JPS5536927A - Manufacturing of semiconductor device - Google Patents
Manufacturing of semiconductor deviceInfo
- Publication number
- JPS5536927A JPS5536927A JP10844578A JP10844578A JPS5536927A JP S5536927 A JPS5536927 A JP S5536927A JP 10844578 A JP10844578 A JP 10844578A JP 10844578 A JP10844578 A JP 10844578A JP S5536927 A JPS5536927 A JP S5536927A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electrode
- layer
- wiring
- silicon dioxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To make a pattern available in high density from facilitating formation of a contact window by a metamorphic layer which is obtainable, through high-frequency spatter etching, on the surface of an insulating film formed after applying a lower layer electrode and a wiring on semiconductor substrate.
CONSTITUTION: An electrode contact window 2a is formed, through patterning, in a heat-oxidized silicon dioxide film 2 on a semiconductor substrate 1, a silicon dioxide film 3 is then grown according to chemical vapor phase growth process, and the electrode contact window 2a is exposed from patterning the film 3. Further an Al film 5 is formed for which a photoresist film 4 is left as it is, then the film 4 is removed to form electrode and wiring 5 of the first layer, and a silicon dioxide film 7 is further formed. Next, the film 7 is subjected to high-frequency spatter etching to expose electrode and wiring 5e of the first layer and also to form a metamorphic layer on the surface. A silicon dioxide film 8 and a photoresist film 9 are formed furthermore, an etching window 9 is formed from patterning the film 9, and then electrode and wiring 10e of the second layer are formed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10844578A JPS6056295B2 (en) | 1978-09-04 | 1978-09-04 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10844578A JPS6056295B2 (en) | 1978-09-04 | 1978-09-04 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5536927A true JPS5536927A (en) | 1980-03-14 |
JPS6056295B2 JPS6056295B2 (en) | 1985-12-09 |
Family
ID=14484952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10844578A Expired JPS6056295B2 (en) | 1978-09-04 | 1978-09-04 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6056295B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59192916A (en) * | 1983-04-16 | 1984-11-01 | Hitachi Zosen Corp | Generating method of crank mark signal |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0381414U (en) * | 1989-12-11 | 1991-08-20 | ||
JPH0381413U (en) * | 1989-12-11 | 1991-08-20 |
-
1978
- 1978-09-04 JP JP10844578A patent/JPS6056295B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59192916A (en) * | 1983-04-16 | 1984-11-01 | Hitachi Zosen Corp | Generating method of crank mark signal |
Also Published As
Publication number | Publication date |
---|---|
JPS6056295B2 (en) | 1985-12-09 |
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