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JPS55138891A - Light semiconductor device - Google Patents

Light semiconductor device

Info

Publication number
JPS55138891A
JPS55138891A JP4741479A JP4741479A JPS55138891A JP S55138891 A JPS55138891 A JP S55138891A JP 4741479 A JP4741479 A JP 4741479A JP 4741479 A JP4741479 A JP 4741479A JP S55138891 A JPS55138891 A JP S55138891A
Authority
JP
Japan
Prior art keywords
optical fiber
semiconductor device
plug
light semiconductor
engaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4741479A
Other languages
Japanese (ja)
Inventor
Osamu Hasegawa
Takayuki Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4741479A priority Critical patent/JPS55138891A/en
Publication of JPS55138891A publication Critical patent/JPS55138891A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To easily attach or detach between an optical fiber and a light semiconductor device in a device for coupling the optical fiber to the light semiconductor device by engaging a plug disposed at the end of the optical fiber with the recess of the light semiconductor device. CONSTITUTION:A transmitting optical fiber 8 is inserted fixedly into the center of a wedge-type plug 13. A semiconductor chip 6 is disposed on a substrate 5 and buried in a transparent epoxy resin 15. A tapered connector 14 capable of engaging the plug 13 is formed at the resin 15. The semiconductor chip can be coupled with the optical fiber by such simple plug 13 and the connector 14, and can also be detached readily from the optical fiber.
JP4741479A 1979-04-18 1979-04-18 Light semiconductor device Pending JPS55138891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4741479A JPS55138891A (en) 1979-04-18 1979-04-18 Light semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4741479A JPS55138891A (en) 1979-04-18 1979-04-18 Light semiconductor device

Publications (1)

Publication Number Publication Date
JPS55138891A true JPS55138891A (en) 1980-10-30

Family

ID=12774476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4741479A Pending JPS55138891A (en) 1979-04-18 1979-04-18 Light semiconductor device

Country Status (1)

Country Link
JP (1) JPS55138891A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58204576A (en) * 1982-05-24 1983-11-29 Mitsubishi Rayon Co Ltd Semiconductor light emitting element and photodetector
JPS61109010A (en) * 1984-11-01 1986-05-27 Fuji Electric Co Ltd Optically driven semiconductor device
JPS61128214A (en) * 1984-11-27 1986-06-16 Rohm Co Ltd Optical semiconductor device
EP0413489A2 (en) * 1989-08-17 1991-02-20 AT&T Corp. Optical assembly comprising optical fiber coupling means
EP0635741A2 (en) * 1993-07-19 1995-01-25 Motorola, Inc. Optoelectronic interface and method of making
JP2007534988A (en) * 2004-04-28 2007-11-29 フィニサー コーポレイション Modular optical device package
US7407312B2 (en) * 2005-12-29 2008-08-05 Lg Display Co., Ltd. Luminescent diode, fabrication method thereof, and backlight assembly having the same
US7805084B2 (en) 2004-05-20 2010-09-28 Finisar Corporation Dual stage modular optical devices
JP2011124492A (en) * 2009-12-14 2011-06-23 Yamatake Corp Optical package and photoelectric sensor

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58204576A (en) * 1982-05-24 1983-11-29 Mitsubishi Rayon Co Ltd Semiconductor light emitting element and photodetector
JPS61109010A (en) * 1984-11-01 1986-05-27 Fuji Electric Co Ltd Optically driven semiconductor device
JPS61128214A (en) * 1984-11-27 1986-06-16 Rohm Co Ltd Optical semiconductor device
JPH0528804B2 (en) * 1984-11-27 1993-04-27 Rohm Kk
EP0413489A2 (en) * 1989-08-17 1991-02-20 AT&T Corp. Optical assembly comprising optical fiber coupling means
EP0635741A2 (en) * 1993-07-19 1995-01-25 Motorola, Inc. Optoelectronic interface and method of making
EP0635741A3 (en) * 1993-07-19 1996-01-10 Motorola Inc Optoelectronic interface and method of making.
JP2007534988A (en) * 2004-04-28 2007-11-29 フィニサー コーポレイション Modular optical device package
US7805084B2 (en) 2004-05-20 2010-09-28 Finisar Corporation Dual stage modular optical devices
US7407312B2 (en) * 2005-12-29 2008-08-05 Lg Display Co., Ltd. Luminescent diode, fabrication method thereof, and backlight assembly having the same
JP2011124492A (en) * 2009-12-14 2011-06-23 Yamatake Corp Optical package and photoelectric sensor

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