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JPS55140126A - Semiconductor pressure sensor - Google Patents

Semiconductor pressure sensor

Info

Publication number
JPS55140126A
JPS55140126A JP4795379A JP4795379A JPS55140126A JP S55140126 A JPS55140126 A JP S55140126A JP 4795379 A JP4795379 A JP 4795379A JP 4795379 A JP4795379 A JP 4795379A JP S55140126 A JPS55140126 A JP S55140126A
Authority
JP
Japan
Prior art keywords
chip
semiconductor chip
package
electrodes
pressure chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4795379A
Other languages
Japanese (ja)
Inventor
Yasuo Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4795379A priority Critical patent/JPS55140126A/en
Publication of JPS55140126A publication Critical patent/JPS55140126A/en
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Abstract

PURPOSE: To enable the use of small chips and make the assembling work easier by an arrangement wherein lead members for leading out the electrodes of the semiconductor chip are provided in a container in which the semoconductor is airtightly enclosed to form the reference pressure chamber.
CONSTITUTION: A semiconductor chip 13 is placed on the surface of a ceramic plate 11 having a through hole 12 at its center in such a manner that the chip will colse the through hole 12. Lead members 17 are provided at both sides of the chip and connected to electrodes of the semiconductor chip 13. Then, a cap 18 made of ceramic or others is adhered on the ceramic plate 11 with the aid of glass 19 at its upper side so as to airtightly enclose the chip therein. Thus formed inner space is vacuumed. In such a way, the semiconductor chip 13 is assembled into a package and the interior space of the package can be used as a reference pressure chamber. Therefore, design freedom for the chip is increased and chips with small dimension can be used, while providing the simple assembling work.
COPYRIGHT: (C)1980,JPO&Japio
JP4795379A 1979-04-20 1979-04-20 Semiconductor pressure sensor Pending JPS55140126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4795379A JPS55140126A (en) 1979-04-20 1979-04-20 Semiconductor pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4795379A JPS55140126A (en) 1979-04-20 1979-04-20 Semiconductor pressure sensor

Publications (1)

Publication Number Publication Date
JPS55140126A true JPS55140126A (en) 1980-11-01

Family

ID=12789710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4795379A Pending JPS55140126A (en) 1979-04-20 1979-04-20 Semiconductor pressure sensor

Country Status (1)

Country Link
JP (1) JPS55140126A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53125879A (en) * 1977-04-08 1978-11-02 Toyoda Chuo Kenkyusho Kk Pressure converter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53125879A (en) * 1977-04-08 1978-11-02 Toyoda Chuo Kenkyusho Kk Pressure converter

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