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JPS5442976A - Lead dipping method for semiconductor device - Google Patents

Lead dipping method for semiconductor device

Info

Publication number
JPS5442976A
JPS5442976A JP9026678A JP9026678A JPS5442976A JP S5442976 A JPS5442976 A JP S5442976A JP 9026678 A JP9026678 A JP 9026678A JP 9026678 A JP9026678 A JP 9026678A JP S5442976 A JPS5442976 A JP S5442976A
Authority
JP
Japan
Prior art keywords
semiconductor device
dipping method
lead
lead dipping
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9026678A
Other languages
Japanese (ja)
Other versions
JPS5733708B2 (en
Inventor
Tomofusa Otaguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9026678A priority Critical patent/JPS5442976A/en
Publication of JPS5442976A publication Critical patent/JPS5442976A/en
Publication of JPS5733708B2 publication Critical patent/JPS5733708B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To simplify the lead dipping to the process solution by giving the process to the lead while holding the magnet which can absorb and hold a number of semiconductor devices and the magnet for spread prevention of the semiconductor device via the jig which can vary the distance between these magnets.
COPYRIGHT: (C)1979,JPO&Japio
JP9026678A 1978-07-24 1978-07-24 Lead dipping method for semiconductor device Granted JPS5442976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9026678A JPS5442976A (en) 1978-07-24 1978-07-24 Lead dipping method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9026678A JPS5442976A (en) 1978-07-24 1978-07-24 Lead dipping method for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5442976A true JPS5442976A (en) 1979-04-05
JPS5733708B2 JPS5733708B2 (en) 1982-07-19

Family

ID=13993693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9026678A Granted JPS5442976A (en) 1978-07-24 1978-07-24 Lead dipping method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5442976A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130164A (en) * 1989-04-28 1992-07-14 United Technologies Corporation Solder-coating method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0421849Y2 (en) * 1985-01-14 1992-05-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130164A (en) * 1989-04-28 1992-07-14 United Technologies Corporation Solder-coating method

Also Published As

Publication number Publication date
JPS5733708B2 (en) 1982-07-19

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