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JPS55119471A - Adhesive coating method - Google Patents

Adhesive coating method

Info

Publication number
JPS55119471A
JPS55119471A JP2809979A JP2809979A JPS55119471A JP S55119471 A JPS55119471 A JP S55119471A JP 2809979 A JP2809979 A JP 2809979A JP 2809979 A JP2809979 A JP 2809979A JP S55119471 A JPS55119471 A JP S55119471A
Authority
JP
Japan
Prior art keywords
protrusions
head
adhesive agent
wiring substrate
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2809979A
Other languages
Japanese (ja)
Inventor
Toshimichi Ishida
Takeo Takayanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2809979A priority Critical patent/JPS55119471A/en
Publication of JPS55119471A publication Critical patent/JPS55119471A/en
Pending legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE: To accurately coat adhesive agent in the specified position between the electronic part connecting lands by contacting the protrusions provided to the coating head end to the connecting lands and coating a slight amount of adhesive agent on a wiring substrate surface from the end of a discharge nozzle provided with a slight clearance from the wiring substrate surface.
CONSTITUTION: Connecting lands 6 are pressed by the protrusions 2 of a coating head 1 and the head 1 is so mounted as to produce a slight clearance between a discharge nozzle 3 and a wiring substrate 5. Next, in this state the adhesive agent 4 contained in the head 1 is discharged from the nozzle 3 end by being pressurized for a fixed time by compressed air and is thereby coated on the substrate 5 surface. Hence, the protrusions 2 press the lands 6 in the position not in contact with the adhesive agnet 4' to be coated, whereby the direct contact of the nozzle 3 with the substrate 5 surface may be prevented.
COPYRIGHT: (C)1980,JPO&Japio
JP2809979A 1979-03-09 1979-03-09 Adhesive coating method Pending JPS55119471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2809979A JPS55119471A (en) 1979-03-09 1979-03-09 Adhesive coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2809979A JPS55119471A (en) 1979-03-09 1979-03-09 Adhesive coating method

Publications (1)

Publication Number Publication Date
JPS55119471A true JPS55119471A (en) 1980-09-13

Family

ID=12239341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2809979A Pending JPS55119471A (en) 1979-03-09 1979-03-09 Adhesive coating method

Country Status (1)

Country Link
JP (1) JPS55119471A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6397259A (en) * 1986-10-14 1988-04-27 Shinkawa Ltd Paste discharger
JPS63177530A (en) * 1987-01-19 1988-07-21 Toshiba Corp Method and device for die bonding

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043566U (en) * 1973-08-16 1975-05-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043566U (en) * 1973-08-16 1975-05-01

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6397259A (en) * 1986-10-14 1988-04-27 Shinkawa Ltd Paste discharger
JPH0518632B2 (en) * 1986-10-14 1993-03-12 Shinkawa Kk
JPS63177530A (en) * 1987-01-19 1988-07-21 Toshiba Corp Method and device for die bonding
JPH0567057B2 (en) * 1987-01-19 1993-09-24 Tokyo Shibaura Electric Co

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