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EP0278457A3 - Method of coating adhesive for mounting parts onto a printed substrate and apparatus therefor - Google Patents

Method of coating adhesive for mounting parts onto a printed substrate and apparatus therefor Download PDF

Info

Publication number
EP0278457A3
EP0278457A3 EP88101806A EP88101806A EP0278457A3 EP 0278457 A3 EP0278457 A3 EP 0278457A3 EP 88101806 A EP88101806 A EP 88101806A EP 88101806 A EP88101806 A EP 88101806A EP 0278457 A3 EP0278457 A3 EP 0278457A3
Authority
EP
European Patent Office
Prior art keywords
coating
adhesive
printed substrate
nozzle
mounting parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP88101806A
Other languages
German (de)
French (fr)
Other versions
EP0278457A2 (en
Inventor
Toshiyuki Kurihara
Ko Nishio
Benso Aomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62027607A external-priority patent/JPS63194394A/en
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of EP0278457A2 publication Critical patent/EP0278457A2/en
Publication of EP0278457A3 publication Critical patent/EP0278457A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The present invention discloses a method and apparatus for coating adhesive for mounting parts onto a printed substrate (4, 5) in which an adhesive coating nozzle (6-9) is arranged in correspondence to the printed substrate placed on an X-Y table (1) controlled to be moved in an X-Y direction, and said coating nozzle (6-9) is operated to coat the adhesive within an adhesive storage tank (10-13) in position on each of the printed substrates, at which a waste coating is carried out for said coating nozzle before the latter performs the coating operation with respect to the printed substrate, whereby even if the adhesive trickles from the end of the nozzle to bring forth the liquid-drip state, the adhesive in the liquid-drip state is eliminated by the waste coating of the coating nozzle to prevent the adhesive in the amount more than as needed from being coated on the printed substrate, thus always maintaining a stable amount of coating thereby positively preventing occurence of irre­ gularities in quantity.
EP88101806A 1987-02-09 1988-02-08 Method of coating adhesive for mounting parts onto a printed substrate and apparatus therefor Withdrawn EP0278457A3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62027607A JPS63194394A (en) 1987-02-09 1987-02-09 Adhesive coater
JP27607/87 1987-02-09
JP215768/87 1987-08-28
JP21576887 1987-08-28

Publications (2)

Publication Number Publication Date
EP0278457A2 EP0278457A2 (en) 1988-08-17
EP0278457A3 true EP0278457A3 (en) 1989-06-14

Family

ID=26365552

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88101806A Withdrawn EP0278457A3 (en) 1987-02-09 1988-02-08 Method of coating adhesive for mounting parts onto a printed substrate and apparatus therefor

Country Status (3)

Country Link
US (1) US4919074A (en)
EP (1) EP0278457A3 (en)
KR (1) KR910002998B1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3842166C2 (en) * 1988-12-15 1996-07-25 Karsten Sturm Computer-controlled dispenser device with level control
US5232736A (en) * 1989-07-24 1993-08-03 Motorola, Inc. Method for controlling solder printer
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
JP3801674B2 (en) * 1995-12-15 2006-07-26 松下電器産業株式会社 Electronic component mounting method
JPH1068759A (en) * 1996-05-31 1998-03-10 Advantest Corp Attracted matter detecting device attracted mater detecting method using the same, dislocation detecting method using the device and cleaning method using the device
JP3587627B2 (en) * 1996-09-05 2004-11-10 松下電器産業株式会社 Adhesive application method
US6132809A (en) 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6066206A (en) 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
US6206964B1 (en) 1997-11-10 2001-03-27 Speedline Technologies, Inc. Multiple head dispensing system and method
US6214117B1 (en) 1998-03-02 2001-04-10 Speedline Technologies, Inc. Dispensing system and method
US6866881B2 (en) 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method
IES20000567A2 (en) * 1999-07-13 2001-02-21 Mv Res Ltd A circuit production method
DE60043776D1 (en) * 2000-08-16 2010-03-18 Ericsson Ab A method for dispensing an adhesive on a printed circuit board support member and printed circuit board thus prepared
US6688458B2 (en) 2001-10-09 2004-02-10 Speedline Technologies, Inc. System and method for controlling a conveyor system configuration to accommodate different size substrates
JP2006013427A (en) 2004-05-25 2006-01-12 Ricoh Co Ltd Minute adhesive nozzle and adhesive coating device
KR100836632B1 (en) * 2007-09-21 2008-06-10 천성관 Glue board with timer telling hardening time of glue for connecting insulating barrier of lng ship
JP7122451B1 (en) * 2021-07-08 2022-08-19 アーベーベー・シュバイツ・アーゲー Coating determination device for coating head and coating system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129776A (en) * 1982-11-15 1984-05-23 Usm Corp Adhesive dispenser
US4569305A (en) * 1981-10-09 1986-02-11 Ferco S.R.L. Apparatus to provide the application of glue on preselected zones of printed circuit boards
US4584964A (en) * 1983-12-12 1986-04-29 Engel Harold J Viscous material dispensing machine having programmed positioning

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3364055A (en) * 1964-09-01 1968-01-16 Waldorf Paper Prod Co Method for applying hot melt adhesive to a carton blank
US4420510A (en) * 1982-03-23 1983-12-13 Weyerhaeuser Company Method for applying a foamed adhesive under start-stop conditions
JPS60219793A (en) * 1984-04-17 1985-11-02 松下電器産業株式会社 Method of drawing thick film circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4569305A (en) * 1981-10-09 1986-02-11 Ferco S.R.L. Apparatus to provide the application of glue on preselected zones of printed circuit boards
GB2129776A (en) * 1982-11-15 1984-05-23 Usm Corp Adhesive dispenser
US4584964A (en) * 1983-12-12 1986-04-29 Engel Harold J Viscous material dispensing machine having programmed positioning

Also Published As

Publication number Publication date
EP0278457A2 (en) 1988-08-17
US4919074A (en) 1990-04-24
KR910002998B1 (en) 1991-05-11
KR880010644A (en) 1988-10-10

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Effective date: 19930205