JPS56119776A - Method and apparatus for removing copper from copper chloride etching solution and regenerating said solution by electrolysis - Google Patents
Method and apparatus for removing copper from copper chloride etching solution and regenerating said solution by electrolysisInfo
- Publication number
- JPS56119776A JPS56119776A JP1749081A JP1749081A JPS56119776A JP S56119776 A JPS56119776 A JP S56119776A JP 1749081 A JP1749081 A JP 1749081A JP 1749081 A JP1749081 A JP 1749081A JP S56119776 A JPS56119776 A JP S56119776A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- copper
- metallic copper
- current density
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
PURPOSE:To easily separate and recover metallic copper from the surface of a cathode, when a waste copper chloride etching soln. is regenerated by an electrolytic method and metallic copper is deposited on the cathode, by adjusting the area and current density of the cathode to a specified range. CONSTITUTION:The etching power of a CuCl2 etching soln. used in a process of etching copper of a printed substrate or the like is reduced owing to an increase in the CuCl content as the soln. is used. So, the soln. is electrolyzed to deposit metallic copper on a cathode as well as chlorinate CuCl to CuCl2. At this time, the current density of the cathode is adjuted to 20-150A/cm<2>, and the area of the cathode is reduced to a half or less of that of an anode. By controlling the increase of the anode current density to a half or less of that of the cathode current density, polarization is inhibited to prevent the CuCl2 regeneration efficiency from lowering, and metallic copper is deposited on the cathode in the form of fine grains to easily separate and recover metallic copper from the cathode surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1749081A JPS56119776A (en) | 1981-02-10 | 1981-02-10 | Method and apparatus for removing copper from copper chloride etching solution and regenerating said solution by electrolysis |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1749081A JPS56119776A (en) | 1981-02-10 | 1981-02-10 | Method and apparatus for removing copper from copper chloride etching solution and regenerating said solution by electrolysis |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56119776A true JPS56119776A (en) | 1981-09-19 |
JPS5729560B2 JPS5729560B2 (en) | 1982-06-23 |
Family
ID=11945439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1749081A Granted JPS56119776A (en) | 1981-02-10 | 1981-02-10 | Method and apparatus for removing copper from copper chloride etching solution and regenerating said solution by electrolysis |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56119776A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007186769A (en) * | 2006-01-16 | 2007-07-26 | Nikko Kinzoku Kk | Method for producing electrodeposited copper sheet |
JP2014520956A (en) * | 2011-07-08 | 2014-08-25 | インスティテュート・オブ・ケミカル・テクノロジー | Effect of operating parameters on the performance of electrochemical cells in the copper-chlorine cycle |
JP2014522912A (en) * | 2011-07-08 | 2014-09-08 | インスティテュート・オブ・ケミカル・テクノロジー | Electrochemical cell used in hydrogen production using CU-Cl thermochemical cycle |
-
1981
- 1981-02-10 JP JP1749081A patent/JPS56119776A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007186769A (en) * | 2006-01-16 | 2007-07-26 | Nikko Kinzoku Kk | Method for producing electrodeposited copper sheet |
JP2014520956A (en) * | 2011-07-08 | 2014-08-25 | インスティテュート・オブ・ケミカル・テクノロジー | Effect of operating parameters on the performance of electrochemical cells in the copper-chlorine cycle |
JP2014522912A (en) * | 2011-07-08 | 2014-09-08 | インスティテュート・オブ・ケミカル・テクノロジー | Electrochemical cell used in hydrogen production using CU-Cl thermochemical cycle |
US9487876B2 (en) | 2011-07-08 | 2016-11-08 | Institute Of Chemical Technology | Effect of operating parameters on the performance of electrochemical cell in copper-chlorine cycle |
Also Published As
Publication number | Publication date |
---|---|
JPS5729560B2 (en) | 1982-06-23 |
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