JPS5568174A - Ultrasonic soldering method of ceramics element - Google Patents
Ultrasonic soldering method of ceramics elementInfo
- Publication number
- JPS5568174A JPS5568174A JP14078678A JP14078678A JPS5568174A JP S5568174 A JPS5568174 A JP S5568174A JP 14078678 A JP14078678 A JP 14078678A JP 14078678 A JP14078678 A JP 14078678A JP S5568174 A JPS5568174 A JP S5568174A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ceramics
- lead wires
- oil
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
Abstract
PURPOSE: To prevent solder deposition on ceramics surface by first dipping the ceramics element connected with lead wires in an oil bath then dipping the same in a solder bath provided with an ultrasonic wave vibrator.
CONSTITUTION: Lead wires 3 are mounted to a ceramics element such as a voltage non-linear resistor 1 provided with electrodes 2 or the like is dipped in an oil bath 4 using silicone oil or the like having heat resistance. Thence, the resistor 1 and lead wires whose surfaces are covered with oil films are dipped in a solder bath 5 and ultrasonic vibrations are transmitted to the melted solder by an ultrasonic wave vibrator 6. Because of these ultrasonic wave vibrations, the oil films detach from the metal surfaces and the solder deposits. On the other hand, the oil films do not peel off from the ceramics surfaces and therefore no solder deposits thereon. If this element is taken out from the solder bath, the solder solidifies and the electrodes 2 and lead wires 3 are connected. By this method, the connection of the ceramics and lead wires 3 is accomplished without using flux.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14078678A JPS5568174A (en) | 1978-11-15 | 1978-11-15 | Ultrasonic soldering method of ceramics element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14078678A JPS5568174A (en) | 1978-11-15 | 1978-11-15 | Ultrasonic soldering method of ceramics element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5568174A true JPS5568174A (en) | 1980-05-22 |
Family
ID=15276700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14078678A Pending JPS5568174A (en) | 1978-11-15 | 1978-11-15 | Ultrasonic soldering method of ceramics element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5568174A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759662A (en) * | 2019-01-16 | 2019-05-17 | 哈尔滨工业大学 | A kind of method of ultrasonic wave added porous ceramics soldering |
| CN110640292A (en) * | 2019-09-11 | 2020-01-03 | 东莞令特电子有限公司 | Method for manufacturing electrode by using ultrasonic welding process |
-
1978
- 1978-11-15 JP JP14078678A patent/JPS5568174A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759662A (en) * | 2019-01-16 | 2019-05-17 | 哈尔滨工业大学 | A kind of method of ultrasonic wave added porous ceramics soldering |
| CN109759662B (en) * | 2019-01-16 | 2020-07-07 | 哈尔滨工业大学 | Ultrasonic-assisted porous ceramic brazing method |
| CN110640292A (en) * | 2019-09-11 | 2020-01-03 | 东莞令特电子有限公司 | Method for manufacturing electrode by using ultrasonic welding process |
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