JPS5518053A - Packing of method semiconductor wafer - Google Patents
Packing of method semiconductor waferInfo
- Publication number
- JPS5518053A JPS5518053A JP9106878A JP9106878A JPS5518053A JP S5518053 A JPS5518053 A JP S5518053A JP 9106878 A JP9106878 A JP 9106878A JP 9106878 A JP9106878 A JP 9106878A JP S5518053 A JPS5518053 A JP S5518053A
- Authority
- JP
- Japan
- Prior art keywords
- support
- cover
- wafer
- wafers
- treating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To enable transfer of a semiconductor wafer once into an automatic treating device by supporting the wafers to an internal support in which a number of supporting grooves are formed on the inside surfaces of a pair of facing plates and filling the support in an external airtight container in a sealed manner.
CONSTITUTION: Wafers 29 are inserted into an internal support 25 in which a number of supporting grooves of V shape in cross section are formed on the inside surfaces of a pair of facing plates 26. This support is then filled in a container body 20, and a retainer 32 is inserted between the support 25 and a cover 23 or between the support 25 and the container body 20. Then, the cover 23 is engaged with the groove 21 of the body 20 to thus mount the cover 23 over the body 20. The retainer 32 is pressed onto the inside surface of the cover 23 or on the bottom surface of the body 20 at this time to thereby fix the wafer 29. In order to transfer the wafer 29 thus packaged into an automatic wafer treating device, the cover 23 is removed from the body 20, and the entire wafers 29 in the support 25 is transferred once into the wafer jig. Thus, it may not be necessary to pull out the support 25 every time, and mount the support 25 at the treating device at it is.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9106878A JPS5518053A (en) | 1978-07-26 | 1978-07-26 | Packing of method semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9106878A JPS5518053A (en) | 1978-07-26 | 1978-07-26 | Packing of method semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5518053A true JPS5518053A (en) | 1980-02-07 |
Family
ID=14016176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9106878A Pending JPS5518053A (en) | 1978-07-26 | 1978-07-26 | Packing of method semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5518053A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169037U (en) * | 1983-04-27 | 1984-11-12 | 凸版印刷株式会社 | container |
| JPH08255826A (en) * | 1995-03-17 | 1996-10-01 | Shin Etsu Polymer Co Ltd | Semiconductor wafer housing cassette |
| EP1148536A2 (en) * | 2000-04-17 | 2001-10-24 | Shin-Etsu Polymer Co., Ltd. | Support device for a wafer shipping container |
-
1978
- 1978-07-26 JP JP9106878A patent/JPS5518053A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169037U (en) * | 1983-04-27 | 1984-11-12 | 凸版印刷株式会社 | container |
| JPS6334273Y2 (en) * | 1983-04-27 | 1988-09-12 | ||
| JPH08255826A (en) * | 1995-03-17 | 1996-10-01 | Shin Etsu Polymer Co Ltd | Semiconductor wafer housing cassette |
| EP1148536A2 (en) * | 2000-04-17 | 2001-10-24 | Shin-Etsu Polymer Co., Ltd. | Support device for a wafer shipping container |
| EP1148536A3 (en) * | 2000-04-17 | 2007-05-30 | Shin-Etsu Polymer Co., Ltd. | Support device for a wafer shipping container |
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