch Gmbh & Co, 7505 Ettlingen Verfahren und Einrichtung zum opto-elektronischen Pruefen eines Flaechenmusters an einem Objekt
DE3427981A1 (de) * 1984-07-28 1986-02-06 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur fehlererkennung an definierten strukturen
CA1273224A (en) * 1985-03-14 1990-08-28 Timothy R. Pryor Panel surface flaw inspection
DE4003983C1 (en) * 1990-02-09 1991-08-29 Abos Automation, Bildverarbeitung, Optische Systeme Gmbh, 8057 Eching, De Automated monitoring of space=shape data for mfg. semiconductors - compares image signals for defined illumination angle range with master signals, to determine defects
DE4027902C2 (de) * 1990-09-03 1994-07-14 Siemens Ag Verfahren zur visuellen Prüfung bestückter Flachbaugruppen und Anordnung zur Durchführung des Verfahrens
IT1272853B (it) * 1994-11-30 1997-06-30 Circuit Line Spa Metodo e apparecchiatura per il carico e lo scarico automatico di circuiti stampati su macchine per l'esecuzione del test elettrico
DE19525081B4 (de) * 1995-07-10 2006-06-29 Display Products Group, Inc., Hayward Verfahren und Vorrichtung zum Testen der Funktion von Mikrostrukturelementen
DE19709939A1 (de) * 1997-03-11 1998-09-17 Atg Test Systems Gmbh Verfahren und Vorrichtung zum Prüfen von Leiterplatten
US6321338B1 (en) * 1998-11-09 2001-11-20 Sri International Network surveillance
TWI323503B (en) * 2005-12-12 2010-04-11 Optopac Co Ltd Apparatus, unit and method for testing image sensor packages
JP5534715B2 (ja) * 2009-05-27 2014-07-02 株式会社ジャパンディスプレイ 電子回路パターンの欠陥修正方法およびその装置
CN102142086A (zh) * 2010-02-03 2011-08-03 鸿富锦精密工业(深圳)有限公司 电路板侦测系统及其图像获取装置
US8902765B1 (en) 2010-02-25 2014-12-02 Integrated Device Technology, Inc. Method and apparatus for congestion and fault management with time-to-live
CN104035009B (zh) * 2014-06-14 2016-04-13 国网四川省电力公司双流县供电分公司 一种方便操作人员调整位置的绝缘子故障侦测装置
CN107543828B (zh) * 2017-08-25 2020-09-11 广东工业大学 一种工件表面缺陷检测方法及系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065212A (en) * 1975-06-30 1977-12-27 International Business Machines Corporation Inspection tool
DE2643809B2 (de) * 1976-09-29 1980-10-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Einjustieren eines Körpers
DE2700252C2 (de) * 1977-01-05 1985-03-14 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Prüfen definierter Strukturen
GB1564181A (en) * 1977-02-11 1980-04-02 Paabo M Device for examination of distances in a picture
US4208675A (en) * 1978-03-20 1980-06-17 Agence Nationale De Valorization De La Recherche (Anvar) Method and apparatus for positioning an object
CH643959A5 (de) * 1978-04-14 1984-06-29 Siemens Ag Verfahren und vorrichtung zur automatischen lageerkennung von halbleiterchips.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57161642A (en) * 1981-03-31 1982-10-05 Olympus Optical Co Ltd Inspecting device for defect of surface
JPS5833154A (ja) * 1981-08-24 1983-02-26 Hitachi Ltd 検査装置
JPH0325738B2 (ja) * 1981-08-24 1991-04-08 Hitachi Seisakusho Kk
JPH02503775A (ja) * 1988-03-15 1990-11-08 オセ プリンテイング システムズ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 発光ダイオード行を作るための組立方法

Also Published As

Publication number Publication date
US4305097A (en) 1981-12-08
EP0023574A1 (de) 1981-02-11
EP0023574B1 (de) 1984-10-10
DE2929846A1 (de) 1981-03-12
ATE9848T1 (de) 1984-10-15

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